MY174931A - Ultrathin copper foil with carrier and method for manufacturing same - Google Patents

Ultrathin copper foil with carrier and method for manufacturing same

Info

Publication number
MY174931A
MY174931A MYPI2017702395A MYPI2017702395A MY174931A MY 174931 A MY174931 A MY 174931A MY PI2017702395 A MYPI2017702395 A MY PI2017702395A MY PI2017702395 A MYPI2017702395 A MY PI2017702395A MY 174931 A MY174931 A MY 174931A
Authority
MY
Malaysia
Prior art keywords
copper foil
carrier
extremely thin
thin copper
release layer
Prior art date
Application number
MYPI2017702395A
Inventor
Toru Hanada
Akitoshi Takanashi
Tetsuhiro Matsunaga
Ayumu Tateoka
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY174931A publication Critical patent/MY174931A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

There is provided an extremely thin copper foil with a carrier which can simultaneously achieve the formability of microcircuits and laser machining in processing of a copper-clad laminate or production of a printed wiring board. The extremely thin copper foil with a carrier of the present invention includes a carrier foil, a release layer, and an extremely thin copper foil disposed in this order. The surface of the extremely thin copper foil on the side of the release layer has an average distance between the surface peaks (Peak spacing) of 20 ?m or less and the surface of the extremely thin copper foil on the opposite side of the release layer has a maximum height difference of waviness (Wmax) of 1.0 ?m or less. Most illustrative Drawing : Figure 1
MYPI2017702395A 2015-01-22 2016-01-20 Ultrathin copper foil with carrier and method for manufacturing same MY174931A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015010431 2015-01-22

Publications (1)

Publication Number Publication Date
MY174931A true MY174931A (en) 2020-05-24

Family

ID=56417128

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2017702395A MY174931A (en) 2015-01-22 2016-01-20 Ultrathin copper foil with carrier and method for manufacturing same

Country Status (6)

Country Link
JP (2) JP6352449B2 (en)
KR (2) KR101929844B1 (en)
CN (2) CN107002265B (en)
MY (1) MY174931A (en)
TW (1) TWI572747B (en)
WO (1) WO2016117587A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181726A1 (en) * 2017-03-30 2018-10-04 古河電気工業株式会社 Surface-treated copper foil, and copper-clad laminate and printed wiring board using same
CN107454762A (en) * 2017-09-14 2017-12-08 桐城市闲产网络服务有限公司 A kind of preparation method of computer circuit board
CN108323025B (en) * 2018-02-01 2020-01-14 北京启创驿讯科技有限公司 Preparation method of printed circuit board and copper foil for processing
WO2020031721A1 (en) * 2018-08-10 2020-02-13 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper-clad laminate and printed wiring board
CN109518131A (en) * 2018-12-25 2019-03-26 胡旭日 A kind of ultrathin copper foil with carrier, ultrathin copper foil production method and device
JP7177956B2 (en) * 2020-02-04 2022-11-24 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board
CN115038819B (en) * 2020-02-04 2024-12-17 三井金属矿业株式会社 Roughened copper foil, copper foil with carrier, copper-clad laminate, and printed wiring board
CN112795964B (en) * 2020-12-07 2021-11-19 安徽铜冠铜箔集团股份有限公司 Ultrathin strippable composite copper foil and preparation method thereof
US12457686B2 (en) 2021-03-29 2025-10-28 Mitsui Mining & Smelting Co., Ltd. Roughened copper foil, copper-cladded laminate board, and printed wiring board
US12104265B2 (en) 2021-03-29 2024-10-01 Mitsui Mining & Smelting Co., Ltd. Roughened copper foil, copper-clad laminate and printed wiring board
JPWO2022244826A1 (en) 2021-05-20 2022-11-24
WO2022244828A1 (en) 2021-05-20 2022-11-24 三井金属鉱業株式会社 Roughened copper foil, copper foil with carrier, copper-clad laminate, and printed wiring board
KR20240009404A (en) 2021-05-20 2024-01-22 미쓰이금속광업주식회사 Roughened copper foil, copper foil with carrier, copper clad laminate and printed wiring board
CN115233262B (en) * 2022-08-01 2023-12-12 九江德福科技股份有限公司 Preparation method of extra-thin copper foil with carrier
TWI911566B (en) 2023-09-20 2026-01-11 南亞塑膠工業股份有限公司 Release carrier structure and copper foil composite structure
TWI883624B (en) * 2023-11-01 2025-05-11 南亞塑膠工業股份有限公司 Ultra-thin copper foil with carrier and manufacturing method thereof

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW432124B (en) * 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
JP3142270B2 (en) 1998-04-01 2001-03-07 三井金属鉱業株式会社 Manufacturing method of printed wiring board
JP4298943B2 (en) * 2001-10-18 2009-07-22 日鉱金属株式会社 Copper foil surface treatment agent
JP2005048277A (en) * 2003-07-15 2005-02-24 Mitsui Mining & Smelting Co Ltd Electrolytic copper foil with carrier foil and method for producing electrolytic copper foil with carrier foil
US20050158574A1 (en) * 2003-11-11 2005-07-21 Furukawa Circuit Foil Co., Ltd. Ultra-thin copper foil with carrier and printed wiring board using ultra-thin copper foil with carrier
JP4087369B2 (en) * 2003-11-11 2008-05-21 古河サーキットフォイル株式会社 Ultra-thin copper foil with carrier and printed wiring board
TW200738913A (en) * 2006-03-10 2007-10-16 Mitsui Mining & Smelting Co Surface treated elctrolytic copper foil and process for producing the same
JP5256747B2 (en) * 2008-01-21 2013-08-07 宇部興産株式会社 Manufacturing method of copper wiring insulating film by semi-additive method, and copper wiring insulating film manufactured therefrom
JP6219034B2 (en) * 2010-10-06 2017-10-25 古河電気工業株式会社 Copper foil and manufacturing method thereof, copper foil with carrier and manufacturing method thereof, printed wiring board, multilayer printed wiring board
KR102116928B1 (en) * 2013-02-28 2020-05-29 미쓰이금속광업주식회사 Blackened surface-treated copper foil, method for manufacturing blackened surface-treated copper foil, copper-clad laminate and flexible printed circuit board
JP6403969B2 (en) * 2013-03-29 2018-10-10 Ｊｘ金属株式会社 Copper foil with carrier, printed wiring board, copper-clad laminate, electronic device, and method for manufacturing printed wiring board

Also Published As

Publication number Publication date
TW201636457A (en) 2016-10-16
WO2016117587A1 (en) 2016-07-28
JP2018138702A (en) 2018-09-06
CN107002265A (en) 2017-08-01
CN110072334B (en) 2022-04-01
TWI572747B (en) 2017-03-01
JP6352449B2 (en) 2018-07-04
JP6529640B2 (en) 2019-06-12
CN110072334A (en) 2019-07-30
CN107002265B (en) 2019-04-26
KR20170057327A (en) 2017-05-24
KR102031065B1 (en) 2019-10-11
KR101929844B1 (en) 2018-12-17
KR20180135105A (en) 2018-12-19
JPWO2016117587A1 (en) 2017-07-06

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