MY169975A - Abrasive grain embedding apparatus, lapping apparatus and lapping method - Google Patents

Abrasive grain embedding apparatus, lapping apparatus and lapping method

Info

Publication number
MY169975A
MY169975A MYPI2012003579A MYPI2012003579A MY169975A MY 169975 A MY169975 A MY 169975A MY PI2012003579 A MYPI2012003579 A MY PI2012003579A MY PI2012003579 A MYPI2012003579 A MY PI2012003579A MY 169975 A MY169975 A MY 169975A
Authority
MY
Malaysia
Prior art keywords
pressing
polishing platen
lapping
slurry
abrasive grains
Prior art date
Application number
MYPI2012003579A
Inventor
Hotta Haruhiko
Tashino Fumiteru
Qiu Xiaoming
Iwata Naoya
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of MY169975A publication Critical patent/MY169975A/en

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

In an abrasive grain embedding apparatus (1) wherein, while slurry (40) which contains abrasive grains (40a) is supplied to the surface (30) of a polishing platen (3), the polishing platen is pressed through the slurry by pressing means (6) and the pressing means and the polishing platen are slidably moved relative to each other to embed the abrasive grains contained in the slurry into the surface of the polishing platen, the pressing means includes one or more pressing members (60), a weight (63) disposed above the pressing members for pressing the pressing members against the polishing platen, and an ultrasonic vibrator (65) for applying ultrasonic waves to the pressing members. Each pressing member has a pressing face on which a plurality of disk-shaped pressing chips are disposed such that the processing faces have an equal length in the relative sliding direction of the pressing means and the polishing platen. By this, a dispersion of fluid stress is suppressed to suppress an embedding dispersion of abrasive grains into the polishing platen.
MYPI2012003579A 2011-09-01 2012-08-08 Abrasive grain embedding apparatus, lapping apparatus and lapping method MY169975A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011190641A JP5808201B2 (en) 2011-09-01 2011-09-01 Abrasive grain embedding device, lapping device, and lapping method

Publications (1)

Publication Number Publication Date
MY169975A true MY169975A (en) 2019-06-19

Family

ID=47793352

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2012003579A MY169975A (en) 2011-09-01 2012-08-08 Abrasive grain embedding apparatus, lapping apparatus and lapping method

Country Status (4)

Country Link
JP (1) JP5808201B2 (en)
CN (1) CN102962763B (en)
MY (1) MY169975A (en)
TW (1) TWI579105B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6267916B2 (en) * 2013-10-08 2018-01-24 株式会社ディスコ Charging device
JP6434266B2 (en) 2013-12-17 2018-12-05 富士紡ホールディングス株式会社 Lapping resin surface plate and lapping method using the same
JP6842669B2 (en) 2017-05-29 2021-03-17 トヨタ紡織株式会社 Particle impregnation device and manufacturing method of particle impregnated non-woven fabric
CN112892809B (en) * 2021-02-05 2023-01-24 惠州大唐伟业电子有限公司 Ultrasonic machining device for optical glass
JP7240078B1 (en) 2021-08-30 2023-03-15 直江津電子工業株式会社 Workpiece polishing device and polishing auxiliary device
JP7238053B1 (en) 2021-08-30 2023-03-13 直江津電子工業株式会社 Work polishing device, polishing auxiliary device and work manufacturing method
CN114247939B (en) * 2021-12-24 2023-01-06 大连理工大学 A kind of unloaded overall immersion chemical-mechanical coupling surface polishing method for gears
CN115042086B (en) * 2022-07-15 2023-11-28 江苏科沛达半导体科技有限公司 High-precision semiconductor wafer outer diameter grinding device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0392264A (en) * 1989-09-04 1991-04-17 Hitachi Ltd High-accuracy lapping method and device for composite material
JPH07299737A (en) * 1994-04-28 1995-11-14 Matsushita Electric Ind Co Ltd Polishing method
JP3371775B2 (en) * 1997-10-31 2003-01-27 株式会社日立製作所 Polishing method
JPH11213367A (en) * 1998-01-28 1999-08-06 Citizen Watch Co Ltd Grinding method for floating surface of thin film magnetic head
JP2001232558A (en) * 2000-02-24 2001-08-28 Matsushita Electric Ind Co Ltd Polishing method
WO2003059576A1 (en) * 2001-12-27 2003-07-24 Fujitsu Limited Abrasive grain burying device for lapping device
JP2004330338A (en) * 2003-05-06 2004-11-25 Shin Etsu Chem Co Ltd Work polishing apparatus and work polishing method
JP4155872B2 (en) * 2003-05-26 2008-09-24 一正 大西 Lapping machine manufacturing method
JP4646638B2 (en) * 2005-01-14 2011-03-09 株式会社リコー Surface polishing processing method and processing apparatus
JP2007067166A (en) * 2005-08-31 2007-03-15 Matsushita Electric Ind Co Ltd Chemo-mechanical polishing method for SiC substrate
JP5209378B2 (en) * 2008-06-06 2013-06-12 株式会社ディスコ Wrap equipment
JP5024305B2 (en) * 2009-02-04 2012-09-12 住友電気工業株式会社 Polishing method of GaN substrate

Also Published As

Publication number Publication date
TW201318768A (en) 2013-05-16
JP5808201B2 (en) 2015-11-10
CN102962763A (en) 2013-03-13
TWI579105B (en) 2017-04-21
JP2013052455A (en) 2013-03-21
CN102962763B (en) 2016-08-17

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