PL2024991T3 - Sposób wytwarzania domieszkowanego kryształu III-N - Google Patents
Sposób wytwarzania domieszkowanego kryształu III-NInfo
- Publication number
- PL2024991T3 PL2024991T3 PL06776716T PL06776716T PL2024991T3 PL 2024991 T3 PL2024991 T3 PL 2024991T3 PL 06776716 T PL06776716 T PL 06776716T PL 06776716 T PL06776716 T PL 06776716T PL 2024991 T3 PL2024991 T3 PL 2024991T3
- Authority
- PL
- Poland
- Prior art keywords
- crystal
- producing
- doped iii
- doped
- iii
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2901—Materials
- H10P14/2907—Materials being Group IIIA-VA materials
- H10P14/2908—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
- H10P14/2926—Crystal orientations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
- H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
- H10P14/3416—Nitrides
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/34—Deposited materials, e.g. layers
- H10P14/3438—Doping during depositing
- H10P14/3441—Conductivity type
- H10P14/3446—Transition metal elements; Rare earth elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
- H10P14/38—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/127—The active layers comprising only Group III-V materials, e.g. GaAs or InP
- H10F71/1272—The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising at least three elements, e.g. GaAlAs or InGaAsP
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP06776716A EP2024991B1 (de) | 2006-08-09 | 2006-08-09 | Verfahren zur herstellung eines dotierten iii-n-kristalls |
| PCT/EP2006/007894 WO2008017320A1 (de) | 2006-08-09 | 2006-08-09 | Verfahren zur herstellung eines dotierten iii-n-massivkristalls sowie eines freistehenden dotierten iii-n-substrates und dotierter iii-n-massivkristall sowie freistehendes dotiertes iii-n-substrat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL2024991T3 true PL2024991T3 (pl) | 2013-03-29 |
Family
ID=37401600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL06776716T PL2024991T3 (pl) | 2006-08-09 | 2006-08-09 | Sposób wytwarzania domieszkowanego kryształu III-N |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP2024991B1 (pl) |
| JP (1) | JP5298015B2 (pl) |
| CN (1) | CN101506947B (pl) |
| PL (1) | PL2024991T3 (pl) |
| WO (1) | WO2008017320A1 (pl) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012012292A (ja) * | 2010-05-31 | 2012-01-19 | Mitsubishi Chemicals Corp | Iii族窒化物結晶の製造方法、および該製造方法により得られるiii族窒化物結晶、iii族窒化物結晶基板 |
| JP2016115794A (ja) * | 2014-12-15 | 2016-06-23 | 日亜化学工業株式会社 | 窒化物半導体テンプレートの製造方法 |
| JP6001129B2 (ja) * | 2015-04-15 | 2016-10-05 | 住友化学株式会社 | ハイドライド気相成長装置 |
| CN105442045A (zh) * | 2015-06-25 | 2016-03-30 | 苏州纳维科技有限公司 | 低杂质浓度半绝缘GaN单晶及其制备方法与应用 |
| CN106918477B (zh) * | 2015-12-24 | 2019-09-27 | 中芯国际集成电路制造(上海)有限公司 | 用于透射电子显微镜俯视观察的芯片样品制备方法 |
| US11371165B2 (en) | 2018-12-26 | 2022-06-28 | National University Corporation Tokai National Higher Education And Research System | Vapor phase epitaxial growth device |
| WO2020219697A1 (en) * | 2019-04-25 | 2020-10-29 | Aledia | Enhanced doping using alloy based sources |
| DE102019008930A1 (de) * | 2019-12-20 | 2021-06-24 | Azur Space Solar Power Gmbh | Gasphasenepitaxieverfahren |
| DE102019008928B9 (de) * | 2019-12-20 | 2021-08-26 | Azur Space Solar Power Gmbh | Gasphasenepitaxieverfahren |
| WO2025196855A1 (ja) * | 2024-03-18 | 2025-09-25 | 日本碍子株式会社 | Iii族元素窒化物基板、貼合せ基板、半導体素子およびiii族元素窒化物基板の製造方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2872096B2 (ja) * | 1996-01-19 | 1999-03-17 | 日本電気株式会社 | 低抵抗p型窒化ガリウム系化合物半導体の気相成長方法 |
| RU2097452C1 (ru) * | 1996-02-22 | 1997-11-27 | Юрий Александрович Водаков | Способ эпитаксиального выращивания монокристаллов нитридов металлов 3а группы химических элементов |
| JP4790914B2 (ja) * | 1999-05-13 | 2011-10-12 | ヴィーコ・プロセス・イクウィップメント・インコーポレーテッド | 基板上に材料をエピタキシャル成長させるための方法と装置 |
| US6596079B1 (en) * | 2000-03-13 | 2003-07-22 | Advanced Technology Materials, Inc. | III-V nitride substrate boule and method of making and using the same |
| JP4511006B2 (ja) * | 2000-09-01 | 2010-07-28 | 独立行政法人理化学研究所 | 半導体の不純物ドーピング方法 |
| SG125069A1 (en) * | 2001-05-17 | 2006-09-29 | Sumitomo Chemical Co | Method and system for manufacturing III-V group compound semiconductor and III-V group compound semiconductor |
| JP3886341B2 (ja) * | 2001-05-21 | 2007-02-28 | 日本電気株式会社 | 窒化ガリウム結晶基板の製造方法及び窒化ガリウム結晶基板 |
| PL225235B1 (pl) * | 2001-10-26 | 2017-03-31 | Ammono Spółka Z Ograniczoną Odpowiedzialnością | Objętościowy monokryształ azotkowy oraz jego zastosowanie jako podłoże do epitaksji |
| JP5260831B2 (ja) * | 2006-01-05 | 2013-08-14 | 古河機械金属株式会社 | Iii族窒化物半導体結晶の製造方法、iii族窒化物半導体基板の製造方法および半導体装置の製造方法 |
-
2006
- 2006-08-09 JP JP2009523151A patent/JP5298015B2/ja not_active Expired - Fee Related
- 2006-08-09 CN CN2006800555691A patent/CN101506947B/zh active Active
- 2006-08-09 WO PCT/EP2006/007894 patent/WO2008017320A1/de not_active Ceased
- 2006-08-09 EP EP06776716A patent/EP2024991B1/de active Active
- 2006-08-09 PL PL06776716T patent/PL2024991T3/pl unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JP2010500267A (ja) | 2010-01-07 |
| EP2024991B1 (de) | 2012-10-17 |
| CN101506947A (zh) | 2009-08-12 |
| JP5298015B2 (ja) | 2013-09-25 |
| EP2024991A1 (de) | 2009-02-18 |
| CN101506947B (zh) | 2011-06-08 |
| WO2008017320A1 (de) | 2008-02-14 |
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