NL8800901A - Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie. - Google Patents

Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie. Download PDF

Info

Publication number
NL8800901A
NL8800901A NL8800901A NL8800901A NL8800901A NL 8800901 A NL8800901 A NL 8800901A NL 8800901 A NL8800901 A NL 8800901A NL 8800901 A NL8800901 A NL 8800901A NL 8800901 A NL8800901 A NL 8800901A
Authority
NL
Netherlands
Prior art keywords
semiconductor body
support
carrier
metal layer
combination
Prior art date
Application number
NL8800901A
Other languages
English (en)
Dutch (nl)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Priority to NL8800901A priority Critical patent/NL8800901A/nl
Priority to EP89200844A priority patent/EP0337540B1/de
Priority to DE68918741T priority patent/DE68918741T2/de
Priority to US07/334,063 priority patent/US4929999A/en
Priority to JP1084914A priority patent/JPH01310545A/ja
Publication of NL8800901A publication Critical patent/NL8800901A/nl
Priority to US07/468,679 priority patent/US5057458A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/681—Shapes or dispositions thereof comprising holes not having chips therein, e.g. for outgassing, underfilling or bond wire passage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Die Bonding (AREA)
NL8800901A 1988-04-08 1988-04-08 Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie. NL8800901A (nl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
NL8800901A NL8800901A (nl) 1988-04-08 1988-04-08 Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie.
EP89200844A EP0337540B1 (de) 1988-04-08 1989-04-03 Gefüge aus einem Träger und einem Halbleiterkörper und Verfahren zum Herstellen desselben
DE68918741T DE68918741T2 (de) 1988-04-08 1989-04-03 Gefüge aus einem Träger und einem Halbleiterkörper und Verfahren zum Herstellen desselben.
US07/334,063 US4929999A (en) 1988-04-08 1989-04-04 Combination of a support and a semiconductor body and method of manufacturing such a combination
JP1084914A JPH01310545A (ja) 1988-04-08 1989-04-05 半導体装置
US07/468,679 US5057458A (en) 1988-04-08 1990-01-23 Combination of a support and a semiconductor body and method of manufacturing such a combination

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL8800901A NL8800901A (nl) 1988-04-08 1988-04-08 Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie.
NL8800901 1988-04-08

Publications (1)

Publication Number Publication Date
NL8800901A true NL8800901A (nl) 1989-11-01

Family

ID=19852089

Family Applications (1)

Application Number Title Priority Date Filing Date
NL8800901A NL8800901A (nl) 1988-04-08 1988-04-08 Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie.

Country Status (5)

Country Link
US (2) US4929999A (de)
EP (1) EP0337540B1 (de)
JP (1) JPH01310545A (de)
DE (1) DE68918741T2 (de)
NL (1) NL8800901A (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0770806B2 (ja) * 1990-08-22 1995-07-31 株式会社エーユーイー研究所 超音波溶着による電子回路およびその製造方法
US5585282A (en) * 1991-06-04 1996-12-17 Micron Technology, Inc. Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor
US5385869A (en) * 1993-07-22 1995-01-31 Motorola, Inc. Semiconductor chip bonded to a substrate and method of making
US5478779A (en) 1994-03-07 1995-12-26 Micron Technology, Inc. Electrically conductive projections and semiconductor processing method of forming same
US5326428A (en) 1993-09-03 1994-07-05 Micron Semiconductor, Inc. Method for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability
DE4409068C2 (de) * 1994-03-14 1998-05-28 Hartmann & Braun Ag Bondverfahren und damit hergestellte Bondverbindung
DE4433689C2 (de) * 1994-09-21 1996-07-11 Siemens Ag Chipkonfiguration und Verwendung eines entsprechenden Chips
FR2738395B1 (fr) * 1995-08-31 1997-10-10 Commissariat Energie Atomique Dispositif autoporte pour la propagation d'ondes hyperfrequences et procedes de realisation d'un tel dispositif
JPH10270496A (ja) * 1997-03-27 1998-10-09 Hitachi Ltd 電子装置、情報処理装置、半導体装置並びに半導体チップの実装方法
FR2775810B1 (fr) * 1998-03-09 2000-04-28 Gemplus Card Int Procede de fabrication de cartes sans contact
US6078103A (en) * 1998-10-29 2000-06-20 Mcdonnell Douglas Corporation Dimpled contacts for metal-to-semiconductor connections, and methods for fabricating same
JP4159778B2 (ja) * 2001-12-27 2008-10-01 三菱電機株式会社 Ｉｃパッケージ、光送信器及び光受信器
US9076674B2 (en) * 2012-09-25 2015-07-07 Intermolecular, Inc. Method and apparatus for improving particle performance

