MY176308A - Surface-treated electrolytic copper foil, laminate, printed circuit board and electronic device - Google Patents

Surface-treated electrolytic copper foil, laminate, printed circuit board and electronic device

Info

Publication number
MY176308A
MY176308A MYPI2015701682A MYPI2015701682A MY176308A MY 176308 A MY176308 A MY 176308A MY PI2015701682 A MYPI2015701682 A MY PI2015701682A MY PI2015701682 A MYPI2015701682 A MY PI2015701682A MY 176308 A MY176308 A MY 176308A
Authority
MY
Malaysia
Prior art keywords
copper foil
electrolytic copper
laminate
circuit board
printed circuit
Prior art date
Application number
MYPI2015701682A
Inventor
Michiya Kohiki
Kenji Inukai
Original Assignee
Jx Nippon Mining & Metals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jx Nippon Mining & Metals Corp filed Critical Jx Nippon Mining & Metals Corp
Publication of MY176308A publication Critical patent/MY176308A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

The present invention provides a surface-treated electrolytic copper foil capable of adopting fine pitch and excellent in adhesion reliability with resin, a laminate and a printed circuit board. The surface-treated electrolytic copper foil has a roughness Rz of the rough surface of the copper foil of 2.0 ?m or less as measured with a stylus-type roughness meter, and a kurtosis number Sku of the roughness curve of the rough surface of 2 to 4.
MYPI2015701682A 2012-11-26 2013-11-26 Surface-treated electrolytic copper foil, laminate, printed circuit board and electronic device MY176308A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012257896 2012-11-26

Publications (1)

Publication Number Publication Date
MY176308A true MY176308A (en) 2020-07-28

Family

ID=50776215

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015701682A MY176308A (en) 2012-11-26 2013-11-26 Surface-treated electrolytic copper foil, laminate, printed circuit board and electronic device

Country Status (7)

