KR970077275A - Silicon Particle Removal Method in Wafer Back Grinding Process - Google Patents

Silicon Particle Removal Method in Wafer Back Grinding Process Download PDF

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Publication number
KR970077275A
KR970077275A KR1019960017393A KR19960017393A KR970077275A KR 970077275 A KR970077275 A KR 970077275A KR 1019960017393 A KR1019960017393 A KR 1019960017393A KR 19960017393 A KR19960017393 A KR 19960017393A KR 970077275 A KR970077275 A KR 970077275A
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KR
South Korea
Prior art keywords
back grinding
grinding process
removal method
particle removal
silicon particle
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Withdrawn
Application number
KR1019960017393A
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Korean (ko)
Inventor
박현
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김주용
현대전자산업 주식회사
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Priority to KR1019960017393A priority Critical patent/KR970077275A/en
Publication of KR970077275A publication Critical patent/KR970077275A/en
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture

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  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

본 발명은 백 그라인딩시 발생되는 파티클의 제거를 위한 침전수로써 알콜을 사용하므로써, 경제적이면서 공정시간을 단축시킬 수 있고, 소자의 신뢰성도 향상시킬 수 있는 웨이퍼의 백 그라인딩 공정시의 실리콘 파티클 제거방법을 제공하는데 목적이 있다.The present invention relates to a method for removing silicon particles in a back grinding process of a wafer which can economically reduce the processing time and improve the reliability of the device by using alcohol as the settling water for removing particles generated during back grinding And the like.

상기 목적을 달성하기 위한 본 발명은 실리콘 웨이퍼의 백 그라인딩 공정에 있어서, 상기 공정에 발생되는 파티클을 제거하기 위한 침전기의 제거수로써 알콜이 사용되는 것을 특징으로 한다.In order to accomplish the above object, the present invention is characterized in that alcohol is used as a removing water for removing precipitates for removing particles generated in the back grinding process of a silicon wafer.

Description

웨이퍼 백그라이인딩 공정시의 실리콘 파티클 제거방법Silicon Particle Removal Method During Wafer Backgraining Process

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제2도는 일반적인 웨이퍼 백 그라인더의 외부구성도.FIG. 2 is an external view of a typical wafer back grinder; FIG.

Claims (1)

실리콘 웨이퍼의 백 그라인딩 공정에 있어서, 상기 공정에서 발생되는 파티클을 제거하기 위한 침전기의 제거수로써 알콜이 사용되는 것을 특징으로 하는 웨이퍼의 백 그라인딩 공정시의 실리콘 파티를 제거방법.A method for removing silicon particles in a backgrinding process of a wafer, characterized in that alcohol is used as the number of precipitates to remove particles generated in the process in the backgrinding process of the silicon wafer. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960017393A 1996-05-22 1996-05-22 Silicon Particle Removal Method in Wafer Back Grinding Process Withdrawn KR970077275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960017393A KR970077275A (en) 1996-05-22 1996-05-22 Silicon Particle Removal Method in Wafer Back Grinding Process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960017393A KR970077275A (en) 1996-05-22 1996-05-22 Silicon Particle Removal Method in Wafer Back Grinding Process

Publications (1)

Publication Number Publication Date
KR970077275A true KR970077275A (en) 1997-12-12

Family

ID=66219670

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960017393A Withdrawn KR970077275A (en) 1996-05-22 1996-05-22 Silicon Particle Removal Method in Wafer Back Grinding Process

Country Status (1)

Country Link
KR (1) KR970077275A (en)

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