LT2019028A - Skaidrių medžiagų apdirbimo būdas ir įrenginys - Google Patents
Skaidrių medžiagų apdirbimo būdas ir įrenginysInfo
- Publication number
- LT2019028A LT2019028A LT2019028A LT2019028A LT2019028A LT 2019028 A LT2019028 A LT 2019028A LT 2019028 A LT2019028 A LT 2019028A LT 2019028 A LT2019028 A LT 2019028A LT 2019028 A LT2019028 A LT 2019028A
- Authority
- LT
- Lithuania
- Prior art keywords
- zones
- damages
- distribution
- affected
- processing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0093—Working by laser beam, e.g. welding, cutting or boring combined with mechanical machining or metal-working covered by other subclasses than B23K
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/046—Automatically focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure
- B23K26/122—Working by laser beam, e.g. welding, cutting or boring in a special environment or atmosphere, e.g. in an enclosure in a liquid, e.g. underwater
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
- C03B33/04—Cutting or splitting in curves, especially for making spectacle lenses
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic materials other than metals or composite materials
- B23K2103/54—Glass
Landscapes
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
Išradimas yra susijęs su skaidrių medžiagų apdirbimo būdais, naudojančiais ultratrumpuosius lazerio impulsus. Medžiagų, žymia dalimi skaidrių lazerio spinduliuotei, apdirbimo būdas apima necentrosimetrinio nedifraguojančio pluošto suformavimą optiniame elemente, kuriame yra bent dvi dvejopalūžių struktūrų sritys, kai kiekvienoje tų sričių Pancharantnam'o-Berry fazė kinta pagal tai sričiai būdingą dėsnį. Praėjusios elementą šviesos energijos, fazės bei poliarizacijos skirstinių forma kinta, priklausomai nuo krentančios į elementą šviesos parametrų. Pluošto energijos skirstinys sukuriamas artutinai tolygus šviesos plitimo kryptimi. Lazerio impulso energija parenkama taip, kad ruošinyje sufokusuoto pagrindinio skirstinio maksimumo poveikio srityje susiformuotų pailgos tuštuminių pažaidų sritys norima kryptimi, o gretimų impulsų šalutiniai maksimumai paveiktų ruošinį, sukurdami cheminio pobūdžio pokyčius tarp gretimų impulsų pažaidų. Iš sukurtų pažaidų sričių ir cheminio poveikio sričių suformuojama norimos formos pjūvio linija. Taip apdirbtas ruošinys patalpinamas agresyviame tirpale, kuriame paveiktos sritys tirpsta žymiai sparčiau, negu nepaveiktos, dėl ko ruošinio medžiagoje galima gauti pjūvius su pločio ir gylio santykiu, siekiančiu 1/50.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LT2019028A LT6791B (lt) | 2019-05-15 | 2019-05-15 | Skaidrių medžiagų apdirbimo būdas ir įrenginys |
| KR1020217041040A KR102890510B1 (ko) | 2019-05-15 | 2020-05-14 | 투명한 재료의 레이저 가공을 위한 방법 및 디바이스 |
| JP2021568330A JP7640090B2 (ja) | 2019-05-15 | 2020-05-14 | 透明材料のレーザ加工方法及び装置 |
| US17/610,861 US12420356B2 (en) | 2019-05-15 | 2020-05-14 | Method and device for laser processing of transparent materials |
| PCT/IB2020/054549 WO2020230064A1 (en) | 2019-05-15 | 2020-05-14 | Method and device for laser processing of transparent materials |
| CN202080036224.1A CN113825585B (zh) | 2019-05-15 | 2020-05-14 | 用于透明材料的激光加工的方法和装置 |
