NO821424L - Montasjearrangement samt fremgangsmaate og utstyr for fremstilling av samme. - Google Patents

Montasjearrangement samt fremgangsmaate og utstyr for fremstilling av samme.

Info

Publication number
NO821424L
NO821424L NO821424A NO821424A NO821424L NO 821424 L NO821424 L NO 821424L NO 821424 A NO821424 A NO 821424A NO 821424 A NO821424 A NO 821424A NO 821424 L NO821424 L NO 821424L
Authority
NO
Norway
Prior art keywords
base plate
components
pattern
flexible
layer
Prior art date
Application number
NO821424A
Other languages
English (en)
Norwegian (no)
Inventor
Mohamed Mah Abdalla El Refaie
Original Assignee
Itt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Itt filed Critical Itt
Publication of NO821424L publication Critical patent/NO821424L/no

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/0959—Plated through-holes or plated blind vias filled with insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10727—Leadless chip carrier [LCC], e.g. chip-modules for cards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Communication Control (AREA)
  • Laminated Bodies (AREA)
  • Structure Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Electrotherapy Devices (AREA)
NO821424A 1981-05-06 1982-04-30 Montasjearrangement samt fremgangsmaate og utstyr for fremstilling av samme. NO821424L (no)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8113873A GB2097998B (en) 1981-05-06 1981-05-06 Mounting of integrated circuits

Publications (1)

Publication Number Publication Date
NO821424L true NO821424L (no) 1982-11-08

Family

ID=10521611

Family Applications (1)

Application Number Title Priority Date Filing Date
NO821424A NO821424L (no) 1981-05-06 1982-04-30 Montasjearrangement samt fremgangsmaate og utstyr for fremstilling av samme.

Country Status (7)

Country Link
EP (1) EP0064854B1 (da)
JP (1) JPS5828848A (da)
AT (1) ATE11713T1 (da)
DE (1) DE3262203D1 (da)
DK (1) DK201182A (da)
GB (1) GB2097998B (da)
NO (1) NO821424L (da)

