PL1498950T3 - Urządzenie ze scalonymi układami hybrydowymi o częstotliwości mikrofalowej z ekranowaniem przez zestykowy(e) element(y) sprężysty(e) - Google Patents

Urządzenie ze scalonymi układami hybrydowymi o częstotliwości mikrofalowej z ekranowaniem przez zestykowy(e) element(y) sprężysty(e)

Info

Publication number
PL1498950T3
PL1498950T3 PL04291722T PL04291722T PL1498950T3 PL 1498950 T3 PL1498950 T3 PL 1498950T3 PL 04291722 T PL04291722 T PL 04291722T PL 04291722 T PL04291722 T PL 04291722T PL 1498950 T3 PL1498950 T3 PL 1498950T3
Authority
PL
Poland
Prior art keywords
shielded
integrated circuits
spring contact
microwave frequency
hybrid integrated
Prior art date
Application number
PL04291722T
Other languages
English (en)
Inventor
Claude Drevon
Mathieu Paillard
Original Assignee
Alcatel Lucent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent filed Critical Alcatel Lucent
Publication of PL1498950T3 publication Critical patent/PL1498950T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Constitution Of High-Frequency Heating (AREA)
  • Casings For Electric Apparatus (AREA)
PL04291722T 2003-07-18 2004-07-07 Urządzenie ze scalonymi układami hybrydowymi o częstotliwości mikrofalowej z ekranowaniem przez zestykowy(e) element(y) sprężysty(e) PL1498950T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0308773A FR2857819B1 (fr) 2003-07-18 2003-07-18 Dispositif a circuits hybrides hyperfrequences a blindage par element(s)de contact elastique(s)
EP04291722A EP1498950B1 (fr) 2003-07-18 2004-07-07 Dispositif à circuits hybrides hyperfréquences à blindage par élèments(s) de contact élastiques(s)

Publications (1)

Publication Number Publication Date
PL1498950T3 true PL1498950T3 (pl) 2009-06-30

Family

ID=33462558

Family Applications (1)

Application Number Title Priority Date Filing Date
PL04291722T PL1498950T3 (pl) 2003-07-18 2004-07-07 Urządzenie ze scalonymi układami hybrydowymi o częstotliwości mikrofalowej z ekranowaniem przez zestykowy(e) element(y) sprężysty(e)

Country Status (10)

Country Link
US (1) US7180393B2 (pl)
EP (1) EP1498950B1 (pl)
JP (1) JP2005123572A (pl)
AT (1) ATE419649T1 (pl)
CA (1) CA2472900A1 (pl)
DE (1) DE602004018712D1 (pl)
DK (1) DK1498950T3 (pl)
ES (1) ES2320447T3 (pl)
FR (1) FR2857819B1 (pl)
PL (1) PL1498950T3 (pl)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100951266B1 (ko) 2007-12-07 2010-04-02 삼성전기주식회사 세라믹 패키지 밀봉장치
EP2398114A1 (en) * 2010-06-15 2011-12-21 Research in Motion Limited Spring finger grounding component and method of manufacture
US20110306252A1 (en) * 2010-06-15 2011-12-15 Research In Motion Limited Spring finger grounding component and method of manufacture
CN105304986A (zh) * 2014-06-17 2016-02-03 中兴通讯股份有限公司 一种滤波器盖板、滤波器及滤波器盖板加工方法
DE102016106135A1 (de) * 2016-04-04 2017-10-05 Vishay Semiconductor Gmbh Elektronische Einheit
US11243675B1 (en) 2021-02-12 2022-02-08 Honda Motor Co., Ltd. Method and system for enriching cross-brand user in interface experiences

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03268396A (ja) * 1990-03-16 1991-11-29 Fujitsu Ltd マイクロ波回路筐体の遮蔽構造
DE19609718C1 (de) * 1996-03-13 1997-06-26 Bosch Gmbh Robert Hochfrequenzdichte Abschirmung
DE19728839C1 (de) * 1997-07-05 1998-09-03 Bosch Gmbh Robert Abschirmgehäuse für Mikrowellenschaltungen
JP3842983B2 (ja) * 2001-03-29 2006-11-08 三洋電機株式会社 シールドケース

Also Published As

Publication number Publication date
EP1498950B1 (fr) 2008-12-31
FR2857819A1 (fr) 2005-01-21
DK1498950T3 (da) 2009-04-14
JP2005123572A (ja) 2005-05-12
CA2472900A1 (fr) 2005-01-18
DE602004018712D1 (de) 2009-02-12
ATE419649T1 (de) 2009-01-15
EP1498950A1 (fr) 2005-01-19
FR2857819B1 (fr) 2008-11-28
US7180393B2 (en) 2007-02-20
ES2320447T3 (es) 2009-05-22
US20050012574A1 (en) 2005-01-20

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