Country Link
JP (1) JP5710845B2 (en)
KR (2) KR102078897B1 (en)
CN (1) CN104812945B (en)
MY (1) MY176308A (en)
PH (1) PH12015501174B1 (en)
TW (1) TWI509111B (en)
WO (1) WO2014081041A1 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6193534B2 (en) * 2015-07-03 2017-09-06 三井金属鉱業株式会社 Roughening copper foil, copper clad laminate and printed wiring board
WO2017018232A1 (en) * 2015-07-29 2017-02-02 三井金属鉱業株式会社 Roughened copper foil, copper-clad laminate, and printed wiring board
TWI732892B (en) * 2016-07-26 2021-07-11 日商松下知識產權經營股份有限公司 Laminate board for see-through electrode, see-through electrode material, component, and method for manufacturing laminate board for see-through electrode
WO2018047933A1 (en) * 2016-09-12 2018-03-15 古河電気工業株式会社 Copper foil and copper-clad laminate comprising same
KR101734840B1 (en) * 2016-11-11 2017-05-15 일진머티리얼즈 주식회사 Electrolytic copper foil of secondary battery enhanced for flexibility resistance and manufacturing method thereof
JP7492808B2 (en) 2017-03-31 2024-05-30 Ｊｘ金属株式会社 Surface-treated copper foil, surface-treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device
JP7356209B2 (en) * 2017-03-31 2023-10-04 Ｊｘ金属株式会社 Surface-treated copper foil, surface-treated copper foil with resin layer, copper foil with carrier, laminate, method for manufacturing printed wiring boards, and method for manufacturing electronic devices
KR102340473B1 (en) * 2017-04-25 2021-12-16 후루카와 덴키 고교 가부시키가이샤 surface treatment copper foil
MY204665A (en) 2018-03-30 2024-09-07 Mitsui Mining & Smelting Co Ltd Copper-clad laminate
JP6819798B2 (en) * 2018-04-10 2021-01-27 Dic株式会社 Composite structure and its manufacturing method
CN112004964B (en) * 2018-04-25 2022-03-18 古河电气工业株式会社 Surface treatment of copper foil, copper clad laminate and printed circuit board
JP7032239B2 (en) * 2018-05-28 2022-03-08 古河電気工業株式会社 Lead frame material and its manufacturing method and semiconductor package
JP6895936B2 (en) * 2018-09-28 2021-06-30 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminates and circuit boards using this
JP2020100144A (en) * 2018-12-21 2020-07-02 積水化学工業株式会社 Laminate
US10581081B1 (en) * 2019-02-01 2020-03-03 Chang Chun Petrochemical Co., Ltd. Copper foil for negative electrode current collector of lithium ion secondary battery
JP6845382B1 (en) * 2019-06-07 2021-03-17 古河電気工業株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
TWM608774U (en) * 2019-06-19 2021-03-11 金居開發股份有限公司 Advanced reverse-treated electrodeposited copper foil and copper clad laminate using the same
US11332839B2 (en) 2019-06-19 2022-05-17 Co-Tech Development Corp. Advanced electrodeposited copper foil and copper clad laminate using the same
TWI697574B (en) * 2019-11-27 2020-07-01 長春石油化學股份有限公司 Electrolytic copper foil and electrode and lithium-ion battery comprising the same
EP4132235B1 (en) * 2020-03-30 2025-02-19 Mitsubishi Materials Corporation Bonded body and insulating circuit board
WO2021251288A1 (en) * 2020-06-11 2021-12-16 三井金属鉱業株式会社 Double-sided copper-clad laminate
WO2022153580A1 (en) * 2021-01-15 2022-07-21 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
WO2023281759A1 (en) * 2021-07-09 2023-01-12 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4567360B2 (en) * 2004-04-02 2010-10-20 三井金属鉱業株式会社 Copper foil manufacturing method and copper foil obtained by the manufacturing method
JP5129642B2 (en) * 2007-04-19 2013-01-30 三井金属鉱業株式会社 Surface treated copper foil, copper clad laminate obtained using the surface treated copper foil, and printed wiring board obtained using the copper clad laminate
JP5215631B2 (en) * 2007-10-24 2013-06-19 三井金属鉱業株式会社 Surface treated copper foil
TWI434965B (en) * 2008-05-28 2014-04-21 Mitsui Mining & Smelting Co A roughening method for copper foil, and a copper foil for a printed wiring board which is obtained by the roughening method
CN102224281B (en) * 2008-11-25 2014-03-26 吉坤日矿日石金属株式会社 Copper foil for printed circuit
JP5282675B2 (en) * 2009-06-23 2013-09-04 日立電線株式会社 Copper foil for printed wiring board and method for producing the same
JP5634103B2 (en) * 2010-04-06 2014-12-03 福田金属箔粉工業株式会社 A treated copper foil for a copper clad laminate, a copper clad laminate obtained by bonding the treated copper foil to an insulating resin substrate, and a printed wiring board using the copper clad laminate.
JP5885054B2 (en) * 2010-04-06 2016-03-15 福田金属箔粉工業株式会社 A treated copper foil for a copper clad laminate, a copper clad laminate obtained by bonding the treated copper foil to an insulating resin substrate, and a printed wiring board using the copper clad laminate.
CN103154327A (en) * 2010-10-06 2013-06-12 古河电气工业株式会社 Copper foil and manufacturing method therefor, copper foil with carrier and manufacturing method therefor, printed circuit board, and multilayer printed circuit board
WO2012101985A1 (en) * 2011-01-26 2012-08-02 住友ベークライト株式会社 Printed wiring board and method for manufacturing printed wiring board

Also Published As

Publication number Publication date
WO2014081041A1 (en) 2014-05-30
TWI509111B (en) 2015-11-21
TW201428139A (en) 2014-07-16
CN104812945B (en) 2018-08-28
PH12015501174B1 (en) 2019-01-11
CN104812945A (en) 2015-07-29
JPWO2014081041A1 (en) 2017-01-05
PH12015501174A1 (en) 2015-08-10
KR102078897B1 (en) 2020-02-19
KR20170002705A (en) 2017-01-06
KR20140124402A (en) 2014-10-24
JP5710845B2 (en) 2015-04-30

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