LT2000074A - Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas - Google Patents

Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas Download PDF

Info

Publication number: LT2000074A
Authority: LT; Lithuania
Prior art keywords: washed; water; solution; treated; solution containing
Prior art date: 2000-07-20

Application number

LT2000074A

Other languages

English (en)

Lithuanian (lt)

Inventor

Mykolas Baranauskas

Original Assignee

Mykolas Baranauskas

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-07-20

Filing date

2000-07-20

Publication date

2002-01-25

2000-07-20 Application filed by Mykolas Baranauskas filed Critical Mykolas Baranauskas

2000-07-20 Priority to LT2000074A priority Critical patent/LT2000074A/lt

2001-07-19 Priority to DE2001633795 priority patent/DE60133795T2/de

2001-07-19 Priority to EP20010306212 priority patent/EP1174530B1/de

2001-07-19 Priority to ES01306212T priority patent/ES2305035T3/es

2001-07-19 Priority to JP2001220307A priority patent/JP4789361B2/ja

2001-07-20 Priority to US09/910,448 priority patent/US6610365B2/en

2001-07-20 Priority to KR1020010043731A priority patent/KR100816667B1/ko

2001-07-20 Priority to TW90117772A priority patent/TW575667B/zh

2002-01-25 Publication of LT2000074A publication Critical patent/LT2000074A/lt

2003-03-31 Priority to US10/403,772 priority patent/US6887561B2/en

Links

238000000576 coating method Methods 0.000 title claims description 22
238000000034 method Methods 0.000 title claims description 21
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 32
238000005530 etching Methods 0.000 claims description 10
229910021645 metal ion Inorganic materials 0.000 claims description 6
238000005486 sulfidation Methods 0.000 claims description 3
229910052797 bismuth Inorganic materials 0.000 claims 1
JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims 1
239000000243 solution Substances 0.000 description 46
239000000047 product Substances 0.000 description 15
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
239000003792 electrolyte Substances 0.000 description 9
239000012153 distilled water Substances 0.000 description 8
QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 6
239000011248 coating agent Substances 0.000 description 6
VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 5
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 5
235000011114 ammonium hydroxide Nutrition 0.000 description 5
229910052759 nickel Inorganic materials 0.000 description 5
229910052979 sodium sulfide Inorganic materials 0.000 description 5
GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 5
235000011149 sulphuric acid Nutrition 0.000 description 5
NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
239000004793 Polystyrene Substances 0.000 description 4
229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 4
150000001412 amines Chemical class 0.000 description 4
239000000908 ammonium hydroxide Substances 0.000 description 4
239000003989 dielectric material Substances 0.000 description 4
235000011007 phosphoric acid Nutrition 0.000 description 4
229920002223 polystyrene Polymers 0.000 description 4
235000019394 potassium persulphate Nutrition 0.000 description 4
229910002567 K2S2O8 Inorganic materials 0.000 description 3
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
229910017052 cobalt Inorganic materials 0.000 description 3
239000010941 cobalt Substances 0.000 description 3
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
229910001451 bismuth ion Inorganic materials 0.000 description 2
KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
229910001429 cobalt ion Inorganic materials 0.000 description 2
XLJKHNWPARRRJB-UHFFFAOYSA-N cobalt(2+) Chemical compound [Co+2] XLJKHNWPARRRJB-UHFFFAOYSA-N 0.000 description 2
150000001875 compounds Chemical class 0.000 description 2
229910001385 heavy metal Inorganic materials 0.000 description 2
229910052976 metal sulfide Inorganic materials 0.000 description 2
229910017604 nitric acid Inorganic materials 0.000 description 2
239000004033 plastic Substances 0.000 description 2
229920003023 plastic Polymers 0.000 description 2
125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
