PL2815419T3 - Blok końcowy i belka magnetyczna dla układu rozpylającego - Google Patents

Blok końcowy i belka magnetyczna dla układu rozpylającego

Info

Publication number: PL2815419T3
Authority: PL; Poland
Prior art keywords: block; sputtering system; magnet bar; magnet; bar
Prior art date: 2012-02-13

Application number

PL13704595T

Other languages

English (en)

Inventor

Wilmert De Bosscher

Ivan Van De Putte

Guy Gobin

Original Assignee

Soleras Advanced Coatings Bvba

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2012-02-13

Filing date

2013-02-13

Publication date

2019-09-30

2013-02-13 Application filed by Soleras Advanced Coatings Bvba filed Critical Soleras Advanced Coatings Bvba

2019-09-30 Publication of PL2815419T3 publication Critical patent/PL2815419T3/pl

Links

238000004544 sputter deposition Methods 0.000 title 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3438—Electrodes other than cathode
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3461—Means for shaping the magnetic field, e.g. magnetic shunts

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Physics & Mathematics (AREA)
Plasma & Fusion (AREA)
Analytical Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physical Vapour Deposition (AREA)

PL13704595T 2012-02-13 2013-02-13 Blok końcowy i belka magnetyczna dla układu rozpylającego PL2815419T3 (pl)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
EP12155246.7A EP2626887A1 (en)	2012-02-13	2012-02-13	Online adjustable magnet bar
PCT/EP2013/052913 WO2013120920A1 (en)	2012-02-13	2013-02-13	Online adjustable magnet bar
EP13704595.1A EP2815419B1 (en)	2012-02-13	2013-02-13	End-block and magnet bar for sputtering system

Publications (1)

Publication Number	Publication Date
PL2815419T3 true PL2815419T3 (pl)	2019-09-30

Family

ID=47720505

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
PL13704595T PL2815419T3 (pl)	2012-02-13	2013-02-13	Blok końcowy i belka magnetyczna dla układu rozpylającego

Country Status (10)

Country	Link
US (1)	US10163612B2 (pl)
EP (2)	EP2626887A1 (pl)
JP (1)	JP6367119B2 (pl)
KR (1)	KR101955748B1 (pl)
CN (1)	CN104137221B (pl)
ES (1)	ES2732740T3 (pl)
HU (1)	HUE044065T2 (pl)
PL (1)	PL2815419T3 (pl)
TR (1)	TR201909175T4 (pl)
WO (1)	WO2013120920A1 (pl)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US9418823B2 (en)	2013-03-01	2016-08-16	Sputtering Components, Inc.	Sputtering apparatus
US9312108B2 (en)	2013-03-01	2016-04-12	Sputtering Components, Inc.	Sputtering apparatus
BE1021296B1 (nl) *	2014-04-18	2015-10-23	Soleras Advanced Coatings Bvba	Sputter systeem voor uniform sputteren
CN106795621B (zh) *	2014-04-28	2020-05-22	零件喷涂公司	磁控管组件和旋转靶阴极组件
BE1022682B1 (nl)	2015-01-11	2016-07-14	Soleras Advanced Coatings Bvba	Een deksel met een sensorsysteem voor een configureerbaar meetsysteem voor een configureerbaar sputtersysteem
BE1024754B9 (nl) *	2016-11-29	2018-07-24	Soleras Advanced Coatings Bvba	Een universeel monteerbaar eindblok
JP2019164851A (ja)	2018-03-19	2019-09-26	株式会社東芝	ディスク装置
KR102535667B1 (ko) *	2018-08-08	2023-05-26	어플라이드 머티어리얼스, 인코포레이티드	스퍼터링 디바이스, 증착 장치, 및 스퍼터링 디바이스를 작동시키는 방법
BE1027175B1 (nl) *	2019-04-05	2020-11-03	Soleras Advanced Coatings Bv	Magneetstaaf met aangehechte sensor
CN116057200B (zh) *	2020-09-16	2024-09-10	株式会社爱发科	旋转式阴极单元用驱动块
CN116057199B (zh) *	2020-10-08	2024-09-03	株式会社爱发科	旋转式阴极单元用的驱动块
US11908669B2 (en)	2021-01-08	2024-02-20	Arizona Thin Film Research, LLC	Thermally controlled magnetic fields optimization system for sputter deposition processes
CN120210752B (zh) *	2025-05-09	2025-09-23	中科纳微真空科技(合肥)有限公司	一种磁控溅射镀膜设备、旋转阴极及在线可调磁棒
CN120138588A (zh) *	2025-05-15	2025-06-13	宏舜(浙江)真空科技有限公司	一种远程可控的旋转阴极磁组件

