MY187307A - Tape for semiconductor processing - Google Patents

Tape for semiconductor processing

Info

Publication number
MY187307A
MY187307A MYPI2019003947A MYPI2019003947A MY187307A MY 187307 A MY187307 A MY 187307A MY PI2019003947 A MYPI2019003947 A MY PI2019003947A MY PI2019003947 A MYPI2019003947 A MY PI2019003947A MY 187307 A MY187307 A MY 187307A
Authority
MY
Malaysia
Prior art keywords
tape
semiconductor processing
temporary adhesive
measured
value
Prior art date
Application number
MYPI2019003947A
Inventor
Kosuke Hashimoto
Akira Sendai
Toru Sano
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Publication of MY187307A publication Critical patent/MY187307A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)

Abstract

A tape for semiconductor processing that can be caused to shrink by heating sufficiently in a short time period and can retain a kerf width is provided. A tape for semiconductor processing 10 of the invention includes a temporary adhesive tape 15 having a substrate film 11; and a temporary adhesive layer 12 formed on at least one surface side of the substrate film 11, in which regarding the temporary adhesive tape 15, the sum of the average value of the differential value of the thermal deformation rate in the MD direction per 1?C between 40?C and 80?C measured at the time of raising temperature by means of a thermomechanical characteristics testing machine, and the average value of the differential value of the thermal deformation rate in the TD direction per 1?C between 40?C and 80?C measured at the time of raising temperature by means of a thermomechanical characteristics testing machine, is a negative value.
MYPI2019003947A 2018-03-28 2018-07-18 Tape for semiconductor processing MY187307A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018061062 2018-03-28
PCT/JP2018/026882 WO2019187186A1 (en) 2018-03-28 2018-07-18 Tape for semiconductor processing

Publications (1)

Publication Number Publication Date
MY187307A true MY187307A (en) 2021-09-21

Family

ID=68059692

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2019003947A MY187307A (en) 2018-03-28 2018-07-18 Tape for semiconductor processing

Country Status (8)

Country Link
JP (2) JP6535138B1 (en)
KR (1) KR102112771B1 (en)
CN (1) CN110546736B (en)
BR (1) BR112019019520B1 (en)
MY (1) MY187307A (en)
SG (1) SG11201906507PA (en)
TW (1) TWI694508B (en)
WO (1) WO2019187186A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7269096B2 (en) * 2019-05-29 2023-05-08 古河電気工業株式会社 glass processing tape
CN114599517B (en) * 2019-10-23 2024-10-01 琳得科株式会社 Film for forming protective film, composite sheet for forming protective film, and method for producing small sheet with protective film
JP7622367B2 (en) * 2020-07-08 2025-01-28 株式会社レゾナック Dicing/die bonding integrated film, die bonding film, and method for manufacturing semiconductor device

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2521459B2 (en) * 1987-02-23 1996-08-07 日東電工株式会社 Method of manufacturing semiconductor chip
JP4757442B2 (en) * 1997-02-10 2011-08-24 リンテック株式会社 Chip body adhesive sheet
JP4358502B2 (en) 2002-03-12 2009-11-04 浜松ホトニクス株式会社 Semiconductor substrate cutting method
JP2003342393A (en) * 2002-05-30 2003-12-03 Mitsubishi Polyester Film Copp Polyester soft film for dicing tape
JP2004273895A (en) 2003-03-11 2004-09-30 Disco Abrasive Syst Ltd Method of dividing semiconductor wafer
KR20050118302A (en) * 2003-04-08 2005-12-16 데이진 듀폰 필름 가부시키가이샤 Base film for semiconductor wafer processing
JP4754278B2 (en) 2005-06-23 2011-08-24 リンテック株式会社 Chip body manufacturing method
JP5554118B2 (en) * 2010-03-31 2014-07-23 古河電気工業株式会社 Wafer processing tape
JP2012174945A (en) * 2011-02-23 2012-09-10 Furukawa Electric Co Ltd:The Semiconductor wafer processing method
JP5801584B2 (en) 2011-03-29 2015-10-28 リンテック株式会社 Dicing tape and chip-shaped part manufacturing method
KR101903312B1 (en) * 2012-12-26 2018-10-01 히타치가세이가부시끼가이샤 Expansion method, method for manufacturing semiconductor devices, and semiconductor device
JP6021263B2 (en) * 2013-01-29 2016-11-09 日東電工株式会社 Adhesive tape
JP5855034B2 (en) * 2013-02-18 2016-02-09 古河電気工業株式会社 Adhesive tape for semiconductor wafer processing and method for dividing semiconductor wafer
JP6295135B2 (en) 2014-04-24 2018-03-14 日東電工株式会社 Dicing die bond film
JP6230730B2 (en) * 2015-03-24 2017-11-15 古河電気工業株式会社 Semiconductor processing tape
JP2017147293A (en) * 2016-02-16 2017-08-24 日立化成株式会社 Method for manufacturing semiconductor device by use of adhesive sheet and dicing tape
JP6429824B2 (en) * 2016-03-31 2018-11-28 古河電気工業株式会社 Electronic device packaging tape

Also Published As

Publication number Publication date
JP6535138B1 (en) 2019-06-26
JP2019176159A (en) 2019-10-10
CN110546736A (en) 2019-12-06
SG11201906507PA (en) 2019-11-28
JP7129375B2 (en) 2022-09-01
WO2019187186A1 (en) 2019-10-03
KR20190113748A (en) 2019-10-08
CN110546736B (en) 2020-10-16
KR102112771B1 (en) 2020-05-19
BR112019019520A2 (en) 2020-06-09
BR112019019520B1 (en) 2021-03-16
TWI694508B (en) 2020-05-21
TW201942963A (en) 2019-11-01
JPWO2019187186A1 (en) 2020-04-30

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