NO20031998L - Mikrostruktur med bevegelig masse - Google Patents

Mikrostruktur med bevegelig masse

Info

Publication number
NO20031998L
NO20031998L NO20031998A NO20031998A NO20031998L NO 20031998 L NO20031998 L NO 20031998L NO 20031998 A NO20031998 A NO 20031998A NO 20031998 A NO20031998 A NO 20031998A NO 20031998 L NO20031998 L NO 20031998L
Authority
NO
Norway
Prior art keywords
mass
microstructure
movable mass
base member
arranged above
Prior art date
Application number
NO20031998A
Other languages
English (en)
Other versions
NO20031998D0 (no
Inventor
Hiroyuki Hashimoto
Takahiko Ooasa
Naoki Ikeuchi
Muneo Harada
Original Assignee
Muneo Harada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2002244282A external-priority patent/JP2004082238A/ja
Priority claimed from JP2002244283A external-priority patent/JP2003156511A/ja
Application filed by Muneo Harada filed Critical Muneo Harada
Publication of NO20031998D0 publication Critical patent/NO20031998D0/no
Publication of NO20031998L publication Critical patent/NO20031998L/no

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • B81B3/0051—For defining the movement, i.e. structures that guide or limit the movement of an element
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/12—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance
    • G01P15/123—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by alteration of electrical resistance by piezo-resistive elements, e.g. semiconductor strain gauges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0242—Gyroscopes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0181—See-saws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/05—Type of movement
    • B81B2203/053—Translation according to an axis perpendicular to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/05—Type of movement
    • B81B2203/058—Rotation out of a plane parallel to the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0822—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass
    • G01P2015/084—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass
    • G01P2015/0842—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining out-of-plane movement of the mass the mass being suspended at more than one of its sides, e.g. membrane-type suspension, so as to permit multi-axis movement of the mass the mass being of clover leaf shape

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Remote Sensing (AREA)
  • Computer Hardware Design (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Stringed Musical Instruments (AREA)
  • Gyroscopes (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
NO20031998A 2001-09-04 2003-05-02 Mikrostruktur med bevegelig masse NO20031998L (no)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2001266604 2001-09-04
JP2002244282A JP2004082238A (ja) 2002-08-23 2002-08-23 可動構造部を有する微小構造体
JP2002244283A JP2003156511A (ja) 2001-09-04 2002-08-23 可動構造部を有する微小構造体
PCT/JP2002/008879 WO2003023414A1 (en) 2001-09-04 2002-09-02 Microstructure with movable mass

Publications (2)

Publication Number Publication Date
NO20031998D0 NO20031998D0 (no) 2003-05-02
NO20031998L true NO20031998L (no) 2003-07-02

Family

ID=27347434

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20031998A NO20031998L (no) 2001-09-04 2003-05-02 Mikrostruktur med bevegelig masse

Country Status (10)