| EP20726244.5A EP3969219B1 (en) | 2019-05-15 | 2020-05-14 | Method and device for laser processing of transparent materials |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| LT2019028A LT6791B (lt) | 2019-05-15 | 2019-05-15 | Skaidrių medžiagų apdirbimo būdas ir įrenginys |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| LT2019028A true LT2019028A (lt) | 2020-11-25 |
| LT6791B LT6791B (lt) | 2020-12-28 |
Family
ID=68461809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LT2019028A LT6791B (lt) | 2019-05-15 | 2019-05-15 | Skaidrių medžiagų apdirbimo būdas ir įrenginys |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12420356B2 (lt) |
| EP (1) | EP3969219B1 (lt) |
| JP (1) | JP7640090B2 (lt) |
| KR (1) | KR102890510B1 (lt) |
| CN (1) | CN113825585B (lt) |
| LT (1) | LT6791B (lt) |
| WO (1) | WO2020230064A1 (lt) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012110971B4 (de) * | 2012-11-14 | 2025-03-20 | Schott Ag | Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks |
| DE102020132700A1 (de) * | 2020-12-08 | 2022-06-09 | Trumpf Laser- Und Systemtechnik Gmbh | Hochenergieglasschneiden |
| WO2022185096A1 (en) | 2021-03-03 | 2022-09-09 | Uab Altechna R&B | Laser beam transforming element |
| DE102021131811A1 (de) | 2021-12-02 | 2023-06-07 | Trumpf Laser- Und Systemtechnik Gmbh | Vorrichtung und Verfahren zum Bearbeiten eines Werkstücks |
| CN114406448B (zh) * | 2022-01-11 | 2023-01-24 | 北京理工大学 | 一种大尺寸光学元件裂纹损伤的飞秒激光修复方法 |
| CN115722808A (zh) * | 2022-11-15 | 2023-03-03 | 上海无线电设备研究所 | 印制板拼板的激光分板曲线绘制方法及其激光分板方法 |
| CN117607068B (zh) * | 2023-11-03 | 2024-07-23 | 宁波大学 | 一种光学材料激光损伤阈值准确测试方法 |
| CN119387863A (zh) * | 2024-12-18 | 2025-02-07 | 北京工业大学 | 一种用于透明材料低热损伤激光剥离与切割的装置与方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4930901A (en) * | 1988-12-23 | 1990-06-05 | Electro Scientific Industries, Inc. | Method of and apparatus for modulating a laser beam |
| CA2479986A1 (fr) * | 2004-09-14 | 2006-03-14 | Vincent F. Treanton | Fabrication de guides d`onde optique par ablation laser |
| US7438824B2 (en) * | 2005-03-25 | 2008-10-21 | National Research Council Of Canada | Fabrication of long range periodic nanostructures in transparent or semitransparent dielectrics |
| DE602009000115D1 (de) * | 2008-04-15 | 2010-09-30 | Jds Uniphase Corp | Auf einem Wellenlängenplättchen basierende Vorrichtung und Methode zur Reduzierung von Speckles in Laserbeleuchtungssystemen |
| CN102139484B (zh) * | 2010-01-29 | 2015-05-20 | 西进商事股份有限公司 | 激光划线方法以及装置 |
| DE102010029791A1 (de) * | 2010-06-08 | 2011-12-08 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Verfahren zur Lasermaterialbearbeitung eines Werkstücks |
| EP2756342B1 (en) * | 2011-09-14 | 2016-11-30 | IMRA America, Inc. | Controllable multi-wavelength fiber laser source |
| DE102012110971B4 (de) | 2012-11-14 | 2025-03-20 | Schott Ag | Verfahren zur Herstellung von linienförmig aufgereihten Schädigungsstellen in einem transparenten Werkstück sowie Verfahren und Vorrichtung zum Trennen eines Werkstücks |
| WO2014079478A1 (en) * | 2012-11-20 | 2014-05-30 | Light In Light Srl | High speed laser processing of transparent materials |
| JP6333282B2 (ja) * | 2012-11-29 | 2018-05-30 | コーニング インコーポレイテッド | レーザー損傷及びエッチングによってガラス物品を製造する方法 |
| JP2016534008A (ja) | 2013-08-07 | 2016-11-04 | トルンプフ レーザー− ウント ジュステームテヒニク ゲゼルシャフト ミット ベシュレンクテル ハフツングTRUMPF Laser− und Systemtechnik GmbH | 透明の、ガラス状の、ガラス質の、セラミックのかつ/又は結晶質の層を有する板状のワークピースを加工する方法、並びにこのようなワークピース用の分離装置、並びにこのようなワークピースから成る製品 |
