KR970077275A - 웨이퍼 백그라인딩 공정시의 실리콘 파티클 제거방법 - Google Patents
웨이퍼 백그라인딩 공정시의 실리콘 파티클 제거방법 Download PDFInfo
- Publication number
- KR970077275A KR970077275A KR1019960017393A KR19960017393A KR970077275A KR 970077275 A KR970077275 A KR 970077275A KR 1019960017393 A KR1019960017393 A KR 1019960017393A KR 19960017393 A KR19960017393 A KR 19960017393A KR 970077275 A KR970077275 A KR 970077275A
- Authority
- KR
- South Korea
- Prior art keywords
- back grinding
- grinding process
- removal method
- particle removal
- silicon particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P70/00—Cleaning of wafers, substrates or parts of devices
- H10P70/20—Cleaning during device manufacture
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (1)
- 실리콘 웨이퍼의 백 그라인딩 공정에 있어서, 상기 공정에서 발생되는 파티클을 제거하기 위한 침전기의 제거수로써 알콜이 사용되는 것을 특징으로 하는 웨이퍼의 백 그라인딩 공정시의 실리콘 파티를 제거방법.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960017393A KR970077275A (ko) | 1996-05-22 | 1996-05-22 | 웨이퍼 백그라인딩 공정시의 실리콘 파티클 제거방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960017393A KR970077275A (ko) | 1996-05-22 | 1996-05-22 | 웨이퍼 백그라인딩 공정시의 실리콘 파티클 제거방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR970077275A true KR970077275A (ko) | 1997-12-12 |
Family
ID=66219670
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960017393A Withdrawn KR970077275A (ko) | 1996-05-22 | 1996-05-22 | 웨이퍼 백그라인딩 공정시의 실리콘 파티클 제거방법 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR970077275A (ko) |
-
1996
- 1996-05-22 KR KR1019960017393A patent/KR970077275A/ko not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
St.27 status event code: A-0-1-A10-A12-nap-PA0109 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PC1203 | Withdrawal of no request for examination |
St.27 status event code: N-1-6-B10-B12-nap-PC1203 |
|
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |