MY177304A - Protective material for electronic circuit, sealing material for protective material for electronic circuit, sealing method, and method for manufacturing semiconductor device - Google Patents

Protective material for electronic circuit, sealing material for protective material for electronic circuit, sealing method, and method for manufacturing semiconductor device

Info

Publication number
MY177304A
MY177304A MYPI2019005630A MYPI2019005630A MY177304A MY 177304 A MY177304 A MY 177304A MY PI2019005630 A MYPI2019005630 A MY PI2019005630A MY PI2019005630 A MYPI2019005630 A MY PI2019005630A MY 177304 A MY177304 A MY 177304A
Authority
MY
Malaysia
Prior art keywords
electronic circuit
protective material
sealing
viscosity
semiconductor device
Prior art date
Application number
MYPI2019005630A
Inventor
Dongchul Kang
Kenta Ishibashi
Masashi Yamaura
Kohji Hori
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2017072893A external-priority patent/JP6292334B1/en
Priority claimed from JP2017072894A external-priority patent/JP6288344B1/en
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Publication of MY177304A publication Critical patent/MY177304A/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

A protective material for an electronic circuit, satisfying at least one of the following (1) or (2): (1) comprising a resin component and an inorganic filler, and a content ratio of the inorganic filler being 50% by mass or more of the whole protective material for an electronic circuit. (2) comprising a resin component and an inorganic filler, and having a thixotropic index at 75 ?C obtained as a value of viscosity A / viscosity B, where viscosity A is a viscosity (Pa?s) measured at 75 ?C and a shear rate of 5 s-1 and viscosity B is a viscosity (Pa?s) measured at 75 ?C and a shear rate of 50 s-1, of from 0.1 to 2.5.
MYPI2019005630A 2017-03-31 2018-03-28 Protective material for electronic circuit, sealing material for protective material for electronic circuit, sealing method, and method for manufacturing semiconductor device MY177304A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017072893A JP6292334B1 (en) 2017-03-31 2017-03-31 Electronic circuit protective material, electronic circuit protective material sealing material, sealing method, and semiconductor device manufacturing method
JP2017072894A JP6288344B1 (en) 2017-03-31 2017-03-31 Electronic circuit protective material, electronic circuit protective material sealing material, sealing method, and semiconductor device manufacturing method

Publications (1)

Publication Number Publication Date
MY177304A true MY177304A (en) 2020-09-11

Family

ID=63676048

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019005630A MY177304A (en) 2017-03-31 2018-03-28 Protective material for electronic circuit, sealing material for protective material for electronic circuit, sealing method, and method for manufacturing semiconductor device

Country Status (5)

Country Link
KR (2) KR102450897B1 (en)
CN (4) CN113410182A (en)
MY (1) MY177304A (en)
TW (2) TWI892106B (en)
WO (1) WO2018181602A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114507415A (en) * 2022-03-01 2022-05-17 郭亚莹 Fast-flowing high-temperature-resistant underfill adhesive and preparation method thereof
KR102772596B1 (en) * 2023-02-08 2025-02-26 이아이씨티코리아 주식회사 Underfill Adhesive Composition
WO2024242157A1 (en) * 2023-05-23 2024-11-28 デンカ株式会社 Heat dissipation grease

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0272656A (en) * 1988-09-07 1990-03-12 Fujikura Ltd Sealing structure for semiconductor element
JP3611066B2 (en) * 1996-08-29 2005-01-19 株式会社ルネサステクノロジ Inorganic filler and method for producing epoxy resin composition
DE69722106T2 (en) * 1996-08-29 2004-04-01 Mitsubishi Denki K.K. Epoxy resin composition and thus encapsulated semiconductor devices
JP3729225B2 (en) * 1996-08-29 2005-12-21 信越化学工業株式会社 Semiconductor device
JPH10261741A (en) * 1997-03-19 1998-09-29 Oki Electric Ind Co Ltd Semiconductor device and method of manufacturing semiconductor device
JP2000269388A (en) * 1999-03-18 2000-09-29 Toshiba Corp Semiconductor sealing resin and resin sealing type semiconductor device
JP4103342B2 (en) * 2001-05-22 2008-06-18 日立電線株式会社 Manufacturing method of semiconductor device
US20120126434A1 (en) * 2009-07-31 2012-05-24 Masaya Koda Liquid resin composition and semiconductor device using the same
JP5586185B2 (en) 2009-08-06 2014-09-10 パナソニック株式会社 Semiconductor device
JP5906673B2 (en) * 2010-11-26 2016-04-20 日立化成株式会社 Epoxy resin molding material for sealing, and electronic component device provided with element sealed with this molding material
WO2013108629A1 (en) * 2012-01-18 2013-07-25 三井化学株式会社 Composition, composition for display device end-face sealing agent comprising composition, and display device and method for manufacturing same
JP6013906B2 (en) * 2012-12-27 2016-10-25 ナミックス株式会社 Liquid epoxy resin composition
JP5881179B2 (en) * 2013-08-28 2016-03-09 信越化学工業株式会社 Semiconductor sealing resin composition and semiconductor device provided with cured product thereof
JP6125967B2 (en) * 2013-09-30 2017-05-10 明和化成株式会社 Epoxy resin composition, sealing material, cured product thereof, and phenol resin
JP6196138B2 (en) * 2013-11-29 2017-09-13 ナミックス株式会社 Semiconductor encapsulant and semiconductor device
JP6331570B2 (en) * 2014-03-28 2018-05-30 日立化成株式会社 Underfill material, electronic component sealed with underfill material, and manufacturing method thereof
JP6415104B2 (en) * 2014-05-16 2018-10-31 ナミックス株式会社 Liquid encapsulant and electronic parts using it
US20170158807A1 (en) * 2014-07-02 2017-06-08 Dic Corporation Epoxy resin composition for electronic material, cured product thereof and electronic member
JP2016108367A (en) * 2014-12-02 2016-06-20 信越化学工業株式会社 Resin composition for encapsulating semiconductor, and method for encapsulating semiconductor using the resin composition
JP6300744B2 (en) * 2015-02-27 2018-03-28 信越化学工業株式会社 Semiconductor sealing resin composition and semiconductor device
CN104910845B (en) * 2015-06-12 2017-11-07 深圳先进技术研究院 Underfill and preparation method thereof
US20200229707A1 (en) * 2015-08-24 2020-07-23 Sandra Donnelly Device and Method for Equine Condition Monitoring

Also Published As

Publication number Publication date
CN110476243A (en) 2019-11-19
KR102450897B1 (en) 2022-10-04
CN113410182A (en) 2021-09-17
KR20190119143A (en) 2019-10-21
TWI800504B (en) 2023-05-01
CN113345813A (en) 2021-09-03
KR102070113B1 (en) 2020-01-29
WO2018181602A1 (en) 2018-10-04
TW202328334A (en) 2023-07-16
TWI892106B (en) 2025-08-01
TW201842051A (en) 2018-12-01
CN113388229A (en) 2021-09-14
KR20200007090A (en) 2020-01-21

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