NO20071802L - Mikrostrukturinspesjonsapparat og mikrostrukturinspeksjonsfremgangsmate - Google Patents

Mikrostrukturinspesjonsapparat og mikrostrukturinspeksjonsfremgangsmate

Info

Publication number
NO20071802L
NO20071802L NO20071802A NO20071802A NO20071802L NO 20071802 L NO20071802 L NO 20071802L NO 20071802 A NO20071802 A NO 20071802A NO 20071802 A NO20071802 A NO 20071802A NO 20071802 L NO20071802 L NO 20071802L
Authority
NO
Norway
Prior art keywords
microstructure inspection
microstructure
chip
detected
microphone
Prior art date
Application number
NO20071802A
Other languages
English (en)
Inventor
Masami Yakabe
Katsuya Okumura
Naoki Ikeuchi
Toshiyuki Matsumota
Original Assignee
Octec Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Octec Inc filed Critical Octec Inc
Publication of NO20071802L publication Critical patent/NO20071802L/no

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/14—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object using acoustic emission techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/04—Analysing solids
    • G01N29/12—Analysing solids by measuring frequency or resonance of acoustic waves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C99/00—Subject matter not provided for in other groups of this subclass
    • B81C99/0035—Testing
    • B81C99/005—Test apparatus
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/44—Processing the detected response signal, e.g. electronic circuits specially adapted therefor
    • G01N29/4409—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison
    • G01N29/4427—Processing the detected response signal, e.g. electronic circuits specially adapted therefor by comparison with stored values, e.g. threshold values
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2695—Bottles, containers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2697—Wafer or (micro)electronic parts

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

En spenning blir påtrykket av en brikke (TP) fra en spenningsdriverdel (30) gjennom en. probenål (P) og en bevegelig del i en mikrostruktur blir flyttet. En lyd generert som svar på bevegelsen av den bevegelige delen i mikrostrukturen blir detektert av en mikrofon (3). Så vil lyden detektert av mikrofonen (3) bli målt av en måledel (25), og karakteristikker til deteksjonsbrikken (TP) blir evaluert av en kontrolldel (20) basert på sammenligning med en lyd detektert fra en ideell brikke (TP).
NO20071802A 2004-09-13 2007-04-03 Mikrostrukturinspesjonsapparat og mikrostrukturinspeksjonsfremgangsmate NO20071802L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004265385A JP2006078435A (ja) 2004-09-13 2004-09-13 微小構造体の検査装置および微小構造体の検査方法
PCT/JP2005/016663 WO2006030716A1 (ja) 2004-09-13 2005-09-09 微小構造体の検査装置および微小構造体の検査方法

Publications (1)

Publication Number Publication Date
NO20071802L true NO20071802L (no) 2007-06-06

Family

ID=36059969

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20071802A NO20071802L (no) 2004-09-13 2007-04-03 Mikrostrukturinspesjonsapparat og mikrostrukturinspeksjonsfremgangsmate

Country Status (7)

