NO20003015L - Overflatemontering av RC-anordninger - Google Patents

Overflatemontering av RC-anordninger

Info

Publication number
NO20003015L
NO20003015L NO20003015A NO20003015A NO20003015L NO 20003015 L NO20003015 L NO 20003015L NO 20003015 A NO20003015 A NO 20003015A NO 20003015 A NO20003015 A NO 20003015A NO 20003015 L NO20003015 L NO 20003015L
Authority
NO
Norway
Prior art keywords
electrode pattern
layers
sintered body
outer ends
pattern extending
Prior art date
Application number
NO20003015A
Other languages
English (en)
Other versions
NO20003015D0 (no
Inventor
Andrew P Ritter
Andrew Blair
Maureen Strawhorne
Clare Ashley Moore
Ii Robert H Heistand
Original Assignee
Avx Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Avx Corp filed Critical Avx Corp
Publication of NO20003015D0 publication Critical patent/NO20003015D0/no
Publication of NO20003015L publication Critical patent/NO20003015L/no

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/40Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C13/00Resistors not provided for elsewhere
    • H01C13/02Structural combinations of resistors
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H1/02RC networks, e.g. filters
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03HIMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021Constructional details
    • H03H2001/0085Multilayer, e.g. LTCC, HTCC, green sheets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3442Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Thermistors And Varistors (AREA)
  • Electron Tubes For Measurement (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Connection Of Batteries Or Terminals (AREA)

Abstract

Det er beskrevet både separate og gruppesammenstilte RC-komponenter som utnytter saminnbrennbart motstandsmaterial som en del av indre elektroder i anordningen. Disse anordninger omfatter et sintret legeme av flerlags keramikkmaterial og hvori flere første og andre elektrodelag er stakket. Hvert av de første lag omfatter minst ett motstandsgivende elektrodemønster som strekker seg tvers over det sintrede legemet mellom tilsvarende endekontaktpar. De andre lag omfatter et elektrodemønster som strekker seg på tvers av det motstandsgivende elektrodemønster, og da mellom endekontakter på ytterendene. I visse utførelser tjener motstående sideelektroder som inngangs- og utgangsklemmer for et tilhørende gjennomgangsfilter. I et gjenomløpsairangement kan den tredje klemmen utgjøres av den ene av eller begge endekontaktene på ytterendene. I henhold til oppfinnelsen beskrives også en forbedret endekontaktstruktur som omfatter et sjikt fremstilt fra et metalloksidmaterial.
NO20003015A 1999-06-18 2000-06-13 Overflatemontering av RC-anordninger NO20003015L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/335,991 US6525628B1 (en) 1999-06-18 1999-06-18 Surface mount RC array with narrow tab portions on each of the electrode plates

Publications (2)

Publication Number Publication Date
NO20003015D0 NO20003015D0 (no) 2000-06-13
NO20003015L true NO20003015L (no) 2000-12-19

Family

ID=23314104

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20003015A NO20003015L (no) 1999-06-18 2000-06-13 Overflatemontering av RC-anordninger

Country Status (8)

Country Link
US (4) US6525628B1 (no)
EP (1) EP1061535A3 (no)
JP (1) JP2001044076A (no)
KR (1) KR20010021003A (no)
CN (1) CN1279533A (no)
NO (1) NO20003015L (no)
SG (1) SG98405A1 (no)
TW (1) TW452808B (no)

Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7336468B2 (en) 1997-04-08 2008-02-26 X2Y Attenuators, Llc Arrangement for energy conditioning
US6894884B2 (en) 1997-04-08 2005-05-17 Xzy Attenuators, Llc Offset pathway arrangements for energy conditioning
US6603646B2 (en) 1997-04-08 2003-08-05 X2Y Attenuators, Llc Multi-functional energy conditioner
US7110235B2 (en) 1997-04-08 2006-09-19 Xzy Altenuators, Llc Arrangement for energy conditioning
US9054094B2 (en) 1997-04-08 2015-06-09 X2Y Attenuators, Llc Energy conditioning circuit arrangement for integrated circuit
US7336467B2 (en) 2000-10-17 2008-02-26 X2Y Attenuators, Llc Energy pathway arrangement
US7042703B2 (en) 2000-03-22 2006-05-09 X2Y Attenuators, Llc Energy conditioning structure
US6650525B2 (en) 1997-04-08 2003-11-18 X2Y Attenuators, Llc Component carrier
US20030161086A1 (en) 2000-07-18 2003-08-28 X2Y Attenuators, Llc Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
US7321485B2 (en) 1997-04-08 2008-01-22 X2Y Attenuators, Llc Arrangement for energy conditioning
US7301748B2 (en) 1997-04-08 2007-11-27 Anthony Anthony A Universal energy conditioning interposer with circuit architecture
US6606011B2 (en) 1998-04-07 2003-08-12 X2Y Attenuators, Llc Energy conditioning circuit assembly
US7274549B2 (en) 2000-12-15 2007-09-25 X2Y Attenuators, Llc Energy pathway arrangements for energy conditioning
US6954346B2 (en) 1997-04-08 2005-10-11 Xzy Attenuators, Llc Filter assembly
US7110227B2 (en) 1997-04-08 2006-09-19 X2Y Attenuators, Llc Universial energy conditioning interposer with circuit architecture
US7106570B2 (en) 1997-04-08 2006-09-12 Xzy Altenuators, Llc Pathway arrangement
US6018448A (en) 1997-04-08 2000-01-25 X2Y Attenuators, L.L.C. Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
DE69937677T2 (de) 1998-04-07 2008-11-20 X2Y Attenuators, L.L.C. Bauelementeträger
US7427816B2 (en) 1998-04-07 2008-09-23 X2Y Attenuators, Llc Component carrier
US7113383B2 (en) 2000-04-28 2006-09-26 X2Y Attenuators, Llc Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning
US7262949B2 (en) 2000-08-15 2007-08-28 X2Y Attenuators, Llc Electrode arrangement for circuit energy conditioning
US7193831B2 (en) 2000-10-17 2007-03-20 X2Y Attenuators, Llc Energy pathway arrangement
US7433168B2 (en) 2000-10-17 2008-10-07 X2Y Attenuators, Llc Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
DE10202915A1 (de) * 2002-01-25 2003-08-21 Epcos Ag Elektrokeramisches Bauelement mit Innenelektroden
US7075774B2 (en) * 2002-09-10 2006-07-11 Tdk Corporation Multilayer capacitor
US7180718B2 (en) 2003-01-31 2007-02-20 X2Y Attenuators, Llc Shielded energy conditioner
CN1799112A (zh) * 2003-04-08 2006-07-05 阿维科斯公司 电镀端头
EP1629582A2 (en) 2003-05-29 2006-03-01 X2Y Attenuators, L.L.C. Connector related structures including an energy conditioner
EP1698033A4 (en) 2003-12-22 2010-07-21 X2Y Attenuators Llc INTERNAL SHIELDED ENERGY PREPARATION
US20050180091A1 (en) * 2004-01-13 2005-08-18 Avx Corporation High current feedthru device
DE102004016146B4 (de) * 2004-04-01 2006-09-14 Epcos Ag Elektrisches Vielschichtbauelement
WO2006093831A2 (en) 2005-03-01 2006-09-08 X2Y Attenuators, Llc Energy conditioner with tied through electrodes
US7630188B2 (en) 2005-03-01 2009-12-08 X2Y Attenuators, Llc Conditioner with coplanar conductors
US7586728B2 (en) 2005-03-14 2009-09-08 X2Y Attenuators, Llc Conditioner with coplanar conductors
US20060229188A1 (en) * 2005-04-07 2006-10-12 Randall Michael S C0G multi-layered ceramic capacitor
US7923395B2 (en) * 2005-04-07 2011-04-12 Kemet Electronics Corporation C0G multi-layered ceramic capacitor
US20070119911A1 (en) * 2005-11-28 2007-05-31 Chan Su L Method of forming a composite standoff on a circuit board
EP1991996A1 (en) 2006-03-07 2008-11-19 X2Y Attenuators, L.L.C. Energy conditioner structures
CN100545875C (zh) * 2006-09-15 2009-09-30 财团法人工业技术研究院 电动车辆电源管理系统及其方法
US8493744B2 (en) * 2007-04-03 2013-07-23 Tdk Corporation Surface mount devices with minimum lead inductance and methods of manufacturing the same
KR100916480B1 (ko) * 2007-12-20 2009-09-08 삼성전기주식회사 적층 세라믹 캐패시터
US20090236692A1 (en) * 2008-03-24 2009-09-24 Sheng-Fu Su Rc filtering device having air gap construction for over voltage protection
JP2015109409A (ja) 2013-10-25 2015-06-11 株式会社村田製作所 電子部品
KR102048100B1 (ko) * 2014-11-04 2019-12-02 삼성전기주식회사 적층 칩 전자부품 및 그 실장 기판
US10033346B2 (en) 2015-04-20 2018-07-24 Avx Corporation Wire-bond transmission line RC circuit
US9866193B2 (en) 2015-04-20 2018-01-09 Avx Corporation Parallel RC circuit equalizers
US10734159B2 (en) * 2016-12-22 2020-08-04 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor
TW201927091A (zh) * 2017-12-08 2019-07-01 和碩聯合科技股份有限公司 表面黏著元件
CN108365308B (zh) * 2018-02-05 2020-04-21 重庆思睿创瓷电科技有限公司 介质波导滤波器及其贴装方法

