MA52974A - Installation de dépôt sous vide et procédé de revêtement d'un substrat - Google Patents

Installation de dépôt sous vide et procédé de revêtement d'un substrat

Info

Publication number
MA52974A
MA52974A MA052974A MA52974A MA52974A MA 52974 A MA52974 A MA 52974A MA 052974 A MA052974 A MA 052974A MA 52974 A MA52974 A MA 52974A MA 52974 A MA52974 A MA 52974A
Authority
MA
Morocco
Prior art keywords
coating process
substrate coating
vacuum deposit
deposit installation
installation
Prior art date
Application number
MA052974A
Other languages
English (en)
Inventor
Didier Marneffe
Sergio Pace
Bruno Schmitz
Eric Silberberg
Original Assignee
Arcelormittal
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arcelormittal filed Critical Arcelormittal
Publication of MA52974A publication Critical patent/MA52974A/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/243—Crucibles for source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
MA052974A 2018-06-15 2019-06-11 Installation de dépôt sous vide et procédé de revêtement d'un substrat MA52974A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/IB2018/054419 WO2019239192A1 (fr) 2018-06-15 2018-06-15 Installation de dépôt sous vide et procédé de revêtement d'un substrat

Publications (1)

Publication Number Publication Date
MA52974A true MA52974A (fr) 2021-04-28

Family

ID=63036251

Family Applications (1)

Application Number Title Priority Date Filing Date
MA052974A MA52974A (fr) 2018-06-15 2019-06-11 Installation de dépôt sous vide et procédé de revêtement d'un substrat

Country Status (11)

Country Link
US (1) US12129542B2 (fr)
EP (1) EP3810822A1 (fr)
JP (1) JP7165755B2 (fr)
KR (1) KR102538729B1 (fr)
CN (1) CN112400034A (fr)
CA (1) CA3103386C (fr)
MA (1) MA52974A (fr)
MX (1) MX2020013600A (fr)
UA (1) UA128066C2 (fr)
WO (2) WO2019239192A1 (fr)
ZA (1) ZA202007502B (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113957389B (zh) * 2020-07-21 2023-08-11 宝山钢铁股份有限公司 一种具有多孔降噪及均匀化分配金属蒸汽的真空镀膜装置
WO2022175703A1 (fr) * 2021-02-16 2022-08-25 Applied Materials, Inc. Creuset, tuyau de distribution, ensemble de dépôt de matériau, système de dépôt sous vide et procédé de fabrication d'un dispositif
DE102021120004A1 (de) * 2021-08-02 2023-02-02 Thyssenkrupp Steel Europe Ag Beschichtungsanlage zur Beschichtung eines Gegenstands, Verfahren zum Beschichten eines Gegenstands sowie Verwendung
WO2023062410A1 (fr) * 2021-10-14 2023-04-20 Arcelormittal Buse à vapeur pour dépôt physique en phase vapeur (pvd)
WO2025017346A1 (fr) * 2023-07-17 2025-01-23 Arcelormittal Buse à vapeur à des fins de jvd