Country Link
US (1) US20080302185A1 (no)
EP (1) EP1801578A4 (no)
JP (1) JP2006078435A (no)
KR (1) KR20070062979A (no)
NO (1) NO20071802L (no)
TW (1) TW200622240A (no)
WO (1) WO2006030716A1 (no)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4573794B2 (ja) * 2005-03-31 2010-11-04 東京エレクトロン株式会社 プローブカードおよび微小構造体の検査装置
KR100985453B1 (ko) 2005-11-25 2010-10-05 파나소닉 전공 주식회사 센서 장치 및 그 제조 방법
WO2007061047A1 (ja) * 2005-11-25 2007-05-31 Matsushita Electric Works, Ltd. ウェハレベルパッケージ構造体およびその製造方法
US8067769B2 (en) * 2005-11-25 2011-11-29 Panasonic Electric Works Co., Ltd. Wafer level package structure, and sensor device obtained from the same package structure
CN101317263B (zh) * 2005-11-25 2012-03-21 松下电工株式会社 传感器装置及其制造方法
CN100581984C (zh) * 2007-12-28 2010-01-20 中国科学院上海微系统与信息技术研究所 基于电镀工艺的微机械测试探卡及制作方法
JP6399710B2 (ja) * 2013-06-12 2018-10-03 アトラス・コプコ・インダストリアル・テクニーク・アクチボラグ トルクインパルス発生装置の診断方法
JP6954528B2 (ja) * 2017-06-29 2021-10-27 株式会社フジタ 検査対象物の状態評価装置および状態評価方法
JP6954527B2 (ja) * 2017-06-29 2021-10-27 株式会社フジタ 検査対象物の状態評価装置および状態評価方法
JP2019184341A (ja) * 2018-04-05 2019-10-24 東芝三菱電機産業システム株式会社 電力変換システムおよび遮断器診断装置
US12568337B2 (en) 2021-06-17 2026-03-03 Skyworks Solutions, Inc. Acoustic devices with residual stress compensation
DE102021212327A1 (de) * 2021-11-02 2023-05-04 Robert Bosch Gesellschaft mit beschränkter Haftung Verfahren und Einrichtung zum Ermitteln dynamischer Parameter einer MEMS-Vorrichtung, und MEMS-Vorrichtung
CN115877165B (zh) * 2023-03-09 2023-06-16 合肥晶合集成电路股份有限公司 一种wat测试设备及其管控方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6080759A (ja) * 1983-10-07 1985-05-08 Showa Electric Wire & Cable Co Ltd 接着状態試験方法
US4816125A (en) * 1987-11-25 1989-03-28 The Regents Of The University Of California IC processed piezoelectric microphone
US5152401A (en) * 1989-10-13 1992-10-06 The United States Of America As Representd By The Secretary Of Agriculture Agricultural commodity condition measurement
US6295870B1 (en) * 1991-02-08 2001-10-02 Alliedsignal Inc. Triaxial angular rate and acceleration sensor
JPH08278292A (ja) * 1995-03-31 1996-10-22 Sumitomo Sitix Corp シリコンウェーハの検査方法
JPH09196682A (ja) * 1996-01-19 1997-07-31 Matsushita Electric Ind Co Ltd 角速度センサと加速度センサ
JPH1090050A (ja) * 1996-09-20 1998-04-10 Toshiba Corp 回転駆動機構を備えた電子機器の検査装置、及び動作異常検出方法
JPH10174373A (ja) * 1996-12-09 1998-06-26 Meidensha Corp 電気機器の劣化診断装置
JPH11248619A (ja) * 1998-03-06 1999-09-17 Akira Kawai 固体表面の微小付着物の物性評価方法
US6507187B1 (en) * 1999-08-24 2003-01-14 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ultra-sensitive magnetoresistive displacement sensing device
US6629448B1 (en) * 2000-02-25 2003-10-07 Seagate Technology Llc In-situ testing of a MEMS accelerometer in a disc storage system
US6567715B1 (en) * 2000-04-19 2003-05-20 Sandia Corporation Method and system for automated on-chip material and structural certification of MEMS devices
JP4456723B2 (ja) * 2000-04-28 2010-04-28 佐藤工業株式会社 コンクリート健全度判定方法及び装置
US6595058B2 (en) * 2001-06-19 2003-07-22 Computed Ultrasound Global Inc. Method and apparatus for determining dynamic response of microstructure by using pulsed broad bandwidth ultrasonic transducer as BAW hammer
US6954025B2 (en) * 2002-05-13 2005-10-11 University Of Florida Research Foundation, Inc. Resonant energy MEMS array and system including dynamically modifiable power processor
JP2004130449A (ja) * 2002-10-10 2004-04-30 Nippon Telegr & Teleph Corp <Ntt> Ｍｅｍｓ素子及びその製造方法

Also Published As

Publication number Publication date
KR20070062979A (ko) 2007-06-18
US20080302185A1 (en) 2008-12-11
EP1801578A1 (en) 2007-06-27
WO2006030716A1 (ja) 2006-03-23
EP1801578A4 (en) 2008-07-30
JP2006078435A (ja) 2006-03-23
TW200622240A (en) 2006-07-01

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