MY181562A - Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board - Google Patents

Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board

Info

Publication number
MY181562A
MY181562A MYPI2015702425A MYPI2015702425A MY181562A MY 181562 A MY181562 A MY 181562A MY PI2015702425 A MYPI2015702425 A MY PI2015702425A MY PI2015702425 A MYPI2015702425 A MY PI2015702425A MY 181562 A MY181562 A MY 181562A
Authority
MY
Malaysia
Prior art keywords
copper foil
black color
wiring board
printed wiring
color surface
Prior art date
Application number
MYPI2015702425A
Inventor
Misato Mizoguchi
Shinichi Obata
Ayumu Tateoka
Shinya Hiraoka
Takashi Hashiguchi
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51428422&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=MY181562(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY181562A publication Critical patent/MY181562A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/028—Electroplating of selected surface areas one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0692—Regulating the thickness of the coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • ing And Chemical Polishing (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

An object is to provide a copper foil for a printed wiring board, wherein the copper foil has a black color roughening-treated surface which enhances CCD visibility in terminal connection processing and precision of inspection by AOI of a flexible printed wiring board; and has an appropriate roughness suitable for manufacturing a flexible printed wiring board and excellent in etching performance. To achieve the object, a surface-treated copper foil having a roughening-treated surface which is a black color surface-treated copper foil for manufacturing of a flexible printed wiring board, wherein the roughening-treated surface is a black color roughening-treated surface having a maximum height of the waviness data (Wmax) of 1.2 micron-meters or less and having color: lightness L* of 30 or less in an L*a*b* color system is employed. Figure 1
MYPI2015702425A 2013-02-28 2014-02-28 Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board MY181562A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013039388 2013-02-28
PCT/JP2014/055173 WO2014133164A1 (en) 2013-02-28 2014-02-28 Blackened surface-treated copper foil, method for manufacturing blackened surface-treated copper foil, copper-clad laminate and flexible printed circuit board

Publications (1)

Publication Number Publication Date
MY181562A true MY181562A (en) 2020-12-29

Family

ID=51428422

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2015702425A MY181562A (en) 2013-02-28 2014-02-28 Black color surface-treated copper foil, method of manufacturing black color surface-treated copper foil, copper-clad laminate and flexible printed wiring board

Country Status (6)

