MY205472A - Surface-treated copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board - Google Patents

Surface-treated copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board

Info

Publication number
MY205472A
MY205472A MYPI2021002226A MYPI2021002226A MY205472A MY 205472 A MY205472 A MY 205472A MY PI2021002226 A MYPI2021002226 A MY PI2021002226A MY PI2021002226 A MYPI2021002226 A MY PI2021002226A MY 205472 A MY205472 A MY 205472A
Authority
MY
Malaysia
Prior art keywords
copper foil
treated
copper
carrier
wiring board
Prior art date
Application number
MYPI2021002226A
Inventor
Mitsuyoshi Matsuda
Tsubasa Kato
Original Assignee
Mitsui Mining & Smelting Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co Ltd filed Critical Mitsui Mining & Smelting Co Ltd
Publication of MY205472A publication Critical patent/MY205472A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • H05K3/025—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

There is provided a surface-treated copper foil which, when it is used in an SAP, can provide a resin substrate with a surface profile that can effectively suppress the occurrence of penetration that may occur in a circuit in the step of etching an electroless copper plating layer. This surface-treated copper foil is a surface-treated copper foil having a treated surface on at least one side, wherein when a resin film is thermocompression-bonded to the treated surface to transfer the surface profile of the treated surface to a surface of the resin film, and the surface-treated copper foil is removed by etching, the surface of the resin film left has a skewness Ssk of -0.6 or less as measured in accordance with ISO 25178.
MYPI2021002226A 2018-11-19 2019-10-02 Surface-treated copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board MY205472A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018216720 2018-11-19
PCT/JP2019/038866 WO2020105289A1 (en) 2018-11-19 2019-10-02 Surface-treated copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board

Publications (1)

Publication Number Publication Date
MY205472A true MY205472A (en) 2024-10-22

Family

ID=70773985

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2021002226A MY205472A (en) 2018-11-19 2019-10-02 Surface-treated copper foil, carrier-attached copper foil, copper-clad laminate, and printed wiring board

Country Status (6)

Country Link
JP (1) JP7453154B2 (en)
KR (1) KR102802888B1 (en)
CN (1) CN112969824B (en)
MY (1) MY205472A (en)
TW (1) TWI740231B (en)
WO (1) WO2020105289A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2022255420A1 (en) * 2021-06-03 2022-12-08
US12060647B2 (en) 2021-07-06 2024-08-13 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil and copper clad laminate
US11540389B1 (en) 2021-07-06 2022-12-27 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil and copper clad laminate
TWI756155B (en) 2021-07-19 2022-02-21 長春石油化學股份有限公司 Surface-treated copper foil and copper clad laminate
EP4404280A4 (en) * 2021-09-14 2025-09-03 Kaneka Corp SOLAR CELL
CN113943954B (en) * 2021-12-01 2023-06-30 青海诺德新材料有限公司 Preparation method of 2-3 micron pinhole-free carrier electrolytic copper foil
WO2023190833A1 (en) 2022-03-30 2023-10-05 古河電気工業株式会社 Surface-treated copper foil, copper-clad laminate plate, and printed wiring board
WO2024070248A1 (en) * 2022-09-28 2024-04-04 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, and printed wiring board
CN120677846A (en) * 2023-03-23 2025-09-19 三井金属矿业株式会社 Method for manufacturing printed circuit board
JPWO2024195539A1 (en) * 2023-03-23 2024-09-26
CN120835943A (en) * 2023-03-27 2025-10-24 三菱综合材料株式会社 Copper terminal material with coating and manufacturing method thereof
WO2024203977A1 (en) * 2023-03-30 2024-10-03 宇部エクシモ株式会社 Flexible metal-clad laminate and method for manufacturing same
WO2024219160A1 (en) * 2023-03-30 2024-10-24 宇部エクシモ株式会社 Flexible metal-clad laminate plate and method for producing same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4538375B2 (en) * 2005-05-31 2010-09-08 日鉱金属株式会社 Metal materials for printed wiring boards
TWI482882B (en) * 2012-09-10 2015-05-01 Ｊｘ日鑛日石金屬股份有限公司 Surface treatment of copper foil and the use of its laminated board
TWI515342B (en) 2013-09-05 2016-01-01 三井金屬鑛業股份有限公司 Surface-treated copper foil, and copper clad laminate and printed wiring board obtained by using the same
JP6497881B2 (en) * 2013-10-04 2019-04-10 Ｊｘ金属株式会社 Rolled copper foil, copper-clad laminate using the same, printed wiring board, electronic equipment, circuit connecting member manufacturing method, and circuit connecting member
CN105814242B (en) * 2013-12-10 2018-08-10 Ｊｘ金属株式会社 Surface-treated copper foil, copper-clad laminate, printed wiring board, electronic device, and method for producing printed wiring board
MY186266A (en) * 2015-03-31 2021-07-01 Mitsui Mining & Smelting Co Ltd Roughened copper foil, copper foil provided with carrier, copper-clad laminated sheet, and printed wiring board
KR101895745B1 (en) * 2015-07-03 2018-09-05 미쓰이금속광업주식회사 Roughened copper foil, copper clad laminate and printed wiring board
MY186397A (en) * 2015-07-29 2021-07-22 Namics Corp Roughened copper foil, copper-clad laminate, and printed wiring board
WO2017179416A1 (en) 2016-04-14 2017-10-19 三井金属鉱業株式会社 Treated surface copper foil, copper foil with carrier as well as methods for manufacturing copper-clad laminate and printed circuit board using same
CN108696987B (en) * 2017-03-31 2021-11-30 Ｊｘ金属株式会社 Surface-treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device

Also Published As

Publication number Publication date
JP7453154B2 (en) 2024-03-19
TWI740231B (en) 2021-09-21
CN112969824B (en) 2024-10-18
JPWO2020105289A1 (en) 2021-09-30
CN112969824A (en) 2021-06-15
TW202020233A (en) 2020-06-01
KR102802888B1 (en) 2025-05-07
KR20210090608A (en) 2021-07-20
WO2020105289A1 (en) 2020-05-28

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