TW349896B - Apparatus and chemical mechanical polishing system for polishing a substrate - Google Patents

Apparatus and chemical mechanical polishing system for polishing a substrate

Info

Publication number
TW349896B
TW349896B TW086105712A TW86105712A TW349896B TW 349896 B TW349896 B TW 349896B TW 086105712 A TW086105712 A TW 086105712A TW 86105712 A TW86105712 A TW 86105712A TW 349896 B TW349896 B TW 349896B
Authority
TW
Taiwan
Prior art keywords
polishing
substrate
chemical mechanical
mechanical polishing
polishing surface
Prior art date
Application number
TW086105712A
Other languages
English (en)
Chinese (zh)
Inventor
Tsungnan Cheng
Robert D Tolles
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Application granted granted Critical
Publication of TW349896B publication Critical patent/TW349896B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW086105712A 1996-05-02 1997-04-30 Apparatus and chemical mechanical polishing system for polishing a substrate TW349896B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US64305496A 1996-05-02 1996-05-02

Publications (1)

Publication Number Publication Date
TW349896B true TW349896B (en) 1999-01-11

Family

ID=24579176

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086105712A TW349896B (en) 1996-05-02 1997-04-30 Apparatus and chemical mechanical polishing system for polishing a substrate

Country Status (4)

Country Link
EP (1) EP0806267A1 (fr)
JP (1) JPH1071561A (fr)
KR (1) KR970077301A (fr)
TW (1) TW349896B (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3056714B2 (ja) * 1997-10-06 2000-06-26 松下電子工業株式会社 半導体基板の研磨方法
US6287174B1 (en) 1999-02-05 2001-09-11 Rodel Holdings Inc. Polishing pad and method of use thereof
US6234875B1 (en) 1999-06-09 2001-05-22 3M Innovative Properties Company Method of modifying a surface
DE60232497D1 (de) * 2001-01-05 2009-07-16 Seiko Epson Corp Poliervorrichtung und -verfahren
US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US6632129B2 (en) 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
RU190145U1 (ru) * 2018-10-15 2019-06-21 Акционерное общество "Опытное Конструкторское Бюро Машиностроения имени И.И. Африкантова" (АО "ОКБМ Африкантов") Притир
CN117733662B (zh) * 2024-02-19 2024-04-16 南方科技大学 一种基于等离子体刻蚀和改性作用的金刚石抛光方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2639278B1 (fr) * 1988-11-22 1991-01-11 Lam Plan Sa Plateau de polissage
US5020283A (en) * 1990-01-22 1991-06-04 Micron Technology, Inc. Polishing pad with uniform abrasion
US5212910A (en) * 1991-07-09 1993-05-25 Intel Corporation Composite polishing pad for semiconductor process
JP2985490B2 (ja) * 1992-02-28 1999-11-29 信越半導体株式会社 研磨機の除熱方法
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
EP0728055A1 (fr) * 1994-09-08 1996-08-28 Struers A/S Feuille de couverture de meulage/polissage se pla ant sur un disque tournant de meulage/polissage

Also Published As

Publication number Publication date
KR970077301A (ko) 1997-12-12
JPH1071561A (ja) 1998-03-17
EP0806267A1 (fr) 1997-11-12

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees