PL1969069T3 - Zmatowiona silanizowana krzemionka - Google Patents

Zmatowiona silanizowana krzemionka

Info

Publication number
PL1969069T3
PL1969069T3 PL06830358T PL06830358T PL1969069T3 PL 1969069 T3 PL1969069 T3 PL 1969069T3 PL 06830358 T PL06830358 T PL 06830358T PL 06830358 T PL06830358 T PL 06830358T PL 1969069 T3 PL1969069 T3 PL 1969069T3
Authority
PL
Poland
Prior art keywords
silanized silica
fumed silanized
fumed
silica
silanized
Prior art date
Application number
PL06830358T
Other languages
English (en)
Inventor
Jürgen Meyer
Mario Scholz
Original Assignee
Evonik Degussa Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evonik Degussa Gmbh filed Critical Evonik Degussa Gmbh
Publication of PL1969069T3 publication Critical patent/PL1969069T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C01B33/181—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process
    • C01B33/183—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof by a dry process by oxidation or hydrolysis in the vapour phase of silicon compounds such as halides, trichlorosilane, monosilane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK  ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
    • C09C1/00—Treatment of specific inorganic materials other than fibrous fillers; Preparation of carbon black
    • C09C1/28—Compounds of silicon
    • C09C1/30—Silicic acid
    • C09C1/3081—Treatment with organo-silicon compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/51—Particles with a specific particle size distribution
    • C01P2004/52—Particles with a specific particle size distribution highly monodisperse size distribution
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/11—Powder tap density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/22—Rheological behaviour as dispersion, e.g. viscosity, sedimentation stability
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Compounds (AREA)
PL06830358T 2005-12-23 2006-12-05 Zmatowiona silanizowana krzemionka PL1969069T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05112922A EP1801166A1 (de) 2005-12-23 2005-12-23 Pyrogen hergestelltes silanisiertes Siliciumdioxid
PCT/EP2006/069308 WO2007071553A1 (en) 2005-12-23 2006-12-05 Fumed silanized silica
EP06830358.5A EP1969069B1 (en) 2005-12-23 2006-12-05 Fumed silanized silica

Publications (1)

Publication Number Publication Date
PL1969069T3 true PL1969069T3 (pl) 2014-01-31

Family

ID=36095747

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06830358T PL1969069T3 (pl) 2005-12-23 2006-12-05 Zmatowiona silanizowana krzemionka

Country Status (7)

