KR970077474A - 수직 웨이퍼 보트 - Google Patents

수직 웨이퍼 보트 Download PDF

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Publication number
KR970077474A
KR970077474A KR1019970018828A KR19970018828A KR970077474A KR 970077474 A KR970077474 A KR 970077474A KR 1019970018828 A KR1019970018828 A KR 1019970018828A KR 19970018828 A KR19970018828 A KR 19970018828A KR 970077474 A KR970077474 A KR 970077474A
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KR
South Korea
Prior art keywords
wafer boat
support
vertical wafer
support groove
vertical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
KR1019970018828A
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English (en)
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KR100474157B1 (ko
Inventor
도시오 나까지마
히사오 야마모또
Original Assignee
세야 히로미찌
아사히가라스 가부시끼가이샤
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Publication of KR970077474A publication Critical patent/KR970077474A/ko
Application granted granted Critical
Publication of KR100474157B1 publication Critical patent/KR100474157B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H10P72/123—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterised by a material, a roughness, a coating or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S206/00—Special receptacle or package
    • Y10S206/832—Semiconductor wafer boat
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10—Apparatus

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

수직 웨이퍼 보트의 상부와 하부의 단부 플레이트들을 연결하는 봉들에 형성된, 각각의 반도체 웨어퍼 삽입 및 지지 홈의 바닥부와, 상기 지지 홈과 이에 인접하는 지지 홈간의지지 피스의 기부 사이의 모퉁이에 0.1-1㎜의 반경이 제공된다.

Description

수직 웨이퍼 보트
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 본 발명의 일 실시예에 따른 수직 웨이퍼 보트의 지지 홈들의 확대 단면도.

Claims (10)

  1. 상부 위치와 하부 위치에 배열된 한쌍의 단부 플레이트와, 상기 단부 플레이트들을 연결하는 복수의 봉과, 상기 봉에 소정의 간격으로 형성되어 반도체 웨이퍼를 수용 및 지지하는 지지 홈과, 및 인접하는 상기 지지 홈들 사이에 각각 형성되는 빗살-치형의 지지 피스를 포함하는 수직 웨이퍼 보트로서, 상기 단부 플레이트, 봉,지지 홈 및 지지 피스가 탄화규소를 주성분으로서 포함하는 재료로 제조되고, 상기 각 지지 홈의 바닥부와 이에 인접하는 상기지지 피스의 기부 사이에 모퉁이는 0.1-1㎜의 반경으로 모가 둥글게 되는 것을 특징으로 하는 수직 웨이퍼 보트.
  2. 제1항에 있어서, 상기 지지 피스가 a㎜의 두께를 갖고, 상기지지 홈이 b㎜의 깊이와 c㎜의 수직 공간을 가지며, 이들 간에는 (b/a)×c〉10㎜의 관계가 성립하는 것을 특징으로 하는 수직 웨이퍼 보트.
  3. 제1항에 있어서, 상기지지 홈이 b㎜의 깊이를 갖고, 봉 두께로부터 상기 지지 홈의 깊이를 뺄셈함으로써 얻어지는 길이가 d㎜이며, 이들 간에는 b〉d의 관계가 성립하는 것을 특징으로 하는 수직 웨이퍼 보트.
  4. 제1항에 있어서, 상기지지 홈이 10㎛ 이하의 표면조도, 또는 0.1㎜이하의 편평도를 갖는 것을 특징으로 하는 수직 웨이퍼 보트.
  5. 제1항에 있어서, 상기지지 피스가1/500-1/20의 원뿔각을 제공하는 테이퍼형 단면형상으로 형성된 것을 특징으로 하는 수직 웨이퍼 보트.
  6. 제4항에 있어서, 상기 지지 홈의 내벽의 표면조도가 30㎛ 이하인 것을 특징으로 하는 수직 웨이퍼 보트.
  7. 제1항에 있어서, 상기 지지 홈의 바닥부 및 인접하는 상기 지지 피스의 기부 사이의 모퉁이는 0.2-0.7㎜의 반경으로 모가 둥글게 되는 것을 특징으로 하는 수직 웨이퍼 보트.
  8. 제1항에 있어서, 상기 각 봉이 65-250㎟의 단면적을 갖는 것을 특징으로 하는 수직 웨이퍼 보트.
  9. 제1항에 있어서, 상기 봉과 단부 플레이트는 내부에 채워진 실리콘을 갖는 것을 특징으로 하는 수직 웨이퍼 보트.
  10. 제1항에 있어서, 상기 봉과 단부 플레이트는 탄화규소를 피막된 표면을 갖는 것을 특징으로 하는 수직 웨이퍼 보트.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019970018828A 1996-05-17 1997-05-16 수직웨이퍼보트 Expired - Fee Related KR100474157B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP14814596A JPH09306980A (ja) 1996-05-17 1996-05-17 縦型ウエハボート
JP96-148145 1996-05-17

Publications (2)

Publication Number Publication Date
KR970077474A true KR970077474A (ko) 1997-12-12
KR100474157B1 KR100474157B1 (ko) 2005-04-14

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970018828A Expired - Fee Related KR100474157B1 (ko) 1996-05-17 1997-05-16 수직웨이퍼보트

Country Status (6)

Country Link
US (1) US5858103A (ko)
EP (1) EP0807961B1 (ko)
JP (1) JPH09306980A (ko)
KR (1) KR100474157B1 (ko)
DE (1) DE69716811T2 (ko)
TW (1) TW392275B (ko)

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Also Published As

Publication number Publication date
EP0807961A1 (en) 1997-11-19
KR100474157B1 (ko) 2005-04-14
DE69716811D1 (de) 2002-12-12
JPH09306980A (ja) 1997-11-28
TW392275B (en) 2000-06-01
EP0807961B1 (en) 2002-11-06
US5858103A (en) 1999-01-12
DE69716811T2 (de) 2003-09-04

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