PL2024991T3 - Sposób wytwarzania domieszkowanego kryształu III-N - Google Patents

Sposób wytwarzania domieszkowanego kryształu III-N

Info

Publication number
PL2024991T3
PL2024991T3 PL06776716T PL06776716T PL2024991T3 PL 2024991 T3 PL2024991 T3 PL 2024991T3 PL 06776716 T PL06776716 T PL 06776716T PL 06776716 T PL06776716 T PL 06776716T PL 2024991 T3 PL2024991 T3 PL 2024991T3
Authority
PL
Poland
Prior art keywords
crystal
producing
doped iii
doped
iii
Prior art date
Application number
PL06776716T
Other languages
English (en)
Inventor
Ferdinand Scholz
Peter Brückner
Frank Habel
Gunnar Leibiger
Original Assignee
Freiberger Compound Mat Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Freiberger Compound Mat Gmbh filed Critical Freiberger Compound Mat Gmbh
Publication of PL2024991T3 publication Critical patent/PL2024991T3/pl

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/14Feed and outlet means for the gases; Modifying the flow of the reactive gases
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901Materials
    • H10P14/2907Materials being Group IIIA-VA materials
    • H10P14/2908Nitrides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2926Crystal orientations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3402Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3416Nitrides
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3438Doping during depositing
    • H10P14/3441Conductivity type
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34Deposited materials, e.g. layers
    • H10P14/3438Doping during depositing
    • H10P14/3441Conductivity type
    • H10P14/3446Transition metal elements; Rare earth elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/38Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/127The active layers comprising only Group III-V materials, e.g. GaAs or InP
    • H10F71/1272The active layers comprising only Group III-V materials, e.g. GaAs or InP comprising at least three elements, e.g. GaAlAs or InGaAsP

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
PL06776716T 2006-08-09 2006-08-09 Sposób wytwarzania domieszkowanego kryształu III-N PL2024991T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06776716A EP2024991B1 (de) 2006-08-09 2006-08-09 Verfahren zur herstellung eines dotierten iii-n-kristalls
PCT/EP2006/007894 WO2008017320A1 (de) 2006-08-09 2006-08-09 Verfahren zur herstellung eines dotierten iii-n-massivkristalls sowie eines freistehenden dotierten iii-n-substrates und dotierter iii-n-massivkristall sowie freistehendes dotiertes iii-n-substrat

Publications (1)

Publication Number Publication Date
PL2024991T3 true PL2024991T3 (pl) 2013-03-29

Family

ID=37401600

Family Applications (1)

Application Number Title Priority Date Filing Date
PL06776716T PL2024991T3 (pl) 2006-08-09 2006-08-09 Sposób wytwarzania domieszkowanego kryształu III-N

Country Status (5)

