MY200333A - Photosensitive resin composition - Google Patents

Photosensitive resin composition

Info

Publication number
MY200333A
MY200333A MYUI2021001391A MYUI2021001391A MY200333A MY 200333 A MY200333 A MY 200333A MY UI2021001391 A MYUI2021001391 A MY UI2021001391A MY UI2021001391 A MYUI2021001391 A MY UI2021001391A MY 200333 A MY200333 A MY 200333A
Authority
MY
Malaysia
Prior art keywords
photosensitive resin
resin composition
copper
pattern
laminated
Prior art date
Application number
MYUI2021001391A
Inventor
Kazuya Naito
Yuri Yamada
Junya Kosaka
Original Assignee
Asahi Chemical Ind
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Ind filed Critical Asahi Chemical Ind
Publication of MY200333A publication Critical patent/MY200333A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/02—Monomers containing only one unsaturated aliphatic radical
    • C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
    • C08F212/06—Hydrocarbons
    • C08F212/08—Styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/04—Acids; Metal salts or ammonium salts thereof
    • C08F220/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/106—Esters of polycondensation macromers
    • C08F222/1063—Esters of polycondensation macromers of alcohol terminated polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F285/00—Macromolecular compounds obtained by polymerising monomers on to preformed graft polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)

Abstract

A photosensitive resin composition containing an alkali-soluble polymer, a compound having an ethylenic double bond, and a photopolymerization initiator, wherein the photosensitive resin composition is characterized in that: a photosensitive resin layer comprising the photosensitive resin composition is laminated to a thickness of 25 m onto a copper-clad laminated plate laminated with 18-m-thick copper foil; a cured resist pattern is formed through light irradiation in a pattern where the line/space ratio is 50 m/30 m and a development treatment; and a copper etching process is performed for 55 seconds at 50C, whereupon the bottom width of the copper line pattern obtained by removing the cured resist pattern is 38 m or greater.
MYUI2021001391A 2015-09-11 2016-09-07 Photosensitive resin composition MY200333A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2015179888 2015-09-11
JP2015195984 2015-10-01
JP2015199434 2015-10-07
JP2015218912 2015-11-06
JP2015257519 2015-12-28

Publications (1)

Publication Number Publication Date
MY200333A true MY200333A (en) 2023-12-20

Family

ID=58239851

Family Applications (3)

Application Number Title Priority Date Filing Date
MYUI2021001392A MY199738A (en) 2015-09-11 2016-09-07 Photosensitive resin composition
MYUI2018700667A MY186932A (en) 2015-09-11 2016-09-07 Photosensitive resin composition
MYUI2021001391A MY200333A (en) 2015-09-11 2016-09-07 Photosensitive resin composition

Family Applications Before (2)

Application Number Title Priority Date Filing Date
MYUI2021001392A MY199738A (en) 2015-09-11 2016-09-07 Photosensitive resin composition
MYUI2018700667A MY186932A (en) 2015-09-11 2016-09-07 Photosensitive resin composition

Country Status (6)

Country Link
JP (3) JP6514346B2 (en)
KR (3) KR20180042842A (en)
CN (3) CN120044756A (en)
MY (3) MY199738A (en)
TW (3) TWI709815B (en)
WO (1) WO2017043544A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6809873B2 (en) * 2015-12-28 2021-01-06 旭化成株式会社 Laminate
JP2019133143A (en) * 2018-01-30 2019-08-08 旭化成株式会社 Photosensitive resin laminate and method for manufacturing resist pattern
CN108205240B (en) * 2018-02-01 2021-05-07 浙江福斯特新材料研究院有限公司 Photosensitive resin composition with high photosensitivity and excellent hole masking performance and application thereof
KR102655468B1 (en) * 2018-06-22 2024-04-05 아사히 가세이 가부시키가이샤 Photosensitive resin composition and method of forming resist pattern
JP7422664B2 (en) * 2018-08-09 2024-01-26 旭化成株式会社 Photosensitive resin composition and resist pattern formation method
JP2020076945A (en) * 2018-09-21 2020-05-21 旭化成株式会社 Photosensitive resin composition
WO2021049241A1 (en) * 2019-09-13 2021-03-18 旭化成株式会社 Photosensitive resin composition and photosensitive element
KR20250009559A (en) * 2019-11-11 2025-01-17 아사히 가세이 가부시키가이샤 Photosensitive resin composition and photosensitive resin multilayer body
JP7769468B2 (en) * 2019-12-13 2025-11-13 旭化成株式会社 Photosensitive resin composition, transfer film using photosensitive resin composition
CN115485621B (en) * 2020-04-28 2026-02-03 富士胶片株式会社 Photosensitive transfer material, method for producing resin pattern, method for producing circuit wiring, and method for producing touch panel
JP2020190735A (en) * 2020-07-14 2020-11-26 旭化成株式会社 Photosensitive resin composition, photosensitive resin laminate, resist pattern forming method and conductor pattern manufacturing method
TWI818456B (en) * 2021-03-05 2023-10-11 日商旭化成股份有限公司 Photosensitive resin laminate and manufacturing method thereof
JP7631907B2 (en) 2021-03-08 2025-02-19 株式会社レゾナック Method for producing photosensitive resin film, photosensitive element, and laminate
WO2023073799A1 (en) * 2021-10-26 2023-05-04 株式会社レゾナック Photosensitive resin composition, photosensitive element, and laminate production method
KR102882784B1 (en) * 2022-03-31 2025-11-06 아사히 가세이 가부시키가이샤 Photosensitive resin composition and photosensitive element