Country Link
US (1) US6931928B2 (no)
EP (1) EP1423714B1 (no)
KR (1) KR100638928B1 (no)
CN (1) CN100335905C (no)
AT (1) ATE333651T1 (no)
DE (1) DE60213257T2 (no)
DK (1) DK1423714T3 (no)
NO (1) NO20031998L (no)
TW (1) TW569460B (no)
WO (1) WO2003023414A1 (no)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1491901A1 (en) 2003-06-25 2004-12-29 Matsushita Electric Works, Ltd. Semiconductor acceleration sensor and method of manufacturing the same
EP1571454B1 (fr) 2004-03-02 2007-08-01 Colibrys S.A. Microsystème électromécanique
US7710335B2 (en) * 2004-05-19 2010-05-04 Delphi Technologies, Inc. Dual band loop antenna
JP4438579B2 (ja) * 2004-09-14 2010-03-24 株式会社デンソー センサ装置
JP2006125887A (ja) * 2004-10-26 2006-05-18 Fujitsu Media Device Kk 加速度センサ
US7406870B2 (en) * 2005-01-06 2008-08-05 Ricoh Company, Ltd. Semiconductor sensor
JP2006201041A (ja) * 2005-01-20 2006-08-03 Oki Electric Ind Co Ltd 加速度センサ
JP2006242692A (ja) * 2005-03-02 2006-09-14 Oki Electric Ind Co Ltd 加速度センサチップ
US7594440B2 (en) * 2006-10-05 2009-09-29 Endevco Corporation Highly sensitive piezoresistive element
JP4486103B2 (ja) * 2007-03-19 2010-06-23 Ｏｋｉセミコンダクタ株式会社 加速度センサ、及び加速度センサの製造方法
KR100844143B1 (ko) * 2007-05-02 2008-07-04 재단법인서울대학교산학협력재단 3차원 구조의 미세 전극 어레이 제조방법
JP2009020001A (ja) * 2007-07-12 2009-01-29 Oki Electric Ind Co Ltd 加速度センサ
JP2009053180A (ja) * 2007-07-27 2009-03-12 Hitachi Metals Ltd 加速度センサー
US8187903B2 (en) 2009-01-13 2012-05-29 Robert Bosch Gmbh Method of epitaxially growing piezoresistors
CN102190282A (zh) * 2010-03-03 2011-09-21 南茂科技股份有限公司 微机电芯片封装结构及其制造方法
US8776601B2 (en) * 2010-11-23 2014-07-15 Honeywell International Inc. MEMS sensor using multi-layer movable combs
JP2014049733A (ja) * 2012-09-04 2014-03-17 Fujitsu Semiconductor Ltd 半導体装置及び半導体装置の製造方法
GB2506171B (en) * 2012-09-24 2015-01-28 Wolfson Microelectronics Plc MEMS device and process
US11987494B2 (en) 2020-11-24 2024-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Wire-bond damper for shock absorption

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129042A (en) * 1977-11-18 1978-12-12 Signetics Corporation Semiconductor transducer packaged assembly
JPH0679033B2 (ja) 1987-12-21 1994-10-05 日産自動車株式会社 半導体加速度センサ
DE8805846U1 (de) * 1988-05-03 1989-09-07 Robert Bosch Gmbh, 70469 Stuttgart Sensor
DE3814952A1 (de) * 1988-05-03 1989-11-23 Bosch Gmbh Robert Sensor
US5191794A (en) * 1990-12-24 1993-03-09 Litton Systems, Inc. Integrated accelerometer with resilient limit stops
US5894090A (en) 1996-05-31 1999-04-13 California Institute Of Technology Silicon bulk micromachined, symmetric, degenerate vibratorygyroscope, accelerometer and sensor and method for using the same
US5914521A (en) * 1997-07-30 1999-06-22 Motorola, Inc. Sensor devices having a movable structure
CN1069972C (zh) * 1997-11-11 2001-08-22 李韫言 双电极单晶硅电容加速度传感器及其制造方法
CN2438607Y (zh) * 2000-08-25 2001-07-11 华北工学院微米纳米技术研究中心 集成硅微电阻式加速度传感器

Also Published As

Publication number Publication date
NO20031998D0 (no) 2003-05-02
CN1551985A (zh) 2004-12-01
DE60213257D1 (de) 2006-08-31
EP1423714B1 (en) 2006-07-19
CN100335905C (zh) 2007-09-05
EP1423714A1 (en) 2004-06-02
KR100638928B1 (ko) 2006-10-26
ATE333651T1 (de) 2006-08-15
DK1423714T3 (da) 2006-11-06
KR20040041158A (ko) 2004-05-14
US6931928B2 (en) 2005-08-23
DE60213257T2 (de) 2007-06-14
WO2003023414A1 (en) 2003-03-20
TW569460B (en) 2004-01-01
US20050016271A1 (en) 2005-01-27

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