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Application filed by Apic Yamada CorpfiledCriticalApic Yamada Corp
Priority to MYPI93002086ApriorityCriticalpatent/MY109193A/en
Publication of MY109193ApublicationCriticalpatent/MY109193A/en
Encapsulation Of And Coatings For Semiconductor Or Solid State Devices
(AREA)
Abstract
INSERT-PARTS ARE SET ONTO A LOWER DIE (10), AND RESIN TABLETS ARE SUPPLIED INTO POTS (10A) FOR RESIN MOLD. A PRESS MECHANISM A MOLDS THE INSERT-PARTS, A MOLD IS OPENED, THEN THE LOWER DIE (10) IS SLID TO A FIRST POSITION, WHICH IS LOCATED SIDE OF A MOLDING POSITION. AT THE FIRST POSITION, AN UNLOADING MECHANISM (C) AND A PARTS-LOADING MECHANISM (D) EXECUTE TO CLEAN PARTING FACES OF THE MOLD, AND TO SET RESIN TABLETS AND INSERT-PARTS. THE LOWER DIE (10) RETURNS TO THE MOLDING POSITION FOR NEXT MOLDING. BY SLIDING THE LOWER DIE (10), WORKS OF TAKING OUT MOLDED PRODUCTS, SETTING INSERT-PARTS, ETC. CAN BE EASTER, AND THE MOLDING CYCLE TIME CAN BE SHORTENED. (FIG. 2)
MYPI93002086A1993-10-121993-10-12A method of transfer molding and a transfer molding machine.
MY109193A
(en)