Country Link
US (2) US8211971B2 (pl)
EP (2) EP1801166A1 (pl)
JP (1) JP5114425B2 (pl)
CN (2) CN101346439B (pl)
ES (1) ES2435082T3 (pl)
PL (1) PL1969069T3 (pl)
WO (1) WO2007071553A1 (pl)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004021092A1 (de) * 2004-04-29 2005-11-24 Degussa Ag Verwendung einer kationischen Siliciumdioxid-Dispersion als Textilveredlungsmittel
DE102007024095A1 (de) * 2007-05-22 2008-11-27 Evonik Degussa Gmbh Hydrophobe pyrogen hergestellte Kieselsäure und Silikonkautschukmassen, enthaltend die pyrogene Kieselsäure
DE102007024365A1 (de) * 2007-05-22 2008-11-27 Evonik Degussa Gmbh Pyrogen hergestellte silanisierte und vermahlene Kieselsäure
FR2925511A1 (fr) * 2007-12-20 2009-06-26 Bluestar Silicones France Soc Composition organopolysiloxanique vulcanisable a temperature ambiante en elastomere et nouveaux catalyseurs de polycondensation d'organopolysiloxanes.
DE102008017731A1 (de) * 2008-04-07 2009-10-08 Continental Aktiengesellschaft Kautschukmischung
CN101987927A (zh) * 2009-08-05 2011-03-23 任绍志 一种多元硅烷改性纳米二氧化硅的制备方法
WO2011150004A2 (en) 2010-05-25 2011-12-01 The Procter & Gamble Company Oral care compositions and methods of making oral care compositions comprising silica from plant materials
CN103732536B (zh) * 2011-07-29 2016-08-24 电气化学工业株式会社 球形硅石微粉末以及使用球形硅石微粉末的静电图像显影用调色剂外部添加剂
DE102012211121A1 (de) 2012-06-28 2014-01-02 Evonik Industries Ag Granuläre, funktionalisierte Kieselsäure, Verfahren zu deren Herstellung und deren Verwendung
KR20150023868A (ko) 2012-06-29 2015-03-05 쓰리엠 이노베이티브 프로퍼티즈 컴파니 실세스퀴옥산-유사 입자
CN113950511B (zh) * 2019-06-21 2024-01-16 美国陶氏有机硅公司 用于制备触变可固化有机硅组合物的方法
US12378363B2 (en) 2019-06-21 2025-08-05 Dow Silicones Corporation Thermal conductive silicone composition
JP7562370B2 (ja) * 2020-10-27 2024-10-07 キヤノン株式会社 トナー
JP7560997B2 (ja) * 2020-10-27 2024-10-03 キヤノン株式会社 トナー及び画像形成方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2344388B2 (de) * 1973-09-03 1978-06-22 Elektroschmelzwerk Kempten Gmbh, 8000 Muenchen Verfahren zum Herstellen von hydrophobem Siliciumdioxyd
DE3139070A1 (de) 1981-10-01 1983-04-21 Degussa Ag, 6000 Frankfurt Verfahren zur verringerung des grindometerwertes von hochdispersen kieselsaeuren
JPH0627267B2 (ja) * 1985-09-11 1994-04-13 東芝シリコ−ン株式会社 室温硬化性ポリオルガノシロキサン組成物
JP3291588B2 (ja) * 1992-05-27 2002-06-10 日本アエロジル株式会社 樹脂充填材用二酸化珪素微粉末
JPH0627267A (ja) 1992-07-10 1994-02-04 Seiko Instr Inc 複合表示電子時計
JP2000256008A (ja) * 1999-03-08 2000-09-19 Tokuyama Corp 疎水性煙霧シリカ及びその製造方法
EP1199335B1 (de) * 2000-10-21 2010-12-22 Evonik Degussa GmbH Funktionalisierte Kieselsäuren
ATE496098T1 (de) * 2000-10-21 2011-02-15 Evonik Degussa Gmbh Strahlenhärtende lacksysteme
EP1199336B1 (de) * 2000-10-21 2014-01-15 Evonik Degussa GmbH Funktionalisierte, strukturmodifizierte Kieselsäuren
DE10109484A1 (de) * 2001-02-28 2002-09-12 Degussa Oberflächenmodifizierte, dotierte, pyrogen hergestellte Oxide
EP1295906A1 (de) * 2001-09-20 2003-03-26 Degussa AG Silikonkautschukformulierungen mit hydrophoben Kieselsäuren
DE10203500A1 (de) * 2002-01-30 2003-08-07 Degussa Raumtemperaturvernetzende Einkomponenten-Silikonkautschukformulierungen mit hydrophoben Kieselsäuren
DE10239423A1 (de) * 2002-08-28 2004-03-11 Degussa Ag Kieselsäure
DE10239424A1 (de) 2002-08-28 2004-03-11 Degussa Ag Kieselsäuren

Also Published As

Publication number Publication date
ES2435082T3 (es) 2013-12-18
CN1986404A (zh) 2007-06-27
US20120220694A1 (en) 2012-08-30
JP5114425B2 (ja) 2013-01-09
EP1969069A1 (en) 2008-09-17
CN101346439A (zh) 2009-01-14
CN101346439B (zh) 2012-08-29
EP1801166A1 (de) 2007-06-27
US8552107B2 (en) 2013-10-08
US8211971B2 (en) 2012-07-03
US20090298982A1 (en) 2009-12-03
WO2007071553A1 (en) 2007-06-28
JP2009520667A (ja) 2009-05-28
EP1969069B1 (en) 2013-08-21

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