QYIGOGBGVKONDY-UHFFFAOYSA-N 1-(2-bromo-5-chlorophenyl)-3-methylpyrazole Chemical compound N1=C(C)C=CN1C1=CC(Cl)=CC=C1Br QYIGOGBGVKONDY-UHFFFAOYSA-N 0.000 description 1
HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
239000004159 Potassium persulphate Substances 0.000 description 1
GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
AZFNGPAYDKGCRB-XCPIVNJJSA-M [(1s,2s)-2-amino-1,2-diphenylethyl]-(4-methylphenyl)sulfonylazanide;chlororuthenium(1+);1-methyl-4-propan-2-ylbenzene Chemical compound [Ru+]Cl.CC(C)C1=CC=C(C)C=C1.C1=CC(C)=CC=C1S(=O)(=O)[N-][C@@H](C=1C=CC=CC=1)[C@@H](N)C1=CC=CC=C1 AZFNGPAYDKGCRB-XCPIVNJJSA-M 0.000 description 1
239000002253 acid Substances 0.000 description 1
229910052783 alkali metal Inorganic materials 0.000 description 1
150000001340 alkali metals Chemical class 0.000 description 1
239000007864 aqueous solution Substances 0.000 description 1
JHXKRIRFYBPWGE-UHFFFAOYSA-K bismuth chloride Chemical compound Cl[Bi](Cl)Cl JHXKRIRFYBPWGE-UHFFFAOYSA-K 0.000 description 1
229920001870 copolymer plastic Polymers 0.000 description 1
150000001879 copper Chemical class 0.000 description 1
BWFPGXWASODCHM-UHFFFAOYSA-N copper monosulfide Chemical compound [Cu]=S BWFPGXWASODCHM-UHFFFAOYSA-N 0.000 description 1
QKSIFUGZHOUETI-UHFFFAOYSA-N copper;azane Chemical compound N.N.N.N.[Cu+2] QKSIFUGZHOUETI-UHFFFAOYSA-N 0.000 description 1
238000005202 decontamination Methods 0.000 description 1
230000003588 decontaminative effect Effects 0.000 description 1
238000000151 deposition Methods 0.000 description 1
230000008021 deposition Effects 0.000 description 1
230000029087 digestion Effects 0.000 description 1
230000005611 electricity Effects 0.000 description 1
238000009713 electroplating Methods 0.000 description 1
229910052740 iodine Inorganic materials 0.000 description 1
239000011630 iodine Substances 0.000 description 1
235000013675 iodine Nutrition 0.000 description 1
238000004519 manufacturing process Methods 0.000 description 1
238000001465 metallisation Methods 0.000 description 1
125000000896 monocarboxylic acid group Chemical group 0.000 description 1
QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
239000002985 plastic film Substances 0.000 description 1
238000007747 plating Methods 0.000 description 1
229920001021 polysulfide Polymers 0.000 description 1
239000004304 potassium nitrite Substances 0.000 description 1
235000010289 potassium nitrite Nutrition 0.000 description 1
USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
DPLVEEXVKBWGHE-UHFFFAOYSA-N potassium sulfide Chemical compound [S-2].[K+].[K+] DPLVEEXVKBWGHE-UHFFFAOYSA-N 0.000 description 1
239000002244 precipitate Substances 0.000 description 1
230000009993 protective function Effects 0.000 description 1
239000012266 salt solution Substances 0.000 description 1
239000013049 sediment Substances 0.000 description 1
238000004904 shortening Methods 0.000 description 1
229910052708 sodium Inorganic materials 0.000 description 1
239000011734 sodium Substances 0.000 description 1
229910000029 sodium carbonate Inorganic materials 0.000 description 1
235000017550 sodium carbonate Nutrition 0.000 description 1
239000000126 substance Substances 0.000 description 1
239000000725 suspension Substances 0.000 description 1
239000003643 water by type Substances 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S428/00—Stock material or miscellaneous articles
- Y10S428/922—Static electricity metal bleed-off metallic stock
- Y10S428/9335—Product by special process
- Y10S428/934—Electrical process
- Y10S428/935—Electroplating
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12556—Organic component
- Y10T428/12569—Synthetic resin
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12625—Free carbon containing component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12674—Ge- or Si-base component
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
- Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Chemical Kinetics & Catalysis (AREA)
Electrochemistry (AREA)
Materials Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Electroplating Methods And Accessories (AREA)
Chemically Coating (AREA)
Laminated Bodies (AREA)
Paints Or Removers (AREA)