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2405515A (en) 1944-09-23 1946-08-06 Philco Radio & Television Corp Amplifier coupling device
US2828454A (en) 1950-02-11 1958-03-25 Globe Union Inc Ceramic capacitor
US2694185A (en) 1951-01-19 1954-11-09 Sprague Electric Co Electrical circuit arrangement
US2779975A (en) 1955-01-19 1957-02-05 Vitramon Inc Methods for making composite electric circuit components
US3002137A (en) 1957-09-04 1961-09-26 Sprague Electric Co Voltage dependent ceramic capacitor
US3256588A (en) 1962-10-23 1966-06-21 Philco Corp Method of fabricating thin film r-c circuits on single substrate
US3544925A (en) 1965-08-31 1970-12-01 Vitramon Inc Solid-state electrical component with capacitance defeating resistor arrangement
US3490055A (en) 1967-01-16 1970-01-13 Microtek Electronics Inc Circuit structure with capacitor
US3619220A (en) 1968-09-26 1971-11-09 Sprague Electric Co Low temperature fired, glass bonded, dielectric ceramic body and method
US3569872A (en) 1968-11-27 1971-03-09 Vitramon Inc Electronic component
US3569795A (en) 1969-05-29 1971-03-09 Us Army Voltage-variable, ferroelectric capacitor
DE2222546C3 (de) 1972-05-08 1979-10-31 Siemens Ag, 1000 Berlin Und 8000 Muenchen Elektrisches RC-Bauelement
US3896354A (en) 1974-07-02 1975-07-22 Sprague Electric Co Monolithic ceramic capacitor
US4453199A (en) 1983-06-17 1984-06-05 Avx Corporation Low cost thin film capacitor
JPS62194607A (ja) 1986-02-20 1987-08-27 株式会社村田製作所 セラミックコンデンサ
GB2197540B (en) 1986-11-12 1991-04-17 Murata Manufacturing Co A circuit structure.
JPH0635462Y2 (ja) 1988-08-11 1994-09-14 株式会社村田製作所 積層型コンデンサ
US5258335A (en) 1988-10-14 1993-11-02 Ferro Corporation Low dielectric, low temperature fired glass ceramics
JP2790640B2 (ja) 1989-01-14 1998-08-27 ティーディーケイ株式会社 混成集積回路部品の構造
JP2852372B2 (ja) 1989-07-07 1999-02-03 株式会社村田製作所 積層セラミックコンデンサ
JPH0373421U (no) * 1989-07-20 1991-07-24
MY105486A (en) 1989-12-15 1994-10-31 Tdk Corp A multilayer hybrid circuit.
JPH0453219A (ja) 1990-06-20 1992-02-20 Murata Mfg Co Ltd 表面実装型電子部品
US5093774A (en) 1991-03-22 1992-03-03 Thomas & Betts Corporation Two-terminal series-connected network
US5495387A (en) 1991-08-09 1996-02-27 Murata Manufacturing Co., Ltd. RC array
JPH05283283A (ja) 1992-03-31 1993-10-29 Mitsubishi Materials Corp チップ型cr複合素子及びその製造方法
JPH05326317A (ja) * 1992-05-26 1993-12-10 Tama Electric Co Ltd 積層セラミックス素子
US5312674A (en) 1992-07-31 1994-05-17 Hughes Aircraft Company Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer
US5227951A (en) 1992-08-04 1993-07-13 Murata Erie North America, Inc. Composite multilayer capacitive device and method for fabricating the same
US5430605A (en) 1992-08-04 1995-07-04 Murata Erie North America, Inc. Composite multilayer capacitive device and method for fabricating the same
US5530722A (en) 1992-10-27 1996-06-25 Ericsson Ge Mobile Communications Inc. Quadrature modulator with integrated distributed RC filters
JPH06267789A (ja) 1993-03-12 1994-09-22 Rohm Co Ltd 積層チップ型c・r複合電子部品
WO1996006459A1 (en) 1994-08-25 1996-02-29 National Semiconductor Corporation Component stacking in multi-chip semiconductor packages
JPH097877A (ja) 1995-04-18 1997-01-10 Rohm Co Ltd 多層セラミックチップ型コンデンサ及びその製造方法
US5880925A (en) * 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
US5889445A (en) 1997-07-22 1999-03-30 Avx Corporation Multilayer ceramic RC device
US5897912A (en) * 1997-09-03 1999-04-27 Ferro Corporation Method of making conductive electrodes for use in multilayer ceramic capacitors or inductors using organometallic ink