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4646759B2 (en) * 2005-09-20 2011-03-09 旭化成イーマテリアルズ株式会社 Pattern forming material, pattern forming apparatus and pattern forming method
JP4761909B2 (en) * 2005-10-05 2011-08-31 旭化成イーマテリアルズ株式会社 Photosensitive resin composition and laminate
JP2007226158A (en) * 2006-02-27 2007-09-06 Asahi Kasei Electronics Co Ltd Dry film resist
CN101568883B (en) * 2006-12-27 2012-01-18 日立化成工业株式会社 Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing printed circuit board
JP2008197160A (en) * 2007-02-08 2008-08-28 Hitachi Chem Co Ltd Photosensitive resin composition for interlayer insulation film of semiconductor device, interlayer insulation film using the same and method for manufacturing interlayer insulation film
CN101779165B (en) 2007-08-15 2014-09-24 旭化成电子材料株式会社 Photosensitive resin composition and laminate thereof
JP2011233769A (en) 2010-04-28 2011-11-17 Mec Co Ltd Method for forming copper wiring pattern
CN106918991A (en) * 2010-07-13 2017-07-04 日立化成工业株式会社 Photosensitive element, the forming method of corrosion-resisting pattern, the manufacture method of printed circuit board and printed circuit board
KR101444044B1 (en) * 2010-12-16 2014-09-23 히타치가세이가부시끼가이샤 Photosensitive element, method for forming resist pattern, and method for producing printed circuit board
MY179988A (en) * 2010-12-24 2020-11-19 Asahi Kasei E Mat Corporation Photosensitive resin composition
JP2012226254A (en) * 2011-04-22 2012-11-15 Asahi Kasei E-Materials Corp Dry film resist roll
JP6064480B2 (en) 2011-10-26 2017-01-25 日立化成株式会社 Photosensitive resin composition, photosensitive element, resist pattern forming method and printed wiring board manufacturing method
JP6113976B2 (en) 2012-08-29 2017-04-12 旭化成株式会社 Photosensitive resin composition
JP2014182305A (en) * 2013-03-19 2014-09-29 Hitachi Chemical Co Ltd Photosensitive resin composition, photosensitive element, method for manufacturing substrate with resist pattern, and method for manufacturing printed wiring board
JP5673763B2 (en) * 2013-09-17 2015-02-18 日立化成株式会社 Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method
JP6207943B2 (en) * 2013-09-19 2017-10-04 旭化成株式会社 Photosensitive resin composition and photosensitive resin laminate
JP6486672B2 (en) * 2013-12-20 2019-03-20 旭化成株式会社 Photosensitive element and manufacturing method thereof
US10104781B2 (en) 2013-12-27 2018-10-16 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board
JP2015152854A (en) * 2014-02-18 2015-08-24 旭化成イーマテリアルズ株式会社 Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern
US10338468B2 (en) * 2014-09-24 2019-07-02 Asahi Kasei Kabushiki Kaisha Photosensitive resin composition, photosensitive resin laminate, resin pattern production method, cured film, and display device
US20180051183A1 (en) * 2016-08-17 2018-02-22 Xerox Corporation Seven-color ink set for a digital advanced lithographic imaging process