Country Link
EP (1) EP2024991B1 (pl)
JP (1) JP5298015B2 (pl)
CN (1) CN101506947B (pl)
PL (1) PL2024991T3 (pl)
WO (1) WO2008017320A1 (pl)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012012292A (ja) * 2010-05-31 2012-01-19 Mitsubishi Chemicals Corp Iii族窒化物結晶の製造方法、および該製造方法により得られるiii族窒化物結晶、iii族窒化物結晶基板
JP2016115794A (ja) * 2014-12-15 2016-06-23 日亜化学工業株式会社 窒化物半導体テンプレートの製造方法
JP6001129B2 (ja) * 2015-04-15 2016-10-05 住友化学株式会社 ハイドライド気相成長装置
CN105442045A (zh) * 2015-06-25 2016-03-30 苏州纳维科技有限公司 低杂质浓度半绝缘GaN单晶及其制备方法与应用
CN106918477B (zh) * 2015-12-24 2019-09-27 中芯国际集成电路制造(上海)有限公司 用于透射电子显微镜俯视观察的芯片样品制备方法
US11371165B2 (en) 2018-12-26 2022-06-28 National University Corporation Tokai National Higher Education And Research System Vapor phase epitaxial growth device
WO2020219697A1 (en) * 2019-04-25 2020-10-29 Aledia Enhanced doping using alloy based sources
DE102019008930A1 (de) * 2019-12-20 2021-06-24 Azur Space Solar Power Gmbh Gasphasenepitaxieverfahren
DE102019008928B9 (de) * 2019-12-20 2021-08-26 Azur Space Solar Power Gmbh Gasphasenepitaxieverfahren
WO2025196855A1 (ja) * 2024-03-18 2025-09-25 日本碍子株式会社 Iii族元素窒化物基板、貼合せ基板、半導体素子およびiii族元素窒化物基板の製造方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2872096B2 (ja) * 1996-01-19 1999-03-17 日本電気株式会社 低抵抗p型窒化ガリウム系化合物半導体の気相成長方法
RU2097452C1 (ru) * 1996-02-22 1997-11-27 Юрий Александрович Водаков Способ эпитаксиального выращивания монокристаллов нитридов металлов 3а группы химических элементов
JP4790914B2 (ja) * 1999-05-13 2011-10-12 ヴィーコ・プロセス・イクウィップメント・インコーポレーテッド 基板上に材料をエピタキシャル成長させるための方法と装置
US6596079B1 (en) * 2000-03-13 2003-07-22 Advanced Technology Materials, Inc. III-V nitride substrate boule and method of making and using the same
JP4511006B2 (ja) * 2000-09-01 2010-07-28 独立行政法人理化学研究所 半導体の不純物ドーピング方法
SG125069A1 (en) * 2001-05-17 2006-09-29 Sumitomo Chemical Co Method and system for manufacturing III-V group compound semiconductor and III-V group compound semiconductor
JP3886341B2 (ja) * 2001-05-21 2007-02-28 日本電気株式会社 窒化ガリウム結晶基板の製造方法及び窒化ガリウム結晶基板
PL225235B1 (pl) * 2001-10-26 2017-03-31 Ammono Spółka Z Ograniczoną Odpowiedzialnością Objętościowy monokryształ azotkowy oraz jego zastosowanie jako podłoże do epitaksji
JP5260831B2 (ja) * 2006-01-05 2013-08-14 古河機械金属株式会社 Iii族窒化物半導体結晶の製造方法、iii族窒化物半導体基板の製造方法および半導体装置の製造方法

Also Published As

Publication number Publication date
JP2010500267A (ja) 2010-01-07
EP2024991B1 (de) 2012-10-17
CN101506947A (zh) 2009-08-12
JP5298015B2 (ja) 2013-09-25
EP2024991A1 (de) 2009-02-18
CN101506947B (zh) 2011-06-08
WO2008017320A1 (de) 2008-02-14

Similar Documents

Publication Publication Date Title
BRPI0719843A2 (pt) Método para a produção de bisbenzoxazóis
NO20091286L (no) Krystallfabrikasjon
NL2001649A1 (nl) Non-bolt joint structure and method for producing non-bolt joint structure.
PL1896065T3 (pl) Sposób wytwarzania szczepionek
BRPI0814359A2 (pt) Método
BRPI0817226A2 (pt) Método
BRPI0817726A2 (pt) Método
PL1951636T3 (pl) Sposób wytwarzania płyty cementowej
DK2004794T3 (da) Fremgangsmåde til mæskning
BRPI0812275A2 (pt) Aparelho e método de produção de painéis de gesso
DK3216802T3 (da) Produktionsfremgangsmåde
DE602007002135D1 (de) Kristalloszillator
PL2160432T3 (pl) Sposób wytwarzania poliamidów
NO20042425L (no) Anordning for algeproduksjon
FI20085735A0 (fi) Menetelmä linssimoduulin valmistamiseksi ja menetelmällä valmistettu linssi
DK2029567T3 (da) Fremgangsmåde til frembringelse af benzopyran-2-ol-derivater
FI20055616L (fi) Menetelmä valmisteen rakenteen muokkaamiseen
DK2160225T3 (da) Fremgangsmåde til fremstilling af krystaller
FI20060682L (fi) Karbonitridin valmistusmenetelmä
BRPI0718145A2 (pt) Método de micronização
DE602006016683D1 (de) Tonerherstellungsverfahren
PL2024991T3 (pl) Sposób wytwarzania domieszkowanego kryształu III-N
FI20086138A0 (fi) Menetelmä äänen tuottamiseksi
PL1801269T3 (pl) Sposób wytwarzania wolno stojącej warstwy III-N i wolno stojące podłoże III-N
IS8758A (is) Aðferð til þess að framleiða essítalópram