NO20005777L - Fremgangsmåte for elektro-forkobring av substrater - Google Patents

Fremgangsmåte for elektro-forkobring av substrater

Info

Publication number
NO20005777L
NO20005777L NO20005777A NO20005777A NO20005777L NO 20005777 L NO20005777 L NO 20005777L NO 20005777 A NO20005777 A NO 20005777A NO 20005777 A NO20005777 A NO 20005777A NO 20005777 L NO20005777 L NO 20005777L
Authority
NO
Norway
Prior art keywords
copper
electro
separate
separate tank
carbonate
Prior art date
Application number
NO20005777A
Other languages
English (en)
Other versions
NO20005777D0 (no
Inventor
Juergen Hupe
Walter Kronenberg
Eugen Breitkreuz
Ulrich Schmergel
Original Assignee
Blasberg Oberflaechentech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Blasberg Oberflaechentech filed Critical Blasberg Oberflaechentech
Publication of NO20005777D0 publication Critical patent/NO20005777D0/no
Publication of NO20005777L publication Critical patent/NO20005777L/no

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacture And Refinement Of Metals (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Optical Integrated Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

Det er beskrevet en fremgangsmåte for kobberbelegging av substrater ved anvendelser av uoppløselige anoder i sure kobberbad med separat erstatning av forbrukte kobberioner, kjennetegnet ved at hoveddelen av kobberionene tilføres direkte i form av kobberkarbonat og/eller basisk kobberkarbonat, idet det gis avkall på diafragmaer og hjelpeelektrolytter, i en separat tank drevet i en bypass-modus med hensyn til arbeidselektrolytten, idet det frigitte gassformige C02 separeres fra i nevnte separate tank.
NO20005777A 1998-05-16 2000-11-15 Fremgangsmåte for elektro-forkobring av substrater NO20005777L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19822076 1998-05-16
PCT/EP1999/003321 WO1999060188A2 (de) 1998-05-16 1999-05-14 Verfahren zur galvanischen verkupferung von substraten

Publications (2)

Publication Number Publication Date
NO20005777D0 NO20005777D0 (no) 2000-11-15
NO20005777L true NO20005777L (no) 2000-11-15

Family

ID=7868038

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20005777A NO20005777L (no) 1998-05-16 2000-11-15 Fremgangsmåte for elektro-forkobring av substrater

Country Status (22)

Country Link
US (1) US6576111B1 (no)
EP (1) EP1080252B1 (no)
JP (1) JP2002515549A (no)
KR (1) KR100545664B1 (no)
CN (1) CN1170965C (no)
AT (1) ATE221930T1 (no)
AU (1) AU4261799A (no)
CA (1) CA2331750A1 (no)
DE (1) DE59902276D1 (no)
DK (1) DK1080252T3 (no)
HU (1) HUP0102016A3 (no)
IL (1) IL139418A0 (no)
IS (1) IS5703A (no)
NO (1) NO20005777L (no)
PL (1) PL344529A1 (no)
RO (1) RO119838B1 (no)
RU (1) RU2222643C2 (no)
SK (1) SK16912000A3 (no)
TR (1) TR200003368T2 (no)
WO (1) WO1999060188A2 (no)
YU (1) YU70900A (no)
ZA (1) ZA200006624B (no)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3725083B2 (ja) * 2002-02-21 2005-12-07 アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング メッキ設備における金属イオン供給源の有効保存を可能とする方法
US7776741B2 (en) 2008-08-18 2010-08-17 Novellus Systems, Inc. Process for through silicon via filing
US10472730B2 (en) 2009-10-12 2019-11-12 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
US9109295B2 (en) * 2009-10-12 2015-08-18 Novellus Systems, Inc. Electrolyte concentration control system for high rate electroplating
CN107636209B (zh) * 2015-06-26 2021-07-02 住友金属矿山股份有限公司 导电性基板
US10692735B2 (en) 2017-07-28 2020-06-23 Lam Research Corporation Electro-oxidative metal removal in through mask interconnect fabrication

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU60230A1 (ru) * 1939-06-25 1940-11-30 М.И. Бердников Способ электролитического осаждени меди на железе и других металлах
SU116447A1 (ru) * 1958-06-11 1958-11-30 А.М. Ямпольский Способ нанесени медных покрытий электролизом нецианистых электролитов
DE3483078D1 (de) * 1983-09-28 1990-10-04 Blasberg Oberflaechentech Saures galvanisches kupferbad und verfahren zu seiner herstellung.
JPS62112996A (ja) * 1985-11-11 1987-05-23 Mitsubishi Metal Corp 伝熱体
DE4001960A1 (de) * 1990-01-24 1991-07-25 Roland Schnetteler Verfahren zum elektrochemischen beschichten von stahlbaendern mit zink-nickellegierungen
JPH04320088A (ja) * 1991-04-18 1992-11-10 Cmk Corp プリント配線板の製造方法
US5516414A (en) * 1992-09-15 1996-05-14 Atr Wire & Cable Co., Inc. Method and apparatus for electrolytically plating copper

Also Published As

Publication number Publication date
HUP0102016A2 (hu) 2001-09-28
PL344529A1 (en) 2001-11-05
WO1999060188A3 (de) 2000-01-13
US6576111B1 (en) 2003-06-10
IS5703A (is) 2000-11-02
NO20005777D0 (no) 2000-11-15
DK1080252T3 (da) 2003-01-06
DE59902276D1 (de) 2002-09-12
ZA200006624B (en) 2001-06-01
EP1080252B1 (de) 2002-08-07
EP1080252A1 (de) 2001-03-07
YU70900A (sh) 2003-02-28
KR100545664B1 (ko) 2006-01-24
CN1170965C (zh) 2004-10-13
ATE221930T1 (de) 2002-08-15
CA2331750A1 (en) 1999-11-25
TR200003368T2 (tr) 2001-04-20
WO1999060188A2 (de) 1999-11-25
JP2002515549A (ja) 2002-05-28
RO119838B1 (ro) 2005-04-29
KR20010043597A (ko) 2001-05-25
IL139418A0 (en) 2001-11-25
HUP0102016A3 (en) 2002-03-28
RU2222643C2 (ru) 2004-01-27
SK16912000A3 (sk) 2001-08-06
CN1301313A (zh) 2001-06-27
AU4261799A (en) 1999-12-06

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Legal Events

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FC2A Withdrawal, rejection or dismissal of laid open patent application