MY124410A - Burn-in test socket. - Google Patents

Burn-in test socket.

Info

Publication number
MY124410A
MY124410A MYPI99001225A MYPI9901225A MY124410A MY 124410 A MY124410 A MY 124410A MY PI99001225 A MYPI99001225 A MY PI99001225A MY PI9901225 A MYPI9901225 A MY PI9901225A MY 124410 A MY124410 A MY 124410A
Authority
MY
Malaysia
Prior art keywords
housing
socket
limit position
circuit package
burn
Prior art date
Application number
MYPI99001225A
Other languages
English (en)
Inventor
Isamu Yamamoto
Tomohiro Nakano
Akira Kaneshige
Original Assignee
Molex Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Inc filed Critical Molex Inc
Publication of MY124410A publication Critical patent/MY124410A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for unleaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Connecting Device With Holders (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
MYPI99001225A 1998-04-01 1999-03-31 Burn-in test socket. MY124410A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10105894A JP3020030B2 (ja) 1998-04-01 1998-04-01 バーンインソケット

Publications (1)

Publication Number Publication Date
MY124410A true MY124410A (en) 2006-06-30

Family

ID=14419623

Family Applications (2)

Application Number Title Priority Date Filing Date
MYPI99001225A MY124410A (en) 1998-04-01 1999-03-31 Burn-in test socket.
MYPI99001233A MY123246A (en) 1998-04-01 1999-03-31 Test socket lattice

Family Applications After (1)

Application Number Title Priority Date Filing Date
MYPI99001233A MY123246A (en) 1998-04-01 1999-03-31 Test socket lattice

Country Status (6)

Country Link
JP (1) JP3020030B2 (ko)
KR (2) KR100581240B1 (ko)
CN (2) CN1178065C (ko)
MY (2) MY124410A (ko)
TW (2) TW399814U (ko)
WO (2) WO1999050676A1 (ko)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6267603B1 (en) 1998-04-01 2001-07-31 Molex Incorporated Burn-in test socket
US6283780B1 (en) 1998-04-01 2001-09-04 Molex Incorporated Test socket lattice
JP2002164135A (ja) * 2000-11-26 2002-06-07 Isao Kimoto ソケット
JP3789789B2 (ja) * 2001-08-31 2006-06-28 株式会社エンプラス 電気部品用ソケット
JP4368132B2 (ja) 2003-04-25 2009-11-18 株式会社エンプラス 電気部品用ソケット
KR100898409B1 (ko) 2007-07-05 2009-05-21 주식회사 오킨스전자 리드프레임 방식 칩 패키지용 번인 소켓
KR101090303B1 (ko) * 2009-06-12 2011-12-07 (주)브이알인사이트 반도체 검증용 ｆｐｇａ 보드의 뱅크구조
JP5836112B2 (ja) * 2011-12-28 2015-12-24 株式会社エンプラス 電気部品用ソケット
US8888503B2 (en) * 2011-12-28 2014-11-18 Enplas Corporation Socket for electric parts
KR101485779B1 (ko) 2013-06-28 2015-01-26 황동원 반도체 소자 테스트용 소켓장치
KR101931623B1 (ko) * 2016-12-20 2018-12-21 주식회사 오킨스전자 래치 고정 락커를 포함하는 소켓
CN109342773A (zh) * 2018-08-17 2019-02-15 北方电子研究院安徽有限公司 一种金属管壳老化板夹具
MY206375A (en) * 2019-01-31 2024-12-13 Yamaichi Electronics Co Ltd Socket for inspection
CN110867422A (zh) * 2019-10-29 2020-03-06 太极半导体（苏州）有限公司 一种陶瓷栅格阵列clga封装载具
KR102606908B1 (ko) * 2020-12-23 2023-11-24 (주)마이크로컨텍솔루션 반도체 칩 테스트 소켓

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3245747B2 (ja) * 1991-09-18 2002-01-15 日本テキサス・インスツルメンツ株式会社 ソケット
JPH0677467B2 (ja) * 1992-12-25 1994-09-28 山一電機株式会社 Ｉｃソケット
JP3259109B2 (ja) * 1993-02-08 2002-02-25 日本テキサス・インスツルメンツ株式会社 ソケット
JP2667633B2 (ja) * 1994-02-24 1997-10-27 山一電機株式会社 Ｉｃソケットにおけるｉｃ保持装置
JPH0888063A (ja) * 1994-09-16 1996-04-02 Yamaichi Electron Co Ltd Ｉｃソケットの接触構造
JPH09162332A (ja) * 1995-12-13 1997-06-20 Toshiba Chem Corp Ｂｇａのｉｃテスト用ソケット
JP3714642B2 (ja) * 1996-07-30 2005-11-09 株式会社エンプラス 電気的接続装置

Also Published As

Publication number Publication date
TW411060U (en) 2000-11-01
KR20010013206A (ko) 2001-02-26
JP3020030B2 (ja) 2000-03-15
WO1999050676A1 (en) 1999-10-07
KR100581237B1 (ko) 2006-05-22
MY123246A (en) 2006-05-31
KR20010013205A (ko) 2001-02-26
CN1178066C (zh) 2004-12-01
TW399814U (en) 2000-07-21
CN1266491A (zh) 2000-09-13
CN1178065C (zh) 2004-12-01
KR100581240B1 (ko) 2006-05-22
JPH11297443A (ja) 1999-10-29
WO1999050677A1 (en) 1999-10-07
CN1266492A (zh) 2000-09-13

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