KR970077301A - 기판 폴리싱 장치 - Google Patents

기판 폴리싱 장치 Download PDF

Info

Publication number
KR970077301A
KR970077301A KR1019970016955A KR19970016955A KR970077301A KR 970077301 A KR970077301 A KR 970077301A KR 1019970016955 A KR1019970016955 A KR 1019970016955A KR 19970016955 A KR19970016955 A KR 19970016955A KR 970077301 A KR970077301 A KR 970077301A
Authority
KR
South Korea
Prior art keywords
grooves
polishing
substrate
parallel grooves
parallel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1019970016955A
Other languages
English (en)
Korean (ko)
Inventor
충난 쳉
로버트 디. 톨레스
Original Assignee
조셉 제이. 스위니
어플라이드 머티어리얼스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 조셉 제이. 스위니, 어플라이드 머티어리얼스, 인코포레이티드 filed Critical 조셉 제이. 스위니
Publication of KR970077301A publication Critical patent/KR970077301A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1019970016955A 1996-05-02 1997-05-02 기판 폴리싱 장치 Withdrawn KR970077301A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US64305496A 1996-05-02 1996-05-02
US8/643,054 1996-05-02

Publications (1)

Publication Number Publication Date
KR970077301A true KR970077301A (ko) 1997-12-12

Family

ID=24579176

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970016955A Withdrawn KR970077301A (ko) 1996-05-02 1997-05-02 기판 폴리싱 장치

Country Status (4)

Country Link
EP (1) EP0806267A1 (fr)
JP (1) JPH1071561A (fr)
KR (1) KR970077301A (fr)
TW (1) TW349896B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3056714B2 (ja) * 1997-10-06 2000-06-26 松下電子工業株式会社 半導体基板の研磨方法
US6287174B1 (en) 1999-02-05 2001-09-11 Rodel Holdings Inc. Polishing pad and method of use thereof
US6234875B1 (en) 1999-06-09 2001-05-22 3M Innovative Properties Company Method of modifying a surface
DE60232497D1 (de) * 2001-01-05 2009-07-16 Seiko Epson Corp Poliervorrichtung und -verfahren
US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US6632129B2 (en) 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
RU190145U1 (ru) * 2018-10-15 2019-06-21 Акционерное общество "Опытное Конструкторское Бюро Машиностроения имени И.И. Африкантова" (АО "ОКБМ Африкантов") Притир
CN117733662B (zh) * 2024-02-19 2024-04-16 南方科技大学 一种基于等离子体刻蚀和改性作用的金刚石抛光方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2639278B1 (fr) * 1988-11-22 1991-01-11 Lam Plan Sa Plateau de polissage
US5020283A (en) * 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
JP2985490B2 (ja) * 1992-02-28 1999-11-29 信越半導体株式会社 研磨機の除熱方法
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
EP0728055A1 (fr) * 1994-09-08 1996-08-28 Struers A/S Feuille de couverture de meulage/polissage se pla ant sur un disque tournant de meulage/polissage

Also Published As

Publication number Publication date
JPH1071561A (ja) 1998-03-17
TW349896B (en) 1999-01-11
EP0806267A1 (fr) 1997-11-12

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Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PC1203 Withdrawal of no request for examination

St.27 status event code: N-1-6-B10-B12-nap-PC1203

WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid
R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000