ATE419649T1 - Vorrichtung für mikrowellenhybridschaltungen mit federnden kontaktelementen zur elektromagnetischen abschirmung - Google Patents

Vorrichtung für mikrowellenhybridschaltungen mit federnden kontaktelementen zur elektromagnetischen abschirmung

Info

Publication number
ATE419649T1
ATE419649T1 AT04291722T AT04291722T ATE419649T1 AT E419649 T1 ATE419649 T1 AT E419649T1 AT 04291722 T AT04291722 T AT 04291722T AT 04291722 T AT04291722 T AT 04291722T AT E419649 T1 ATE419649 T1 AT E419649T1
Authority
AT
Austria
Prior art keywords
contact elements
electromagnetic shielding
resilient contact
hybrid circuits
microwave hybrid
Prior art date
Application number
AT04291722T
Other languages
English (en)
Inventor
Claude Drevon
Mathieu Paillard
Original Assignee
Alcatel Lucent
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Lucent filed Critical Alcatel Lucent
Application granted granted Critical
Publication of ATE419649T1 publication Critical patent/ATE419649T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0037—Housings with compartments containing a PCB, e.g. partitioning walls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W44/00—Electrical arrangements for controlling or matching impedance
    • H10W44/20—Electrical arrangements for controlling or matching impedance at high-frequency [HF] or radio frequency [RF]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Constitution Of High-Frequency Heating (AREA)
  • Casings For Electric Apparatus (AREA)
AT04291722T 2003-07-18 2004-07-07 Vorrichtung für mikrowellenhybridschaltungen mit federnden kontaktelementen zur elektromagnetischen abschirmung ATE419649T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0308773A FR2857819B1 (fr) 2003-07-18 2003-07-18 Dispositif a circuits hybrides hyperfrequences a blindage par element(s)de contact elastique(s)

Publications (1)

Publication Number Publication Date
ATE419649T1 true ATE419649T1 (de) 2009-01-15

Family

ID=33462558

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04291722T ATE419649T1 (de) 2003-07-18 2004-07-07 Vorrichtung für mikrowellenhybridschaltungen mit federnden kontaktelementen zur elektromagnetischen abschirmung

Country Status (10)

Country Link
US (1) US7180393B2 (de)
EP (1) EP1498950B1 (de)
JP (1) JP2005123572A (de)
AT (1) ATE419649T1 (de)
CA (1) CA2472900A1 (de)
DE (1) DE602004018712D1 (de)
DK (1) DK1498950T3 (de)
ES (1) ES2320447T3 (de)
FR (1) FR2857819B1 (de)
PL (1) PL1498950T3 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100951266B1 (ko) 2007-12-07 2010-04-02 삼성전기주식회사 세라믹 패키지 밀봉장치
EP2398114A1 (de) * 2010-06-15 2011-12-21 Research in Motion Limited Federfingererdungskomponente und Herstellungsverfahren
US20110306252A1 (en) * 2010-06-15 2011-12-15 Research In Motion Limited Spring finger grounding component and method of manufacture
CN105304986A (zh) * 2014-06-17 2016-02-03 中兴通讯股份有限公司 一种滤波器盖板、滤波器及滤波器盖板加工方法
DE102016106135A1 (de) * 2016-04-04 2017-10-05 Vishay Semiconductor Gmbh Elektronische Einheit
US11243675B1 (en) 2021-02-12 2022-02-08 Honda Motor Co., Ltd. Method and system for enriching cross-brand user in interface experiences

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03268396A (ja) * 1990-03-16 1991-11-29 Fujitsu Ltd マイクロ波回路筐体の遮蔽構造
DE19609718C1 (de) * 1996-03-13 1997-06-26 Bosch Gmbh Robert Hochfrequenzdichte Abschirmung
DE19728839C1 (de) * 1997-07-05 1998-09-03 Bosch Gmbh Robert Abschirmgehäuse für Mikrowellenschaltungen
JP3842983B2 (ja) * 2001-03-29 2006-11-08 三洋電機株式会社 シールドケース

Also Published As

Publication number Publication date
EP1498950B1 (de) 2008-12-31
PL1498950T3 (pl) 2009-06-30
FR2857819A1 (fr) 2005-01-21
DK1498950T3 (da) 2009-04-14
JP2005123572A (ja) 2005-05-12
CA2472900A1 (fr) 2005-01-18
DE602004018712D1 (de) 2009-02-12
EP1498950A1 (de) 2005-01-19
FR2857819B1 (fr) 2008-11-28
US7180393B2 (en) 2007-02-20
ES2320447T3 (es) 2009-05-22
US20050012574A1 (en) 2005-01-20

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Legal Events

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