Country Link
JP (1) JP5705381B2 (en)
KR (2) KR102116928B1 (en)
CN (1) CN105008593B (en)
MY (1) MY181562A (en)
TW (1) TWI690625B (en)
WO (1) WO2014133164A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101895256B1 (en) * 2014-09-02 2018-09-05 미쓰이금속광업주식회사 Blackened surface treated copper foil and copper foil with carrier foil
KR102402300B1 (en) * 2014-12-08 2022-05-27 미쓰이금속광업주식회사 Method of manufacturing printed wiring board
KR101929844B1 (en) * 2015-01-22 2018-12-17 미쓰이금속광업주식회사 Ultrathin copper foil with carrier and method for manufacturing same
JP6487704B2 (en) 2015-02-12 2019-03-20 福田金属箔粉工業株式会社 Treated copper foil, copper-clad laminate using the treated copper foil, and printed wiring board
CN107429417B (en) * 2015-03-31 2019-11-22 三井金属矿业株式会社 Roughened copper foil, copper foil with carrier, copper clad laminate and printed circuit board
JP2017014608A (en) * 2015-07-06 2017-01-19 古河電気工業株式会社 Electrolytic copper foil, lithium ion secondary battery negative electrode and lithium ion secondary battery, printed wiring board, and electromagnetic wave-shielding material
US9397343B1 (en) 2015-10-15 2016-07-19 Chang Chun Petrochemical Co., Ltd. Copper foil exhibiting anti-swelling properties
CN109072472B (en) * 2016-04-14 2020-10-16 三井金属矿业株式会社 Surface-treated copper foil, copper foil with carrier, and copper-clad laminate and printed wiring board manufacturing method using same
CN106229344B (en) 2016-08-19 2019-10-15 京东方科技集团股份有限公司 Thin film transistor, its manufacturing method and display device
KR102180926B1 (en) 2017-06-28 2020-11-19 에스케이넥실리스 주식회사 Copper foil having improved workability and charge discharge characteristics, electrode comprisng the same, secondary battery comprising the same and method for manufacturing the same
TWI694176B (en) * 2018-08-10 2020-05-21 南韓商Ｋｃｆ科技有限公司 Copper foil having improved workability and charge/discharge characteristics, electrode including the same, secondary battery including the same and method for manufacturing the same
CN111058063B (en) * 2018-10-16 2021-02-02 长春石油化学股份有限公司 Electrolytic copper foil, electrode including the same, and lithium ion battery including the same
US11365486B2 (en) 2018-10-16 2022-06-21 Chang Chun Petrochemical Co., Ltd. Electrolytic copper foil, electrode comprising the same, and lithium ion battery comprising the same
JP7409602B2 (en) * 2019-05-09 2024-01-09 ナミックス株式会社 composite copper parts
JP7352939B2 (en) * 2019-05-09 2023-09-29 ナミックス株式会社 composite copper parts
JP7456578B2 (en) * 2019-05-09 2024-03-27 ナミックス株式会社 Copper surface processing equipment
CN116997684A (en) 2021-03-26 2023-11-03 三井金属矿业株式会社 Roughened copper foil, copper foil with carrier, copper-clad laminate and printed circuit board
WO2022202541A1 (en) 2021-03-26 2022-09-29 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper-cladded laminate board, and printed wiring board
JP7834086B2 (en) 2021-03-29 2026-03-23 三井金属株式会社 Roughened copper foil, copper-clad laminates, and printed circuit boards
CN117044412A (en) 2021-03-29 2023-11-10 三井金属矿业株式会社 Roughening of copper foil, copper-clad laminates and printed circuit boards
CN113997675A (en) * 2021-11-16 2022-02-01 昆山欧贝达电子科技有限公司 Preparation process of polyphenylene sulfide double-sided copper foil substrate
CN118805004A (en) 2022-03-24 2024-10-18 三井金属矿业株式会社 Roughening copper foil, copper foil with carrier, copper clad laminate and printed circuit board
WO2023182178A1 (en) 2022-03-24 2023-09-28 三井金属鉱業株式会社 Roughened copper foil, copper foil equipped with carrier, copper-clad laminate, and printed wiring board
KR20240166988A (en) 2022-03-24 2024-11-26 미쓰이금속광업주식회사 Copper foil with harmonic treatment, copper foil with carrier, copper-clad laminate and printed wiring board
CN118829747A (en) 2022-03-24 2024-10-22 三井金属矿业株式会社 Roughening copper foil, copper foil with carrier, copper clad laminate and printed circuit board
CN115135043B (en) * 2022-07-18 2023-03-07 东莞市国盈电子有限公司 A sensor circuit board and its manufacturing process
TWI876541B (en) * 2023-09-19 2025-03-11 南亞塑膠工業股份有限公司 Manufacturing method of roughened copper foil

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JP3306404B2 (en) * 2000-01-28 2002-07-24 三井金属鉱業株式会社 Method for producing surface-treated copper foil and copper-clad laminate using surface-treated copper foil obtained by the method
JP2004263300A (en) * 2003-02-12 2004-09-24 Furukawa Techno Research Kk Copper foil for fine pattern printed wiring and manufacturing method thereof
JP2004256832A (en) * 2003-02-24 2004-09-16 Mitsui Mining & Smelting Co Ltd Surface-treated copper foil having a blackened surface and magnetically shielded conductive mesh for front panel of plasma display using the surface-treated copper foil
TW200535259A (en) * 2004-02-06 2005-11-01 Furukawa Circuit Foil Treated copper foil and circuit board
KR100852863B1 (en) * 2004-02-17 2008-08-18 닛코킨조쿠 가부시키가이샤 Copper foil having blackened surface or layer
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JP2006210689A (en) * 2005-01-28 2006-08-10 Fukuda Metal Foil & Powder Co Ltd Copper foil for high frequency printed wiring board and method for producing the same
KR101137274B1 (en) * 2005-04-04 2012-04-20 우베 고산 가부시키가이샤 Copper clad laminate
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
JP4958045B2 (en) 2006-10-27 2012-06-20 三井金属鉱業株式会社 Surface-treated copper foil for producing flexible copper-clad laminate and flexible copper-clad laminate obtained using the surface-treated copper foil
JP2009004423A (en) * 2007-06-19 2009-01-08 Hitachi Cable Ltd Copper foil with carrier foil
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Also Published As

Publication number Publication date
TWI690625B (en) 2020-04-11
KR20160135369A (en) 2016-11-25
JPWO2014133164A1 (en) 2017-02-09
CN105008593B (en) 2018-08-24
TW201447051A (en) 2014-12-16
KR20150090265A (en) 2015-08-05
KR102116928B1 (en) 2020-05-29
CN105008593A (en) 2015-10-28
WO2014133164A1 (en) 2014-09-04
JP5705381B2 (en) 2015-04-22

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