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4602318A (en) * 1981-04-14 1986-07-22 Kollmorgen Technologies Corporation Substrates to interconnect electronic components
DE3138987C2 (de) * 1981-09-30 1984-03-29 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum Verhindern von Beschädigungen von Bausteinen bzw. Leiterbahnen auf einer Leiterplatte
CH660551GA3 (da) * 1982-12-27 1987-05-15
GB8304890D0 (en) * 1983-02-22 1983-03-23 Smiths Industries Plc Chip-carrier substrates
US4658332A (en) * 1983-04-04 1987-04-14 Raytheon Company Compliant layer printed circuit board
DE3406528A1 (de) * 1984-02-23 1985-08-29 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul
JPH0642515B2 (ja) * 1984-12-26 1994-06-01 株式会社東芝 回路基板
US4661192A (en) * 1985-08-22 1987-04-28 Motorola, Inc. Low cost integrated circuit bonding process
DE3536883A1 (de) * 1985-10-16 1987-04-16 Isola Werke Ag Basismaterial fuer gedruckte schaltungen
DE3625263A1 (de) * 1986-07-25 1988-02-04 Basf Ag Mikroelektronische bauelemente sowie dickschicht-hybridschaltungen
US4847146A (en) * 1988-03-21 1989-07-11 Hughes Aircraft Company Process for fabricating compliant layer board with selectively isolated solder pads
US4847136A (en) * 1988-03-21 1989-07-11 Hughes Aircraft Company Thermal expansion mismatch forgivable printed wiring board for ceramic leadless chip carrier
US5194934A (en) * 1988-07-27 1993-03-16 Semiconductor Energy Laboratory Co., Ltd. Mounting structure for a semiconductor chip having a buffer layer
US5068708A (en) * 1989-10-02 1991-11-26 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
US5559369A (en) * 1989-10-02 1996-09-24 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
JP2634351B2 (ja) * 1991-04-23 1997-07-23 三菱電機株式会社 半導体装置
US6111308A (en) * 1991-06-05 2000-08-29 Advanced Micro Devices, Inc. Ground plane for plastic encapsulated integrated circuit die packages
JPH06204632A (ja) * 1991-06-21 1994-07-22 Shin Kobe Electric Mach Co Ltd 表面実装プリント配線板用銅張り積層板
JPH05327152A (ja) * 1992-05-18 1993-12-10 Sanken Electric Co Ltd 配線基板及びその製造方法
WO1994018701A1 (en) * 1993-02-05 1994-08-18 W.L. Gore & Associates, Inc. Stress-resistant semiconductor chip-circuit board interconnect
DE4315160A1 (de) * 1993-05-07 1994-11-17 Bodenseewerk Geraetetech Halterung für Mikrosysteme
US5599744A (en) * 1995-02-06 1997-02-04 Grumman Aerospace Corporation Method of forming a microcircuit via interconnect
SE509570C2 (sv) * 1996-10-21 1999-02-08 Ericsson Telefon Ab L M Temperaturkompenserande organ och förfarande vid montering av elektronik på ett mönsterkort
JP3152180B2 (ja) * 1997-10-03 2001-04-03 日本電気株式会社 半導体装置及びその製造方法
US6299053B1 (en) 1998-08-19 2001-10-09 Kulicke & Soffa Holdings, Inc. Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch
CN100387103C (zh) 1999-08-12 2008-05-07 Ibiden股份有限公司 多层印刷电路板和半导体器件
US6560108B2 (en) * 2000-02-16 2003-05-06 Hughes Electronics Corporation Chip scale packaging on CTE matched printed wiring boards
WO2005074340A1 (ja) 2004-01-30 2005-08-11 Ibiden Co., Ltd. 多層プリント配線板及びその製造方法
WO2005107350A1 (ja) 2004-04-28 2005-11-10 Ibiden Co., Ltd. 多層プリント配線板
WO2005117510A1 (ja) 2004-05-27 2005-12-08 Ibiden Co., Ltd. 多層プリント配線板
ATE502398T1 (de) 2006-01-24 2011-04-15 Nxp Bv Spannungspufferungsgehäuse für ein halbleiterbauelement
US9466579B2 (en) 2007-07-26 2016-10-11 Nxp B.V. Reinforced structure for a stack of layers in a semiconductor component
KR101120285B1 (ko) 2007-07-30 2012-03-07 엔엑스피 비 브이 스트레스 완충 반도체 부품 및 그의 제조 방법
CN106573445A (zh) * 2014-07-29 2017-04-19 惠普发展公司，有限责任合伙企业 在表面上的弹性体涂层
GB201503089D0 (en) * 2015-02-24 2015-04-08 Flight Refueling Ltd Hybrid electronic circuit

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3780352A (en) * 1968-06-25 1973-12-18 J Redwanz Semiconductor interconnecting system using conductive patterns bonded to thin flexible insulating films
IT981202B (it) * 1972-05-31 1974-10-10 Ibm Procedimento per fissare circui ti microminiaturizzati a moduli di supporto e composto adesivo isolante impiegato in tale pro cedimento
US3896544A (en) * 1973-01-15 1975-07-29 Essex International Inc Method of making resilient electrical contact assembly for semiconductor devices
JPS51150672A (en) * 1975-06-19 1976-12-24 Sharp Kk Method of fixing electronic parts
JPS5272466A (en) * 1975-12-15 1977-06-16 Matsushita Electric Industrial Co Ltd Printed circuit board
JPS5333366A (en) * 1976-09-09 1978-03-29 Citizen Watch Co Ltd Ic mounting structure
US4231154A (en) * 1979-01-10 1980-11-04 International Business Machines Corporation Electronic package assembly method

Also Published As

Publication number Publication date
DE3262203D1 (en) 1985-03-21
EP0064854B1 (en) 1985-02-06
DK201182A (da) 1982-11-07
GB2097998B (en) 1985-05-30
JPS5828848A (ja) 1983-02-19
GB2097998A (en) 1982-11-10
ATE11713T1 (de) 1985-02-15
EP0064854A1 (en) 1982-11-17

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