NO20075425L - Varmeoverforingssjikt, utstralestrukstur og fremgangsmate for a anvende varmeoverfoingssjikt - Google Patents

Varmeoverforingssjikt, utstralestrukstur og fremgangsmate for a anvende varmeoverfoingssjikt

Info

Publication number
NO20075425L
NO20075425L NO20075425A NO20075425A NO20075425L NO 20075425 L NO20075425 L NO 20075425L NO 20075425 A NO20075425 A NO 20075425A NO 20075425 A NO20075425 A NO 20075425A NO 20075425 L NO20075425 L NO 20075425L
Authority
NO
Norway
Prior art keywords
heat transfer
transfer layer
heat
radiator
heat generator
Prior art date
Application number
NO20075425A
Other languages
English (en)
Norwegian (no)
Inventor
Yoshiaki Hirose
Original Assignee
Toyo Tanso Vo Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Tanso Vo Ltd filed Critical Toyo Tanso Vo Ltd
Publication of NO20075425L publication Critical patent/NO20075425L/no

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/20—Graphite
    • C01B32/21—After-treatment
    • C01B32/22—Intercalation
    • C01B32/225—Expansion; Exfoliation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geology (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Fixing For Electrophotography (AREA)
  • Paper (AREA)
NO20075425A 2005-03-31 2007-10-25 Varmeoverforingssjikt, utstralestrukstur og fremgangsmate for a anvende varmeoverfoingssjikt NO20075425L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005100622A JP4299261B2 (ja) 2005-03-31 2005-03-31 伝熱シート、放熱構造体および伝熱シートの使用方法
PCT/JP2006/304865 WO2006112211A1 (fr) 2005-03-31 2006-03-13 Feuille de transfert thermique, structure de rayonnement et procede d’utilisation de feuille de transfert thermique

Publications (1)

Publication Number Publication Date
NO20075425L true NO20075425L (no) 2007-10-25

Family

ID=37114943

Family Applications (1)

Application Number Title Priority Date Filing Date
NO20075425A NO20075425L (no) 2005-03-31 2007-10-25 Varmeoverforingssjikt, utstralestrukstur og fremgangsmate for a anvende varmeoverfoingssjikt

Country Status (7)

Country Link
US (1) US20090301697A1 (fr)
EP (1) EP1865552B1 (fr)
JP (2) JP4299261B2 (fr)
KR (3) KR101068416B1 (fr)
NO (1) NO20075425L (fr)
TW (1) TWI320844B (fr)
WO (1) WO2006112211A1 (fr)

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JP5818127B2 (ja) * 2010-02-04 2015-11-18 株式会社リコー 画像形成装置
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JP2013118313A (ja) * 2011-12-05 2013-06-13 Dexerials Corp 電磁波吸収性熱伝導シート及び電磁波吸収性熱伝導シートの製造方法
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CN102917574B (zh) * 2012-10-24 2015-05-27 华为技术有限公司 导热垫、制造导热垫的方法、散热装置和电子设备
JP6043188B2 (ja) * 2013-01-08 2016-12-14 株式会社カネカ 層間熱接続部材および層間熱接続方法
JP6280875B2 (ja) * 2013-01-28 2018-02-14 株式会社村田製作所 はんだバンプの形成方法およびはんだバンプ
JP6251739B2 (ja) 2013-05-22 2017-12-20 株式会社カネカ 放熱構造体
EP3050845B1 (fr) 2013-09-26 2021-04-21 Kaneka Corporation Feuille de graphite, procédé pour la fabriquer, carte stratifiée pour câblage, matériau de câblage en graphite, et procédé pour fabriquer une carte de câblage
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US9706684B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Exfoliated graphite materials and composite materials and devices for thermal management
US9700968B2 (en) 2013-12-26 2017-07-11 Terrella Energy Systems Ltd. Apparatus and methods for processing exfoliated graphite materials
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WO2016088845A1 (fr) 2014-12-04 2016-06-09 株式会社カネカ Graphène intercouche pouvant être collé thermiquement pour vide poussé
JP6968364B2 (ja) 2015-04-15 2021-11-17 株式会社カネカ イオンビーム荷電変換装置の荷電変換膜及びその製造方法
US11840013B2 (en) 2018-02-27 2023-12-12 Matthews International Corporation Graphite materials and devices with surface micro-texturing
US20210050280A1 (en) * 2018-06-28 2021-02-18 Panasonic Intellectual Property Management Co., Ltd. Electronic device and method for manufacturing electronic device
US12087661B2 (en) * 2019-02-08 2024-09-10 Panasonic Intellectual Property Management Co., Ltd. Heat conducting sheet and electronic device using same
JP7598887B2 (ja) * 2020-02-07 2024-12-12 阿波製紙株式会社 熱放射シート及びこれを用いた放熱装置
KR102183485B1 (ko) * 2020-07-30 2020-11-26 주식회사 엔티에스 폐흑연을 이용한 방열 시트의 제조 방법
JP7756301B2 (ja) * 2021-07-29 2025-10-20 パナソニックＩｐマネジメント株式会社 グラファイト複合体及び電子部品
JP7074270B1 (ja) 2022-01-19 2022-05-24 富士電機株式会社 半導体装置
WO2026058832A1 (fr) * 2024-09-10 2026-03-19 三菱ケミカル株式会社 Module semi-conducteur de puissance de type à dissipation de chaleur de surface supérieure

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KR100529112B1 (ko) * 2003-09-26 2005-11-15 삼성에스디아이 주식회사 다공성 열전달 시트를 갖는 디스플레이 장치
US20060070720A1 (en) * 2004-09-17 2006-04-06 Capp Joseph P Heat riser
JP4299261B2 (ja) * 2005-03-31 2009-07-22 東洋炭素株式会社 伝熱シート、放熱構造体および伝熱シートの使用方法

Also Published As

Publication number Publication date
JP2008153704A (ja) 2008-07-03
JP4299261B2 (ja) 2009-07-22
TWI320844B (en) 2010-02-21
US20090301697A1 (en) 2009-12-10
WO2006112211A1 (fr) 2006-10-26
KR20070118099A (ko) 2007-12-13
EP1865552B1 (fr) 2022-06-15
JP5114255B2 (ja) 2013-01-09
KR101068416B1 (ko) 2011-09-29
JP2006286684A (ja) 2006-10-19
EP1865552A1 (fr) 2007-12-12
KR101061805B1 (ko) 2011-09-05
KR20100017859A (ko) 2010-02-16
EP1865552A4 (fr) 2008-07-02
KR20100017858A (ko) 2010-02-16
TW200638018A (en) 2006-11-01
KR101052752B1 (ko) 2011-07-29

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