PL1952427T3 - Urządzenie i sposób obróbki chemicznej na mokro płaskich, cienkich substratów w procesie ciągłym - Google Patents

Urządzenie i sposób obróbki chemicznej na mokro płaskich, cienkich substratów w procesie ciągłym

Info

Publication number
PL1952427T3
PL1952427T3 PL06829090T PL06829090T PL1952427T3 PL 1952427 T3 PL1952427 T3 PL 1952427T3 PL 06829090 T PL06829090 T PL 06829090T PL 06829090 T PL06829090 T PL 06829090T PL 1952427 T3 PL1952427 T3 PL 1952427T3
Authority
PL
Poland
Prior art keywords
flat
wet chemical
continuous process
chemical treatment
thin substrates
Prior art date
Application number
PL06829090T
Other languages
English (en)
Other versions
PL1952427T5 (pl
Inventor
Horst Kunze-Concewitz
Original Assignee
Acp Advanced Clean Production Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=37709722&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=PL1952427(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Acp Advanced Clean Production Gmbh filed Critical Acp Advanced Clean Production Gmbh
Publication of PL1952427T3 publication Critical patent/PL1952427T3/pl
Publication of PL1952427T5 publication Critical patent/PL1952427T5/pl

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C1/00—Apparatus in which liquid or other fluent material is applied to the surface of the work by contact with a member carrying the liquid or other fluent material, e.g. a porous member loaded with a liquid to be applied as a coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/20—Cleaning of moving articles, e.g. of moving webs or of objects on a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts

Landscapes

  • Cleaning In General (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Weting (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • ing And Chemical Polishing (AREA)
PL06829090T 2005-11-26 2006-11-22 Urządzenie i sposób obróbki chemicznej na mokro płaskich, cienkich substratów w procesie ciągłym PL1952427T5 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005057109A DE102005057109A1 (de) 2005-11-26 2005-11-26 Vorrichtung und Verfahren für mechanisches Prozessieren flacher, dünner Substrate im Durchlaufverfahren
PCT/EP2006/011166 WO2007059925A1 (de) 2005-11-26 2006-11-22 Vorrichtung und verfahren für nasschemisches prozessieren flacher, dünner substrate im durchlaufverfahren
EP20060829090 EP1952427B2 (de) 2005-11-26 2006-11-22 Vorrichtung und verfahren für nasschemisches prozessieren flacher, dünner substrate im durchlaufverfahren

Publications (2)

Publication Number Publication Date
PL1952427T3 true PL1952427T3 (pl) 2012-04-30
PL1952427T5 PL1952427T5 (pl) 2015-10-30

Family

ID=37709722

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06829090T PL1952427T5 (pl) 2005-11-26 2006-11-22 Urządzenie i sposób obróbki chemicznej na mokro płaskich, cienkich substratów w procesie ciągłym

Country Status (10)

Country Link
US (2) US20090032492A1 (pl)
EP (1) EP1952427B2 (pl)
JP (1) JP4939545B2 (pl)
KR (1) KR101371818B1 (pl)
CN (1) CN101313384B (pl)
AT (1) ATE532207T1 (pl)
CA (1) CA2630885C (pl)
DE (1) DE102005057109A1 (pl)
PL (1) PL1952427T5 (pl)
WO (1) WO2007059925A1 (pl)

