PL2024991T3 - Sposób wytwarzania domieszkowanego kryształu III-N - Google Patents

Sposób wytwarzania domieszkowanego kryształu III-N

Info

Publication number
PL2024991T3
PL2024991T3 PL06776716T PL06776716T PL2024991T3 PL 2024991 T3 PL2024991 T3 PL 2024991T3 PL 06776716 T PL06776716 T PL 06776716T PL 06776716 T PL06776716 T PL 06776716T PL 2024991 T3 PL2024991 T3 PL 2024991T3
Authority
PL
Poland
Prior art keywords
crystal
producing
doped iii
doped
iii
Prior art date
Application number
PL06776716T
Other languages
English (en)
Inventor
Ferdinand Scholz
Peter Brückner
Frank Habel
Gunnar Leibiger
Original Assignee
Freiberger Compound Mat Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freiberger Compound Mat Gmbh filed Critical Freiberger Compound Mat Gmbh
Publication of PL2024991T3 publication Critical patent/PL2024991T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403—AIII-nitrides
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02—Epitaxial-layer growth
    • C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H10P14/2907—Materials being Group IIIA-VA materials
    • H10P14/2908—Nitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2926—Crystal orientations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3416—Nitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3446—Transition metal elements; Rare earth elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
    • H10F71/1272—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising at least three elements, e.g. GaAlAs or InGaAsP

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
PL06776716T 2006-08-09 2006-08-09 Sposób wytwarzania domieszkowanego kryształu III-N PL2024991T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/EP2006/007894 WO2008017320A1 (de) 2006-08-09 2006-08-09 Verfahren zur herstellung eines dotierten iii-n-massivkristalls sowie eines freistehenden dotierten iii-n-substrates und dotierter iii-n-massivkristall sowie freistehendes dotiertes iii-n-substrat
EP06776716A EP2024991B1 (de) 2006-08-09 2006-08-09 Verfahren zur herstellung eines dotierten iii-n-kristalls

Publications (1)

Publication Number Publication Date
PL2024991T3 true PL2024991T3 (pl) 2013-03-29

Family

ID=37401600

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06776716T PL2024991T3 (pl) 2006-08-09 2006-08-09 Sposób wytwarzania domieszkowanego kryształu III-N

Country Status (5)

Country Link
EP (1) EP2024991B1 (pl)
JP (1) JP5298015B2 (pl)
CN (1) CN101506947B (pl)
PL (1) PL2024991T3 (pl)
WO (1) WO2008017320A1 (pl)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012012292A (ja) * 2010-05-31 2012-01-19 Mitsubishi Chemicals Corp Iii族窒化物結晶の製造方法、および該製造方法により得られるiii族窒化物結晶、iii族窒化物結晶基板
JP2016115794A (ja) * 2014-12-15 2016-06-23 日亜化学工業株式会社 窒化物半導体テンプレートの製造方法
JP6001129B2 (ja) * 2015-04-15 2016-10-05 住友化学株式会社 ハイドライド気相成長装置
CN105442045A (zh) * 2015-06-25 2016-03-30 苏州纳维科技有限公司 低杂质浓度半绝缘GaN单晶及其制备方法与应用
CN106918477B (zh) * 2015-12-24 2019-09-27 中芯国际集成电路制造(上海)有限公司 用于透射电子显微镜俯视观察的芯片样品制备方法
JP6948091B2 (ja) 2018-12-26 2021-10-13 国立大学法人東海国立大学機構 気相成長装置
US20220205133A1 (en) * 2019-04-25 2022-06-30 Aledia Enhanced doping using alloy based sources
DE102019008930A1 (de) * 2019-12-20 2021-06-24 Azur Space Solar Power Gmbh Gasphasenepitaxieverfahren
DE102019008928B9 (de) * 2019-12-20 2021-08-26 Azur Space Solar Power Gmbh Gasphasenepitaxieverfahren
WO2025196855A1 (ja) * 2024-03-18 2025-09-25 日本碍子株式会社 Iii族元素窒化物基板、貼合せ基板、半導体素子およびiii族元素窒化物基板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2872096B2 (ja) * 1996-01-19 1999-03-17 日本電気株式会社 低抵抗p型窒化ガリウム系化合物半導体の気相成長方法
RU2097452C1 (ru) * 1996-02-22 1997-11-27 Юрий Александрович Водаков Способ эпитаксиального выращивания монокристаллов нитридов металлов 3а группы химических элементов
AU4596500A (en) * 1999-05-13 2000-12-05 Emf Ireland Limited Method and apparatus for epitaxially growing a material on substrate
US6596079B1 (en) * 2000-03-13 2003-07-22 Advanced Technology Materials, Inc. III-V nitride substrate boule and method of making and using the same
JP4511006B2 (ja) * 2000-09-01 2010-07-28 独立行政法人理化学研究所 半導体の不純物ドーピング方法
SG125069A1 (en) * 2001-05-17 2006-09-29 Sumitomo Chemical Co Method and system for manufacturing III-V group compound semiconductor and III-V group compound semiconductor
JP3886341B2 (ja) * 2001-05-21 2007-02-28 日本電気株式会社 窒化ガリウム結晶基板の製造方法及び窒化ガリウム結晶基板
AU2002347692C1 (en) * 2001-10-26 2008-03-06 Ammono Sp. Zo.O. Bulk monocrystalline gallium nitride
JP5260831B2 (ja) * 2006-01-05 2013-08-14 古河機械金属株式会社 Iii族窒化物半導体結晶の製造方法、iii族窒化物半導体基板の製造方法および半導体装置の製造方法

Also Published As

Publication number Publication date
JP5298015B2 (ja) 2013-09-25
WO2008017320A1 (de) 2008-02-14
JP2010500267A (ja) 2010-01-07
CN101506947B (zh) 2011-06-08
EP2024991B1 (de) 2012-10-17
CN101506947A (zh) 2009-08-12
EP2024991A1 (de) 2009-02-18

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