NO20062380L - Verktoysystem og fremgangsmate for hoytemperaturomgivelser - Google Patents

Verktoysystem og fremgangsmate for hoytemperaturomgivelser

Info

Publication number
NO20062380L
NO20062380L NO20062380A NO20062380A NO20062380L NO 20062380 L NO20062380 L NO 20062380L NO 20062380 A NO20062380 A NO 20062380A NO 20062380 A NO20062380 A NO 20062380A NO 20062380 L NO20062380 L NO 20062380L
Authority
NO
Norway
Prior art keywords
tool
electronics
high temperature
temperature environment
tool system
Prior art date
Application number
NO20062380A
Other languages
English (en)
Other versions
NO341264B1 (no
Inventor
Roger Lynn Schultz
Paul Rodney
James J Freeman
Original Assignee
Halliburton Energy Serv Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Halliburton Energy Serv Inc filed Critical Halliburton Energy Serv Inc
Publication of NO20062380L publication Critical patent/NO20062380L/no
Publication of NO341264B1 publication Critical patent/NO341264B1/no

Links

Classifications

    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/017—Protecting measuring instruments
    • E21B47/0175—Cooling arrangements
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/002—Survey of boreholes or wells by visual inspection
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/013—Devices specially adapted for supporting measuring instruments on drill bits
    • E—FIXED CONSTRUCTIONS
    • E21—EARTH OR ROCK DRILLING; MINING
    • E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
    • E21B47/00—Survey of boreholes or wells
    • E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
    • E21B47/017—Protecting measuring instruments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V1/00—Seismology; Seismic or acoustic prospecting or detecting
    • G01V1/40—Seismology; Seismic or acoustic prospecting or detecting specially adapted for well-logging
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00—Prospecting or detecting by optical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/03—Manufacture or treatment wherein the substrate comprises sapphire, e.g. silicon-on-sapphire [SOS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/11—Structural features, others than packages, for protecting a device against environmental influences
    • B81B2207/115—Protective layers applied directly to the device before packaging
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Geology (AREA)
  • Mining & Mineral Resources (AREA)
  • Geophysics (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Geochemistry & Mineralogy (AREA)
  • General Physics & Mathematics (AREA)
  • Remote Sensing (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Acoustics & Sound (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Input Circuits Of Receivers And Coupling Of Receivers And Audio Equipment (AREA)
  • Structure Of Receivers (AREA)
  • Drilling Tools (AREA)
  • Forging (AREA)
  • Chemical Vapour Deposition (AREA)
  • Pressure Sensors (AREA)
  • Thin Film Transistor (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Formation Of Insulating Films (AREA)
  • Earth Drilling (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Radiation Pyrometers (AREA)
  • Semiconductor Memories (AREA)

Abstract

I minst enkelte utførelser kan et verktøy omfatte et verktøylegeme og en eller flere verktøykomponenter. Verktøyet kan videre omfatte verktøyelektronikk som er lokalisert inne i verktøylegemet, hvor verktøyelektronikken er funksjonsdyktig til å sanse og lagre verktøykomponentkarakteristika og miljøkarakteristika. I det minste noe av verktøyelektronikken er funksjonsdyktig, i minst én uke, når den utsettes for temperaturer på minst 200 grader C. Verktøyelektronikken kan være integrerte kretser som er dannet på et silisiumkarbidsubstrat eller et silisium på safir substrat. En illustrativ utførelse av verktøyet er en borkrone for anvendelse i en høytemperatur brønnboring.
NO20062380A 2003-11-18 2006-05-24 Verktøysystem og fremgangsmåte for høytemperaturomgivelser NO341264B1 (no)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US52095003P 2003-11-18 2003-11-18
US52099203P 2003-11-18 2003-11-18
PCT/US2004/038791 WO2005049957A2 (en) 2003-11-18 2004-11-18 High temperature environment tool system and method

Publications (2)

Publication Number Publication Date
NO20062380L true NO20062380L (no) 2006-08-11
NO341264B1 NO341264B1 (no) 2017-09-25

Family

ID=34623159

Family Applications (2)

Application Number Title Priority Date Filing Date
NO20062380A NO341264B1 (no) 2003-11-18 2006-05-24 Verktøysystem og fremgangsmåte for høytemperaturomgivelser
NO20171106A NO342998B1 (no) 2003-11-18 2017-07-05 Verktøysystem og fremgangsmåte for høytemperaturomgivelser

Family Applications After (1)

Application Number Title Priority Date Filing Date
NO20171106A NO342998B1 (no) 2003-11-18 2017-07-05 Verktøysystem og fremgangsmåte for høytemperaturomgivelser

Country Status (9)

Country Link
US (3) US7307425B2 (no)
EP (3) EP3249154A1 (no)
JP (1) JP4769729B2 (no)
CN (1) CN101095239B (no)
AU (2) AU2004311152B2 (no)
CA (1) CA2543909C (no)
GB (1) GB2425177B (no)
NO (2) NO341264B1 (no)
WO (4) WO2005049957A2 (no)

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