LT2000074A 2000-07-20 2000-07-20 Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas LT2000074A (lt)

Priority Applications (9)

Application Number	Priority Date	Filing Date	Title
LT2000074A LT2000074A (lt)	2000-07-20	2000-07-20	Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas
DE2001633795 DE60133795T2 (de)	2000-07-20	2001-07-19	Verfahren zum Herstellen von leitenden Schichten auf dielektrischen Oberflächen
EP20010306212 EP1174530B1 (de)	2000-07-20	2001-07-19	Verfahren zur Herstellung von leitenden Schichten auf dielektrischen Oberflächen
ES01306212T ES2305035T3 (es)	2000-07-20	2001-07-19	Procedimiento de produccion de capas conductoras sobre superficies dielectricas.
JP2001220307A JP4789361B2 (ja)	2000-07-20	2001-07-19	誘電体表面上に導電層を製造する方法
US09/910,448 US6610365B2 (en)	2000-07-20	2001-07-20	Methods of producing conductor layers on dielectric surfaces
KR1020010043731A KR100816667B1 (ko)	2000-07-20	2001-07-20	유전체 표면에 전도체 층을 형성시키는 방법
TW90117772A TW575667B (en)	2000-07-20	2001-07-20	Methods of producing conductor layers on dielectric surfaces and articles of manufacture thereof
US10/403,772 US6887561B2 (en)	2000-07-20	2003-03-31	Methods and producing conductor layers on dielectric surfaces

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
LT2000074A LT2000074A (lt)	2000-07-20	2000-07-20	Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas

Publications (1)

Publication Number	Publication Date
LT2000074A true LT2000074A (lt)	2002-01-25

Family

ID=19721484

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
LT2000074A LT2000074A (lt)	2000-07-20	2000-07-20	Elektrai laidžių dangų ant dielektriko paviršiaus gavimo būdas

Country Status (8)

Country	Link
US (2)	US6610365B2 (de)
EP (1)	EP1174530B1 (de)
JP (1)	JP4789361B2 (de)
KR (1)	KR100816667B1 (de)
DE (1)	DE60133795T2 (de)
ES (1)	ES2305035T3 (de)
LT (1)	LT2000074A (de)
TW (1)	TW575667B (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE102004026489B3 (de) *	2004-05-27	2005-09-29	Enthone Inc., West Haven	Verfahren zur Metallisierung von Kunststoffoberflächen
JP2007239003A (ja) *	2006-03-07	2007-09-20	Univ Nagoya	Ａｕメッキ方法及びＡｕメッキによるＡｕ回路の製造方法
JP4786708B2 (ja)	2006-03-31	2011-10-05	荏原ユージライト株式会社	プラスチック用の表面改質液およびそれを利用したプラスチック表面の金属化方法
DE102014216974A1 (de)	2014-08-26	2016-03-03	Mahle International Gmbh	Thermoelektrisches Modul
CN106048564A (zh) *	2016-07-27	2016-10-26	华南理工大学	一种在abs塑料表面无钯活化的金属化方法
TWI762238B (zh) *	2021-03-12	2022-04-21	國立成功大學	一種無電鍍金屬/硫奈米複合材料之製作方法、使用該奈米複合材料之無電鍍金屬/硫陰極、及使用該陰極之電池