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DE102007063202A1 (de) * 2007-12-19 2009-06-25 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zur Behandlung von Silizium-Wafern
DE102008022282A1 (de) * 2008-04-24 2009-10-29 Gebr. Schmid Gmbh & Co. Einrichtung und Verfahren zur Behandlung von Silizium-Wafern oder flachen Gegenständen
DE102008026199B3 (de) * 2008-05-30 2009-10-08 Rena Gmbh Vorrichtung und Verfahren zur elektrischen Kontaktierung von ebenem Gut in Durchlaufanlagen
NL2001642C2 (nl) * 2008-05-30 2009-12-01 Fico Bv Inrichting en werkwijze voor het drogen van gesepareerde elektronische componenten.
KR101040352B1 (ko) * 2008-12-03 2011-06-10 (주)와이티에스 디스플레이 패널 세정장치용 스팀 롤러
US8551386B2 (en) * 2009-08-03 2013-10-08 S.D. Warren Company Imparting texture to cured powder coatings
KR101131330B1 (ko) * 2009-10-22 2012-04-04 삼성전기주식회사 액절장치
KR101118929B1 (ko) * 2010-09-13 2012-02-27 주성엔지니어링(주) 박막형 태양전지의 제조 장치 및 제조 방법
CN102586779A (zh) * 2011-11-30 2012-07-18 常州亿晶光电科技有限公司 一种离液式硅片湿法刻蚀装置
KR102023897B1 (ko) * 2012-05-03 2019-09-25 주식회사 탑 엔지니어링 기판 식각 장치
CA2882179A1 (en) * 2012-08-23 2014-02-27 Gary S. Selwyn Chemical stick finishing method and apparatus
JP6379095B2 (ja) * 2012-09-19 2018-08-22 インヴィスタ テキスタイルズ（ユー．ケー．）リミテッド カーペット糸に色および性能化学薬品を適用するための装置および方法
DE102014222737B4 (de) * 2014-05-16 2021-06-10 Singulus Stangl Solar Gmbh Vorrichtung zum Behandeln der Unterseite und der Kanten eines Guts mit einer Flüssigkeit und Verfahren zum Herstellen eines auf einer Unterseite mit einer Flüssigkeit behandelten Guts
US9757747B2 (en) 2014-05-27 2017-09-12 Palo Alto Research Center Incorporated Methods and systems for creating aerosols
US9527056B2 (en) * 2014-05-27 2016-12-27 Palo Alto Research Center Incorporated Methods and systems for creating aerosols
DE102014110222B4 (de) * 2014-07-21 2016-06-23 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Strukturierung von Ober- und Unterseite eines Halbleitersubstrats
DE102014119090B4 (de) * 2014-12-18 2022-12-01 Hanwha Q Cells Gmbh In-line-Nassbankvorrichtung und Verfahren für die nasschemische Bearbeitung von Halbleiterwafern
TWI623359B (zh) * 2017-03-17 2018-05-11 Manz Taiwan Ltd. 基板清洗方法與清洗設備
WO2018201346A1 (zh) * 2017-05-03 2018-11-08 深圳市柔宇科技有限公司 清洁装置和柔性显示器的制造设备
US10493483B2 (en) 2017-07-17 2019-12-03 Palo Alto Research Center Incorporated Central fed roller for filament extension atomizer
DE102017212442A1 (de) * 2017-07-20 2019-01-24 Singulus Technologies Ag Verfahren und Vorrichtung zum Texturieren einer Oberfläche eines multikristallinen Diamantdraht-gesägten Siliziumsubstrats unter Verwendung von ozonhaltigem Medium
US10464094B2 (en) 2017-07-31 2019-11-05 Palo Alto Research Center Incorporated Pressure induced surface wetting for enhanced spreading and controlled filament size
EP3460578B1 (en) * 2017-09-25 2022-10-26 Glunz & Jensen A/S System for processing flexographic printing plates
JP2021004149A (ja) * 2019-06-26 2021-01-14 日本電気硝子株式会社 ガラス板の洗浄装置及びガラス板の製造方法
CN110976363A (zh) * 2019-12-24 2020-04-10 安徽达顺不锈钢有限公司 一种具有输送功能的钢卷用清洗机
CN113996576B (zh) * 2021-10-29 2023-05-12 浙江海丰生物科技股份有限公司 一种切叶束正反面分段式连续自动清洗方法
CN116553063B (zh) * 2023-04-23 2023-11-03 宇弘研科技(苏州)有限公司 一种可调节的传送夹持结构及半导体输送设备

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Also Published As

Publication number Publication date
CN101313384B (zh) 2011-05-11
JP2009517854A (ja) 2009-04-30
CN101313384A (zh) 2008-11-26
EP1952427B2 (de) 2015-05-13
EP1952427A1 (de) 2008-08-06
EP1952427B1 (de) 2011-11-02
PL1952427T5 (pl) 2015-10-30
CA2630885C (en) 2014-02-18
JP4939545B2 (ja) 2012-05-30
US20090032492A1 (en) 2009-02-05
US20150162225A1 (en) 2015-06-11
CA2630885A1 (en) 2007-05-31
KR101371818B1 (ko) 2014-03-07
KR20080084926A (ko) 2008-09-22
ATE532207T1 (de) 2011-11-15
DE102005057109A1 (de) 2007-05-31
WO2007059925A1 (de) 2007-05-31

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