MY207580A - Method for manufacturing multilayer wiring board - Google Patents
Method for manufacturing multilayer wiring boardInfo
- Publication number
- MY207580A MY207580A MYPI2020004383A MYPI2020004383A MY207580A MY 207580 A MY207580 A MY 207580A MY PI2020004383 A MYPI2020004383 A MY PI2020004383A MY PI2020004383 A MYPI2020004383 A MY PI2020004383A MY 207580 A MY207580 A MY 207580A
- Authority
- MY
- Malaysia
- Prior art keywords
- layer
- wiring board
- metal foil
- wiring
- forming
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A method of manufacturing a multi-layer wiring board (42) is provided that can quite effectively prevent perforation of an inner layer circuit by laser drilling, while achieving superior circuit adhesion. The method of manufacturing the multi-layer wiring board (42) includes: (a) stacking, in sequence, a first insulating layer (18) and a second metal foil (20) onto a first metal foil (16) to form a first laminate (22); (b) forming a second wiring layer (24); (c) stacking, in sequence, a second insulating layer (26) and a third metal foil (28) to form a second laminate (30); (d) forming a first via hole (32) and a second via hole (34); and (e) forming the multi-layer wiring board (42) including a first wiring layer (38), the second wiring layer (24), and a third wiring layer (40). At least one face, adjacent to the first insulating layer (18), of the second metal foil (20) has a laser reflectance of 80% or more at a wavelength of 10.6 m as measured with a Fourier-transform infrared spectrometer (FT-IR) and a density of peaks Spd of 7000 to 15000/mm2 as measured in accordance with ISO 25178.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018063193 | 2018-03-28 | ||
| JP2018183881 | 2018-09-28 | ||
| PCT/JP2019/012233 WO2019188836A1 (en) | 2018-03-28 | 2019-03-22 | Method for manufacturing multilayer wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY207580A true MY207580A (en) | 2025-03-05 |
Family
ID=68058980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2020004383A MY207580A (en) | 2018-03-28 | 2019-03-22 | Method for manufacturing multilayer wiring board |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6622444B1 (en) |
| KR (1) | KR102231993B1 (en) |
| CN (1) | CN111684869B (en) |
| MY (1) | MY207580A (en) |
| TW (1) | TWI703909B (en) |
| WO (1) | WO2019188836A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114039054A (en) * | 2021-10-29 | 2022-02-11 | 广州方邦电子股份有限公司 | Metal foil and preparation method thereof, negative electrode material applied to battery and battery |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3512624B2 (en) * | 1998-03-13 | 2004-03-31 | 三菱電機株式会社 | Laser processing apparatus and method for wiring board processing |
| JP2000165047A (en) * | 1998-11-26 | 2000-06-16 | Nippon Carbide Ind Co Inc | Manufacturing method of printed wiring board |
| JP2003060352A (en) * | 2001-08-08 | 2003-02-28 | Asahi Kasei Corp | Multilayer printed wiring board |
| JP4694349B2 (en) * | 2005-11-07 | 2011-06-08 | 日立ビアメカニクス株式会社 | Printed wiring board using laser processing and manufacturing method thereof |
| KR100797719B1 (en) * | 2006-05-10 | 2008-01-23 | 삼성전기주식회사 | Build-up printed circuit board manufacturing process |
| JP2008218489A (en) * | 2007-02-28 | 2008-09-18 | Sharp Corp | Manufacturing method of multilayer printed wiring board |
| JP4460013B2 (en) | 2008-08-22 | 2010-05-12 | 新光電気工業株式会社 | Wiring board manufacturing method |
| TWI434638B (en) * | 2010-07-29 | 2014-04-11 | 日月光半導體製造股份有限公司 | Circuit substrate process |
| CN103327741B (en) * | 2013-07-04 | 2016-03-02 | 江俊逢 | A kind of base plate for packaging based on 3D printing and manufacture method thereof |
| JP6305001B2 (en) * | 2013-10-15 | 2018-04-04 | Ｊｘ金属株式会社 | Copper foil, copper-clad laminate and flexible printed wiring board |
| CN105934307B (en) * | 2014-01-27 | 2018-04-27 | 三井金属矿业株式会社 | Roughening treatment copper foil, copper clad laminate and printed wiring board |
| MY193192A (en) * | 2014-06-03 | 2022-09-26 | Mitsui Mining & Smelting Co Ltd | Metal foil with releasing resin layer, and printed wiring board |
| MY186859A (en) * | 2016-04-14 | 2021-08-26 | Mitsui Mining & Smelting Co Ltd | Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same |
-
2019
- 2019-03-22 CN CN201980011459.2A patent/CN111684869B/en active Active
- 2019-03-22 JP JP2019548489A patent/JP6622444B1/en active Active
- 2019-03-22 WO PCT/JP2019/012233 patent/WO2019188836A1/en not_active Ceased
- 2019-03-22 KR KR1020207021006A patent/KR102231993B1/en active Active
- 2019-03-22 MY MYPI2020004383A patent/MY207580A/en unknown
- 2019-03-27 TW TW108110633A patent/TWI703909B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2019188836A1 (en) | 2020-04-30 |
| CN111684869B (en) | 2021-03-19 |
| TWI703909B (en) | 2020-09-01 |
| KR102231993B1 (en) | 2021-03-25 |
| KR20200091934A (en) | 2020-07-31 |
| CN111684869A (en) | 2020-09-18 |
| WO2019188836A1 (en) | 2019-10-03 |
| TW201943324A (en) | 2019-11-01 |
| JP6622444B1 (en) | 2019-12-18 |
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