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE45437C (de) * J. ROGGY in Saarlouis Sicherheitsgeldkasse
US2352640A (en) * 1942-11-03 1944-07-04 Fed Telephone & Radio Corp Plate rectifier
US3363308A (en) * 1962-07-30 1968-01-16 Texas Instruments Inc Diode contact arrangement
US3422320A (en) * 1965-12-23 1969-01-14 Gen Motors Corp Sealing technique for composite ferrous-copper base alloy capsules for semiconductor devices
US3492545A (en) * 1968-03-18 1970-01-27 Westinghouse Electric Corp Electrically and thermally conductive malleable layer embodying lead foil
US3611064A (en) * 1969-07-14 1971-10-05 Gen Electric Ohmic contact to n-type silicon carbide, comprising nickel-titanium-gold
GB1297046A (de) * 1969-08-25 1972-11-22
JPS538872B2 (de) * 1971-10-23 1978-04-01
US3888708A (en) * 1972-02-17 1975-06-10 Kensall D Wise Method for forming regions of predetermined thickness in silicon
GB1426874A (en) * 1972-05-03 1976-03-03 Mullard Ltd Method of sealing electrical component envelopes
US4024627A (en) * 1974-04-29 1977-05-24 Amp Incorporated Package mounting of electronic chips, such as light emitting diodes
NL7415668A (nl) * 1974-12-02 1976-06-04 Philips Nv Drukopnemer.
US4125820A (en) * 1975-10-06 1978-11-14 Honeywell Inc. Stress sensor apparatus
JPS53119693A (en) * 1977-03-29 1978-10-19 Toshiba Corp Semiconductor pressure transducer
US4185378A (en) * 1978-02-10 1980-01-29 Chuo Meiban Mfg. Co., LTD. Method for attaching component leads to printed circuit base boards and printed circuit base board advantageously used for working said method
US4754316A (en) * 1982-06-03 1988-06-28 Texas Instruments Incorporated Solid state interconnection system for three dimensional integrated circuit structures
JPS599976A (ja) * 1982-07-09 1984-01-19 Toshiba Corp 絶対圧形半導体圧力センサーの製造方法
DE3337173A1 (de) * 1983-10-12 1985-04-25 Siemens AG, 1000 Berlin und 8000 München Montage von halbleiterbauteilen auf einer traegerplatte
US4753601A (en) * 1983-10-14 1988-06-28 Amp Incorporated Circuit board thickness compensator
US4640438A (en) * 1986-03-17 1987-02-03 Comienco Limited Cover for semiconductor device packages
GB2194477A (en) * 1986-08-28 1988-03-09 Stc Plc Solder joint
EP0262580B1 (de) * 1986-09-25 1993-11-24 Kabushiki Kaisha Toshiba Verfahren zum elektrischen Verbinden von zwei Objekten
JPH07101747B2 (ja) * 1987-03-05 1995-11-01 日本電装株式会社 半導体圧力センサ
US4970624A (en) * 1990-01-22 1990-11-13 Molex Incorporated Electronic device employing a conductive adhesive

Also Published As

Publication number Publication date
EP0337540A1 (de) 1989-10-18
US4929999A (en) 1990-05-29
US5057458A (en) 1991-10-15
DE68918741D1 (de) 1994-11-17
DE68918741T2 (de) 1995-04-27
EP0337540B1 (de) 1994-10-12
JPH01310545A (ja) 1989-12-14

Similar Documents

Publication Publication Date Title
NL8800901A (nl) Combinatie van een drager en een halfgeleiderlichaam en werkwijze voor het vervaardigen van een dergelijke combinatie.
US4761518A (en) Ceramic-glass-metal packaging for electronic components incorporating unique leadframe designs
EP1056972B1 (de) Reflektor für kfz-äussere beleuchtung
NL8403755A (nl) Werkwijze voor de vervaardiging van een meerlaags gedrukte bedrading met doorverbonden sporen in verschillende lagen en meerlaags gedrukte bedrading vervaardigd volgens de werkwijze.
RU2003112617A (ru) Способ изготовления уплотнительного устройства (варианты)
GB2072249A (en) Corner connector for spacers for a double glazed unit
KR900011604A (ko) 무기상을 포함하는 복합재 및 이러한 상을 전달하는 방법
AU4949200A (en) Solid electrolytic capacitor and method of manufacture thereof
US5928455A (en) Method of making an electrical connection by gluing a rigid terminal to a conductive track, rigid terminal for use in the method and application to a heating receptacle heating plate
US5176441A (en) Lamp with a reflector envelope
US2552653A (en) Electrical condenser
US2776467A (en) Method of making a closure and terminal construction for electrolytic devices
US6759718B2 (en) Semiconductor package with a sensor having a fastening insert
US4277298A (en) Method of making a hollow article
NL8800902A (nl) Werkwijze voor het aanbrengen van een halfgeleiderlichaam op een drager.
TW202438812A (zh) 多重曲面物體的電熱片配置方法及配置結構
US5751105A (en) Assembly arrangement for a compact fluorescent lamp
JPS62190627A (ja) 部材間の機電接続方法とそれによる装置
US4509107A (en) Sealed beam lamp unit and method for an improved sealed exhaust hole
NL8602804A (nl) Werkwijze voor het aanbrengen van een aansluitdraad op een uiteinde van een condensator en condensator vervaardigd volgens die werkwijze.
US2611794A (en) Terminal assembly for electric-cell batteries
EP3768986A1 (de) Verfahren zur herstellung einer bremsbelaghalteplatte
JPS5918671Y2 (ja) 固体電解コンデンサ
GB2147289A (en) A method of bonding parts together
JPS6123970Y2 (de)

Legal Events

Date Code Title Description
A1B A search report has been drawn up
BV The patent application has lapsed