Also Published As

Publication number Publication date
KR20010021003A (ko) 2001-03-15
US20020011905A1 (en) 2002-01-31
US20020041219A1 (en) 2002-04-11
NO20003015D0 (no) 2000-06-13
EP1061535A3 (en) 2005-06-15
JP2001044076A (ja) 2001-02-16
SG98405A1 (en) 2003-09-19
TW452808B (en) 2001-09-01
CN1279533A (zh) 2001-01-10
US20020044029A1 (en) 2002-04-18
US6525628B1 (en) 2003-02-25
EP1061535A2 (en) 2000-12-20

Similar Documents

Publication Publication Date Title
NO20003015L (no) Overflatemontering av RC-anordninger
JP5275338B2 (ja) 電気的に接続しない保護構造体を有する電気的な積層素子
US7495884B2 (en) Multilayer capacitor
KR101630040B1 (ko) 적층 세라믹 커패시터 및 그 실장기판
KR101401269B1 (ko) 관통 콘덴서 어레이
KR101514604B1 (ko) 적층 세라믹 커패시터 및 그 실장 기판
ATE222404T1 (de) Aussenelektrode für einen monolithischen vielschichtaktor
DE50106829D1 (de) Elektrisches vielschichtbauelement und entstörschaltung mit dem bauelement
US7995325B2 (en) Multilayer capacitor
CN102318019B (zh) 电多层器件和具有该电多层器件的电路装置
CN100490025C (zh) 多层电气元件
US8250747B2 (en) Method of mounting capacitor array
US20150236238A1 (en) Elastic wave element and ladder filter using same
US7265964B1 (en) Multilayer feedthrough capacitor array
US7675732B2 (en) Multilayer capacitor array
KR20170028700A (ko) 적층형 전자 부품 및 그 실장 기판
US8098477B2 (en) Feedthrough multilayer capacitor with capacitance components connected in parallel
JP4266380B2 (ja) 積層型フィルタ
CN100570946C (zh) 电路装置和使用于该电路装置的基板
KR20160072605A (ko) 회로 보호 소자
JP5304998B2 (ja) サージアブソーバ及びその製造方法
US7646578B2 (en) Filter circuit and filter device
ATE510289T1 (de) Elektrisches bauelement und schaltungsanordnung
JPH11307392A (ja) 積層型差動伝送線路
JP4650807B2 (ja) 積層コンデンサ