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US3620834A (en) *	1968-07-18	1971-11-16	Hooker Chemical Corp	Metal plating of substrates
CA1120420A (en) *	1976-10-26	1982-03-23	Daniel Luch	Process for providing a polymer-electroplate bond of improved strength and stability
SU980858A1 (ru)	1981-07-23	1982-12-15	Вильнюсский государственный университет им.В.Капсукаса	Способ получени электропроводных покрытий
GB8511905D0 (en) *	1985-05-10	1985-06-19	Akzo Nv	Metallizing polymeric materials
JPH0661891B2 (ja) *	1989-05-29	1994-08-17	大阪市	導電性ポリイミド成形物の製造法
US4919768A (en) *	1989-09-22	1990-04-24	Shipley Company Inc.	Electroplating process
SU1762425A1 (ru)	1991-01-22	1992-09-15	Институт Химии И Химической Технологии Литовской Ан	Способ получени электропровод щего покрыти сульфида меди на диэлектрической подложке
US5376248A (en) *	1991-10-15	1994-12-27	Enthone-Omi, Inc.	Direct metallization process
US5698087A (en) *	1992-03-11	1997-12-16	Mcgean-Rohco, Inc.	Plating bath and method for electroplating tin and/or lead
JPH06275758A (ja) *	1993-03-19	1994-09-30	Chichibu Fuji:Kk	半導体装置の製造方法
JP3274232B2 (ja) *	1993-06-01	2002-04-15	ディップソール株式会社	錫−ビスマス合金めっき浴及びそれを使用するめっき方法
US5484518A (en) *	1994-03-04	1996-01-16	Shipley Company Inc.	Electroplating process
JPH07258861A (ja) *	1994-03-22	1995-10-09	Murata Mfg Co Ltd	無電解ビスマスめっき浴
JP3475260B2 (ja) *	1994-12-07	2003-12-08	日本リーロナール株式会社	樹脂製品への機能性皮膜の形成方法
JPH1013022A (ja) *	1996-06-21	1998-01-16	Sumitomo Metal Mining Co Ltd	多層プリント配線板の製造方法
WO2000029646A1 (en) *	1998-11-13	2000-05-25	Enthone-Omi, Inc.	Process for metallizing a plastic surface
US6712948B1 (en) *	1998-11-13	2004-03-30	Enthone Inc.	Process for metallizing a plastic surface

2000
- 2000-07-20 LT LT2000074A patent/LT2000074A/lt unknown
2001
- 2001-07-19 DE DE2001633795 patent/DE60133795T2/de not_active Expired - Lifetime
- 2001-07-19 JP JP2001220307A patent/JP4789361B2/ja not_active Expired - Fee Related
- 2001-07-19 EP EP20010306212 patent/EP1174530B1/de not_active Expired - Lifetime
- 2001-07-19 ES ES01306212T patent/ES2305035T3/es not_active Expired - Lifetime
- 2001-07-20 KR KR1020010043731A patent/KR100816667B1/ko not_active Expired - Fee Related
- 2001-07-20 US US09/910,448 patent/US6610365B2/en not_active Expired - Lifetime
- 2001-07-20 TW TW90117772A patent/TW575667B/zh not_active IP Right Cessation
2003
- 2003-03-31 US US10/403,772 patent/US6887561B2/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
EP1174530A3 (de)	2004-02-04
TW575667B (en)	2004-02-11
KR100816667B1 (ko)	2008-03-27
KR20020009439A (ko)	2002-02-01
US6887561B2 (en)	2005-05-03
US6610365B2 (en)	2003-08-26
US20030183531A1 (en)	2003-10-02
DE60133795D1 (de)	2008-06-12
DE60133795T2 (de)	2009-06-25
ES2305035T3 (es)	2008-11-01
US20020139679A1 (en)	2002-10-03
EP1174530B1 (de)	2008-04-30
JP4789361B2 (ja)	2011-10-12
JP2002146589A (ja)	2002-05-22
EP1174530A2 (de)	2002-01-23

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