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2426377A (en) * 1943-12-07 1947-08-26 Ruben Samuel Selenium rectifier and method of making
US2793609A (en) * 1953-01-26 1957-05-28 British Dielectric Res Ltd Means for the deposition of materials by evaporation in a vacuum
GB1483966A (en) * 1974-10-23 1977-08-24 Sharp Kk Vapourized-metal cluster ion source and ionized-cluster beam deposition
US4401052A (en) * 1979-05-29 1983-08-30 The University Of Delaware Apparatus for continuous deposition by vacuum evaporation
JPS5943874A (ja) 1982-09-04 1984-03-12 Konishiroku Photo Ind Co Ltd 蒸発材料収容器及びその使用方法
JPS6353259A (ja) * 1986-08-22 1988-03-07 Mitsubishi Electric Corp 薄膜形成方法
DE3923390A1 (de) * 1988-07-14 1990-01-25 Canon Kk Vorrichtung zur bildung eines grossflaechigen aufgedampften films unter verwendung von wenigstens zwei getrennt gebildeten aktivierten gasen
GB9300400D0 (en) 1993-01-11 1993-03-03 Glaverbel A device and method for forming a coating by pyrolysis
US5820681A (en) * 1995-05-03 1998-10-13 Chorus Corporation Unibody crucible and effusion cell employing such a crucible
JPH09143692A (ja) * 1995-11-29 1997-06-03 Ishikawajima Harima Heavy Ind Co Ltd 高蒸気圧金属の気相メッキ装置及び方法
BE1010351A6 (fr) 1996-06-13 1998-06-02 Centre Rech Metallurgique Procede et dispositif pour revetir en continu un substrat en mouvement au moyen d'une vapeur metallique.
US6409839B1 (en) * 1997-06-02 2002-06-25 Msp Corporation Method and apparatus for vapor generation and film deposition
DE19843818A1 (de) 1998-09-24 2000-03-30 Leybold Systems Gmbh Bedampfungsvorrichtung für Vakuum-Bedampfungsanlagen
EP1560468B1 (fr) * 2002-07-19 2018-03-21 LG Display Co., Ltd. Source pour dépôt thermique physique en phase vapeur de couches organiques électroluminescentes
US20040043140A1 (en) 2002-08-21 2004-03-04 Ramesh Jagannathan Solid state lighting using compressed fluid coatings
JP4041005B2 (ja) * 2003-04-02 2008-01-30 長州産業株式会社 薄膜堆積用分子線源とそれを使用した薄膜堆積方法
US7232588B2 (en) * 2004-02-23 2007-06-19 Eastman Kodak Company Device and method for vaporizing temperature sensitive materials
JP2007039785A (ja) 2005-07-04 2007-02-15 Seiko Epson Corp 真空蒸着装置及び電気光学装置の製造方法
US7951276B2 (en) * 2006-06-08 2011-05-31 The Board Of Trustees Of The University Of Illinois Cluster generator
JP5013591B2 (ja) * 2006-12-15 2012-08-29 キヤノントッキ株式会社 真空蒸着装置
US20090081365A1 (en) * 2007-09-20 2009-03-26 Cok Ronald S Deposition apparatus for temperature sensitive materials
EP2048261A1 (fr) * 2007-10-12 2009-04-15 ArcelorMittal France Générateur de vapeur industriel pour le dépôt d'un revêtement d'alliage sur une bande métallique
KR100977374B1 (ko) * 2009-08-03 2010-08-20 텔리오솔라 테크놀로지스 인크 대면적 박막형 ｃｉｇｓ 태양전지 고속증착 및 양산장비, 그 공정방법
KR101879805B1 (ko) 2012-01-20 2018-08-17 삼성디스플레이 주식회사 박막 증착 장치 및 방법
CN103589997A (zh) * 2013-10-09 2014-02-19 昆山允升吉光电科技有限公司 一种蒸镀用掩模板
FR3020381B1 (fr) 2014-04-24 2017-09-29 Riber Cellule d'evaporation
CN104078626B (zh) * 2014-07-22 2016-07-06 深圳市华星光电技术有限公司 用于oled材料蒸镀的加热装置
WO2017051790A1 (fr) * 2015-09-24 2017-03-30 シャープ株式会社 Source de dépôt, dispositif de dépôt et procédé de fabrication de film par dépôt
WO2018020296A1 (fr) 2016-07-27 2018-02-01 Arcelormittal Appareil et procédé de dépôt par évaporation sous vide
KR102098455B1 (ko) * 2017-12-26 2020-04-07 주식회사 포스코 연속 증착 장치 및 연속 증착 방법
JP7422557B2 (ja) * 2019-02-28 2024-01-26 東京エレクトロン株式会社 基板処理方法および基板処理装置

Also Published As

Publication number Publication date
US20210238734A1 (en) 2021-08-05
JP7165755B2 (ja) 2022-11-04
MX2020013600A (es) 2021-03-09
CA3103386A1 (fr) 2019-12-19
WO2019239192A1 (fr) 2019-12-19
WO2019239314A1 (fr) 2019-12-19
KR102538729B1 (ko) 2023-05-31
CA3103386C (fr) 2022-08-30
BR112020025040A2 (pt) 2021-03-23
EP3810822A1 (fr) 2021-04-28
CN112400034A (zh) 2021-02-23
ZA202007502B (en) 2021-08-25
JP2021526592A (ja) 2021-10-07
UA128066C2 (uk) 2024-03-27
KR20210008095A (ko) 2021-01-20
US12129542B2 (en) 2024-10-29

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