NO954863L - Halvlederanordning for höytålespenning - Google Patents

Halvlederanordning for höytålespenning

Info

Publication number
NO954863L
NO954863L NO954863A NO954863A NO954863L NO 954863 L NO954863 L NO 954863L NO 954863 A NO954863 A NO 954863A NO 954863 A NO954863 A NO 954863A NO 954863 L NO954863 L NO 954863L
Authority
NO
Norway
Prior art keywords
voltage
mesaspor
underlying
semiconductor device
junction
Prior art date
Application number
NO954863A
Other languages
English (en)
Norwegian (no)
Other versions
NO954863D0 (no
Inventor
Satoshi Kitagawa
Toshihiro Tabuchi
Toshiyuki Kamei
Tatsuya Kamimura
Original Assignee
Komatsu Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Mfg Co Ltd filed Critical Komatsu Mfg Co Ltd
Publication of NO954863D0 publication Critical patent/NO954863D0/no
Publication of NO954863L publication Critical patent/NO954863L/no

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/104Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices having particular shapes of the bodies at or near reverse-biased junctions, e.g. having bevels or moats
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D18/00Thyristors
    • H10D18/80Bidirectional devices, e.g. triacs 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/192Base regions of thyristors
    • H10D62/206Cathode base regions of thyristors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00Diodes
    • H10D8/80PNPN diodes, e.g. Shockley diodes or break-over diodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H10D62/126Top-view geometrical layouts of the regions or the junctions

Landscapes

  • Thyristors (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Bipolar Transistors (AREA)
  • Element Separation (AREA)
NO954863A 1993-06-01 1995-11-30 Halvlederanordning for höytålespenning NO954863L (no)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP5130649A JPH06342902A (ja) 1993-06-01 1993-06-01 高耐圧半導体装置
PCT/JP1994/000884 WO1994028586A1 (fr) 1993-06-01 1994-06-01 Dispositif a semi-conducteur ayant une resistance elevee a la rupture

Publications (2)

Publication Number Publication Date
NO954863D0 NO954863D0 (no) 1995-11-30
NO954863L true NO954863L (no) 1996-01-19

Family

ID=15039305

Family Applications (1)

Application Number Title Priority Date Filing Date
NO954863A NO954863L (no) 1993-06-01 1995-11-30 Halvlederanordning for höytålespenning

Country Status (6)

Country Link
US (1) US5900651A (fr)
EP (1) EP0702412A4 (fr)
JP (1) JPH06342902A (fr)
CA (1) CA2164339A1 (fr)
NO (1) NO954863L (fr)
WO (1) WO1994028586A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10044960B4 (de) * 2000-09-12 2006-05-18 Semikron Elektronik Gmbh & Co. Kg Verfahren zur Herstellung eines Leistungshalbleiterbauelements
FR2956923A1 (fr) * 2010-03-01 2011-09-02 St Microelectronics Tours Sas Composant de puissance vertical haute tension
JP5572531B2 (ja) * 2010-12-08 2014-08-13 新電元工業株式会社 高信頼性半導体装置の製造方法
JP5820710B2 (ja) * 2011-12-02 2015-11-24 新電元工業株式会社 半導体装置
US10103540B2 (en) 2014-04-24 2018-10-16 General Electric Company Method and system for transient voltage suppression devices with active control
US9806157B2 (en) 2014-10-03 2017-10-31 General Electric Company Structure and method for transient voltage suppression devices with a two-region base
US12527017B2 (en) 2021-09-29 2026-01-13 Shindengen Electric Manufacturing Co., Ltd. Bidirectional thyristor

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE639633A (fr) * 1962-11-07
US3628107A (en) * 1969-05-05 1971-12-14 Gen Electric Passivated semiconductor device with peripheral protective junction
JPS5621266B2 (fr) * 1973-10-05 1981-05-18
US4190853A (en) * 1974-07-15 1980-02-26 Hutson Jearld L Multilayer semiconductor switching devices
US3996601A (en) * 1974-07-15 1976-12-07 Hutson Jerald L Shorting structure for multilayer semiconductor switching devices
US3972014A (en) * 1974-11-11 1976-07-27 Hutson Jearld L Four quadrant symmetrical semiconductor switch
JPS5346285A (en) * 1976-10-08 1978-04-25 Hitachi Ltd Mesa type high breakdown voltage semiconductor device
JPS5724558A (en) * 1980-07-22 1982-02-09 Nec Corp Semicondctor device
JPS5745278A (en) * 1980-08-29 1982-03-15 Mitsubishi Electric Corp 3-terminal bidirectional thyristor
FR2574594B1 (fr) * 1984-12-11 1987-01-16 Silicium Semiconducteur Ssc Structure integree de triac a commande par diac
JPH02114669A (ja) * 1988-10-25 1990-04-26 Sharp Corp メサ型トライアック
JPH02184026A (ja) * 1989-01-11 1990-07-18 Sharp Corp 半導体装置の形成方法

Also Published As

Publication number Publication date
WO1994028586A1 (fr) 1994-12-08
EP0702412A4 (fr) 1999-06-09
NO954863D0 (no) 1995-11-30
EP0702412A1 (fr) 1996-03-20
JPH06342902A (ja) 1994-12-13
CA2164339A1 (fr) 1994-12-08
US5900651A (en) 1999-05-04

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