Also Published As

Publication number Publication date
TW201843527A (en) 2018-12-16
KR20180042842A (en) 2018-04-26
CN108027559A (en) 2018-05-11
JP7340581B2 (en) 2023-09-07
TWI684067B (en) 2020-02-01
KR102600211B1 (en) 2023-11-08
MY186932A (en) 2021-08-26
CN120044756A (en) 2025-05-27
KR102443749B1 (en) 2022-09-15
WO2017043544A1 (en) 2017-03-16
CN114296315B (en) 2025-09-05
TWI691793B (en) 2020-04-21
TW201712433A (en) 2017-04-01
CN108027559B (en) 2021-10-26
JP2022027767A (en) 2022-02-14
CN114296315A (en) 2022-04-08
JP6514346B2 (en) 2019-05-15
JP7026606B2 (en) 2022-02-28
JPWO2017043544A1 (en) 2018-03-15
MY199738A (en) 2023-11-21
JP2019105841A (en) 2019-06-27
KR20220127382A (en) 2022-09-19
TWI709815B (en) 2020-11-11
TW201944171A (en) 2019-11-16
KR20190105142A (en) 2019-09-11

Similar Documents

Publication Publication Date Title
MY200333A (en) Photosensitive resin composition
MY199471A (en) Photosensitive resin composition
MY198993A (en) Photosensitive resin composition and method for forming circuit pattern
MY174577A (en) Photosensitive resin composition and photosensitive resin laminate
MY196431A (en) Photosensitive Element, Resin Composition For Forming Barrier Layer, Method For Forming Resist Pattern, And Method For Producing Printed Wiring Board
MY197618A (en) Photosensitive resin laminate and method for producing resist pattern
EP3348542A4 (en) COMPOUND, RESIN, PHOTOSENSITIVE RESIN COMPOSITION OR RADIATION-SENSITIVE COMPOSITION, PROCESS FOR FORMING PHOTOSENSITIVE RESIN PATTERN, PROCESS FOR PRODUCING AMORPHOUS FILM, MATERIAL FOR FORMING LITHOGRAPHIC UNDER-LAYER FILM, COMPOSITION FOR FORMING SUB-LAYER FILM LITHOGRAPHIC, METHOD FOR FORMING CIRCUIT PATTERN AND PURIFICATION METHOD
IL287442A (en) Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern forming method, and method for manufacturing electronic device
MY189073A (en) Photosensitive element, laminated body, method for forming resist pattern, and method for producing printed circuit board
EP3885378A4 (en) Actinic ray-sensitive or radiation-sensitive resin composition, resist film, pattern formation method, and production method for electronic device
TW201614369A (en) Pattern forming method, method for manufacturing electronic device, resist composition, and resist film
IN2014DN03390A (en)
EP2479614A4 (en) RADIATION-SENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PHOTOSENSITIVE RESIN PATTERN, POLYMER, AND POLYMERIZABLE COMPOUND
EP3257835A4 (en) Compound, resin, lithography underlayer film forming material, lithography underlayer film forming composition, lithography underlayer film, method for forming resist pattern, method for forming circuit pattern, and method for purifying compound or resin
MY176799A (en) Photosensitive resin element
EP3279179A4 (en) Compound, resin, and method for purifying same, underlayer film formation material for lithography, underlayer film forming composition, and underlayer film, and method for forming resist pattern and method for forming circuit pattern
BR112018013443A2 (en) continuous additive manufacturing methods
JP2017520915A5 (en)
PH12022550475B1 (en) Method of manufacturing cured film, photocurable resin composition, method of manufacturing laminate, and method of manufacturing semiconductor device
JP2014123630A5 (en)
TW201614368A (en) Pattern forming method, method for manufacturing electronic device, and electronic device
PH12022551233A1 (en) Pattern forming method, photocurable resin composition, method of manufacturing laminate, and method of manufacturing electronic device
TW201613440A (en) Double-sided metal foil laminate manufacturing method, printed circuit board manufacturing method, multi-layer laminate manufacturing method and multi-layer printed circuit board manufacturing method
MY193800A (en) Photosensitive resin laminate and method for manufacturing same
TW201612631A (en) Resin composition, film, blank mask, pattern forming method, method of manufacturing electronic device, and electronic device