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4500408A (en) *	1983-07-19	1985-02-19	Varian Associates, Inc.	Apparatus for and method of controlling sputter coating
JPH0565634A (ja) *	1991-09-06	1993-03-19	Rohm Co Ltd	スパツタ装置
DE4342766A1 (de) *	1993-12-15	1995-06-22	Andre Dipl Ing Linnenbruegger	Magnetron-Zerstäuberquellenanordnung
US5445721A (en) *	1994-08-25	1995-08-29	The Boc Group, Inc.	Rotatable magnetron including a replacement target structure
US5518592A (en) *	1994-08-25	1996-05-21	The Boc Group, Inc.	Seal cartridge for a rotatable magnetron
DE10102493B4 (de) *	2001-01-19	2007-07-12	W.C. Heraeus Gmbh	Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets
US6736948B2 (en) *	2002-01-18	2004-05-18	Von Ardenne Anlagentechnik Gmbh	Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation
US20030173217A1 (en)	2002-03-14	2003-09-18	Sputtering Components, Inc.	High-power ion sputtering magnetron
US20060207871A1 (en) *	2005-03-16	2006-09-21	Gennady Yumshtyk	Sputtering devices and methods
BRPI0911980A2 (pt) *	2008-05-16	2015-10-13	Bekaert Advanced Coatings	pulverização catódica rotativa de magnetron com alta rigidez
DE102009033546B4 (de) *	2009-07-16	2014-07-17	Von Ardenne Anlagentechnik Gmbh	Versorgungsendblock für ein rotierendes Magnetron
KR20130012017A (ko) *	2010-03-31	2013-01-30	무스탕 배큠 시스템즈 인코포레이티드	실린더형 회전 마크네트론 스퍼터링 음극 장치 및 무선 주파수 방사를 사용하여 재료를 증착하는 방법
JP5265811B2 (ja) *	2010-06-03	2013-08-14	株式会社アルバック	スパッタ成膜装置

2012
- 2012-02-13 EP EP12155246.7A patent/EP2626887A1/en not_active Withdrawn
2013
- 2013-02-13 TR TR2019/09175T patent/TR201909175T4/tr unknown
- 2013-02-13 KR KR1020147023292A patent/KR101955748B1/ko not_active Expired - Fee Related
- 2013-02-13 ES ES13704595T patent/ES2732740T3/es active Active
- 2013-02-13 HU HUE13704595A patent/HUE044065T2/hu unknown
- 2013-02-13 PL PL13704595T patent/PL2815419T3/pl unknown
- 2013-02-13 CN CN201380009051.4A patent/CN104137221B/zh active Active
- 2013-02-13 WO PCT/EP2013/052913 patent/WO2013120920A1/en not_active Ceased
- 2013-02-13 US US14/378,383 patent/US10163612B2/en active Active
- 2013-02-13 JP JP2014556106A patent/JP6367119B2/ja active Active
- 2013-02-13 EP EP13704595.1A patent/EP2815419B1/en active Active

Also Published As

Publication number	Publication date
JP6367119B2 (ja)	2018-08-01
US10163612B2 (en)	2018-12-25
CN104137221B (zh)	2017-04-26
ES2732740T3 (es)	2019-11-25
WO2013120920A1 (en)	2013-08-22
EP2626887A1 (en)	2013-08-14
TR201909175T4 (tr)	2019-07-22
JP2015510039A (ja)	2015-04-02
EP2815419A1 (en)	2014-12-24
EP2815419B1 (en)	2019-04-03
CN104137221A (zh)	2014-11-05
HUE044065T2 (hu)	2019-09-30
KR101955748B1 (ko)	2019-03-07
KR20140129039A (ko)	2014-11-06
US20160013034A1 (en)	2016-01-14

Publication	Publication Date	Title
PL2815419T3 (pl)	2019-09-30	Blok końcowy i belka magnetyczna dla układu rozpylającego
PL2830449T3 (pl)	2017-08-31	System magnetycznych zapięć wymiennych
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GB201119183D0 (en)	2011-12-21	Security system
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ZA201408352B (en)	2016-04-28	Micro-resource-pooling system and corresponding method thereof
SG11201500259XA (en)	2015-03-30	Methods and systems for order matching
EP2731830A4 (en)	2014-12-10	SECURITY SYSTEM
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EP2717251A4 (en)	2015-03-11	TUNNELINTERNET DISPLAY SYSTEM
PL2880196T3 (pl)	2020-11-30	Urządzenie do rozpylania
SG11201403984PA (en)	2014-10-30	FePt SPUTTERING TARGET AND METHOD FOR PRODUCING SAME
EP2883014A4 (en)	2016-03-30	THREAT SIMULATION SYSTEM
EP2738648A4 (en)	2015-07-29	DISPLAY SYSTEM
GB2504266B (en)	2017-05-10	Display system