| US9517929B2 (en) * | 2013-11-19 | 2016-12-13 | Rofin-Sinar Technologies Inc. | Method of fabricating electromechanical microchips with a burst ultrafast laser pulses |
| US10293436B2 (en) | 2013-12-17 | 2019-05-21 | Corning Incorporated | Method for rapid laser drilling of holes in glass and products made therefrom |
| LT6240B (lt) * | 2014-05-16 | 2016-01-25 | Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras | Skaidrių terpių lazerinis pjovimo būdas ir įrenginys |
| CN107073641B (zh) * | 2014-07-14 | 2020-11-10 | 康宁股份有限公司 | 接口块;用于使用这种接口块切割在波长范围内透明的衬底的系统和方法 |
| CN104076435B (zh) * | 2014-07-14 | 2016-07-13 | 西北工业大学 | 取样光纤布拉格光栅sfbg的飞秒激光制作装置及方法 |
| EP3169479B1 (en) * | 2014-07-14 | 2019-10-02 | Corning Incorporated | Method of and system for arresting incident crack propagation in a transparent material |
| EP3221727B1 (de) * | 2014-11-19 | 2021-03-17 | Trumpf Laser- und Systemtechnik GmbH | System zur asymmetrischen optischen strahlformung |
| JP6734202B2 (ja) | 2015-01-13 | 2020-08-05 | ロフィン−シナール テクノロジーズ エルエルシー | 脆性材料をスクライブして化学エッチングする方法およびシステム |
| US10717670B2 (en) | 2015-02-10 | 2020-07-21 | Nippon Sheet Glass Company, Limited | Glass for laser processing and method for producing perforated glass using same |
| LT6428B (lt) * | 2015-10-02 | 2017-07-25 | Uab "Altechna R&D" | Skaidrių medžiagų lazerinis apdirbimo būdas ir įrenginys |
| LT3468742T (lt) * | 2016-06-14 | 2022-12-12 | Evana Technologies, Uab | Daugiasegmentis fokusavimo lęšis ir lazerinio apdirbimo sistema plokštelių sudalinimui arba pjaustymui |
| JP2018024571A (ja) | 2016-08-05 | 2018-02-15 | 旭硝子株式会社 | 孔を有するガラス基板の製造方法 |
| EP3335826A1 (en) * | 2016-12-13 | 2018-06-20 | Universita' Degli Studi Dell'Insubria | Laser based hole formation and etching of transparent materials |
| CN107570876A (zh) * | 2017-10-16 | 2018-01-12 | 江南大学 | 一种激光诱导koh化学反应刻蚀和切割蓝宝石的加工方法 |
| WO2019079417A2 (en) * | 2017-10-20 | 2019-04-25 | Corning Incorporated | METHODS FOR LASER PROCESSING OF TRANSPARENT PARTS USING PULSED LASER BEAM FOCAL LINES AND CHEMICAL ETCHING SOLUTIONS |
| CN109551123B (zh) * | 2018-12-17 | 2021-08-24 | 华东师范大学 | 皮秒激光诱导石英玻璃内部裂纹实现微流控器件制备的方法 |
| CN113614045B (zh) * | 2019-02-08 | 2023-11-21 | 康宁股份有限公司 | 采用脉冲激光束聚焦线和气相蚀刻对透明工件进行激光加工的方法 |
-
2019
- 2019-05-15 LT LT2019028A patent/LT6791B/lt unknown
-
2020
- 2020-05-14 JP JP2021568330A patent/JP7640090B2/ja active Active
- 2020-05-14 KR KR1020217041040A patent/KR102890510B1/ko active Active
- 2020-05-14 EP EP20726244.5A patent/EP3969219B1/en active Active
- 2020-05-14 CN CN202080036224.1A patent/CN113825585B/zh active Active
- 2020-05-14 US US17/610,861 patent/US12420356B2/en active Active
- 2020-05-14 WO PCT/IB2020/054549 patent/WO2020230064A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| CN113825585A (zh) | 2021-12-21 |
| JP2022532241A (ja) | 2022-07-13 |
| LT6791B (lt) | 2020-12-28 |
| KR102890510B1 (ko) | 2025-11-24 |
| EP3969219A1 (en) | 2022-03-23 |
| CN113825585B (zh) | 2024-03-26 |
| KR20220008335A (ko) | 2022-01-20 |
| EP3969219B1 (en) | 2023-07-26 |
| WO2020230064A1 (en) | 2020-11-19 |
| US20220258278A1 (en) | 2022-08-18 |
| US12420356B2 (en) | 2025-09-23 |
| JP7640090B2 (ja) | 2025-03-05 |
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