TR201909175T4 - Püskürtme sistemi için uç blok ve çubuk mıknatıs. - Google Patents
Püskürtme sistemi için uç blok ve çubuk mıknatıs. Download PDFInfo
- Publication number
- TR201909175T4 TR201909175T4 TR2019/09175T TR201909175T TR201909175T4 TR 201909175 T4 TR201909175 T4 TR 201909175T4 TR 2019/09175 T TR2019/09175 T TR 2019/09175T TR 201909175 T TR201909175 T TR 201909175T TR 201909175 T4 TR201909175 T4 TR 201909175T4
- Authority
- TR
- Turkey
- Prior art keywords
- bar magnet
- end block
- signal connector
- spraying system
- rotate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3435—Target holders (includes backing plates and endblocks)
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3438—Electrodes other than cathode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3461—Means for shaping the magnetic field, e.g. magnetic shunts
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Mevcut buluş, püskürtme hedef borusunu (200) döner şekilde taşımak ve söz konusu püskürtme hedef borusunun içinde çubuk mıknatısı döner şekilde tutmak için bir uç blok (100) sağlamaktadır. Uç blok (100), bir çubuk mıknatıs tertibatını (150) almak için bir hazne içerir; burada söz konusu hazne, söz konusu mıknatıstan bir sinyal konektörünün bir ikinci kısmını (164) alacak şekilde düzenlenmiş bir sinyal konektörünün bir birinci kısmını (162) içerir ve çubuk mıknatıs tertibatını (150) ve uç blok (100) ile çubuk mıknatıs (220) arasında bir sinyal konektörünün oluşturulmasına izin verilir. Uç blok, çubuk mıknatıs ve uç blok arasında iletilen bir güç ve/veya veri sinyalinin bozulmasından, tahrip edilmesinden veya karışmasından korumak için çevresindeki soğutma sıvısından ve/veya çevresindeki yüksek enerji alanlarından dolayı sinyal konektörüne koruma araçları sağlamak üzere uyarlanmıştır. Mevcut buluş ayrıca karşılık gelen bir çubuk mıknatısı ve bir çubuk mıknatısın manyetik bir konfigürasyonunu silindirik püskürtme aparatına uyarlamak için bir yöntem sağlamaktadır.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP12155246.7A EP2626887A1 (en) | 2012-02-13 | 2012-02-13 | Online adjustable magnet bar |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TR201909175T4 true TR201909175T4 (tr) | 2019-07-22 |
Family
ID=47720505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TR2019/09175T TR201909175T4 (tr) | 2012-02-13 | 2013-02-13 | Püskürtme sistemi için uç blok ve çubuk mıknatıs. |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US10163612B2 (tr) |
| EP (2) | EP2626887A1 (tr) |
| JP (1) | JP6367119B2 (tr) |
| KR (1) | KR101955748B1 (tr) |
| CN (1) | CN104137221B (tr) |
| ES (1) | ES2732740T3 (tr) |
| HU (1) | HUE044065T2 (tr) |
| PL (1) | PL2815419T3 (tr) |
| TR (1) | TR201909175T4 (tr) |
| WO (1) | WO2013120920A1 (tr) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9418823B2 (en) | 2013-03-01 | 2016-08-16 | Sputtering Components, Inc. | Sputtering apparatus |
| US9312108B2 (en) | 2013-03-01 | 2016-04-12 | Sputtering Components, Inc. | Sputtering apparatus |
| BE1021296B1 (nl) * | 2014-04-18 | 2015-10-23 | Soleras Advanced Coatings Bvba | Sputter systeem voor uniform sputteren |
| CN106795621B (zh) * | 2014-04-28 | 2020-05-22 | 零件喷涂公司 | 磁控管组件和旋转靶阴极组件 |
| BE1022682B1 (nl) | 2015-01-11 | 2016-07-14 | Soleras Advanced Coatings Bvba | Een deksel met een sensorsysteem voor een configureerbaar meetsysteem voor een configureerbaar sputtersysteem |
| BE1024754B9 (nl) * | 2016-11-29 | 2018-07-24 | Soleras Advanced Coatings Bvba | Een universeel monteerbaar eindblok |
| JP2019164851A (ja) | 2018-03-19 | 2019-09-26 | 株式会社東芝 | ディスク装置 |
| KR102535667B1 (ko) * | 2018-08-08 | 2023-05-26 | 어플라이드 머티어리얼스, 인코포레이티드 | 스퍼터링 디바이스, 증착 장치, 및 스퍼터링 디바이스를 작동시키는 방법 |
| BE1027175B1 (nl) * | 2019-04-05 | 2020-11-03 | Soleras Advanced Coatings Bv | Magneetstaaf met aangehechte sensor |
| CN116057200B (zh) * | 2020-09-16 | 2024-09-10 | 株式会社爱发科 | 旋转式阴极单元用驱动块 |
| CN116057199B (zh) * | 2020-10-08 | 2024-09-03 | 株式会社爱发科 | 旋转式阴极单元用的驱动块 |
| US11908669B2 (en) | 2021-01-08 | 2024-02-20 | Arizona Thin Film Research, LLC | Thermally controlled magnetic fields optimization system for sputter deposition processes |
| CN120210752B (zh) * | 2025-05-09 | 2025-09-23 | 中科纳微真空科技(合肥)有限公司 | 一种磁控溅射镀膜设备、旋转阴极及在线可调磁棒 |
| CN120138588A (zh) * | 2025-05-15 | 2025-06-13 | 宏舜(浙江)真空科技有限公司 | 一种远程可控的旋转阴极磁组件 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4500408A (en) * | 1983-07-19 | 1985-02-19 | Varian Associates, Inc. | Apparatus for and method of controlling sputter coating |
| JPH0565634A (ja) * | 1991-09-06 | 1993-03-19 | Rohm Co Ltd | スパツタ装置 |
| DE4342766A1 (de) * | 1993-12-15 | 1995-06-22 | Andre Dipl Ing Linnenbruegger | Magnetron-Zerstäuberquellenanordnung |
| US5445721A (en) * | 1994-08-25 | 1995-08-29 | The Boc Group, Inc. | Rotatable magnetron including a replacement target structure |
| US5518592A (en) * | 1994-08-25 | 1996-05-21 | The Boc Group, Inc. | Seal cartridge for a rotatable magnetron |
| DE10102493B4 (de) * | 2001-01-19 | 2007-07-12 | W.C. Heraeus Gmbh | Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets |
| US6736948B2 (en) * | 2002-01-18 | 2004-05-18 | Von Ardenne Anlagentechnik Gmbh | Cylindrical AC/DC magnetron with compliant drive system and improved electrical and thermal isolation |
| US20030173217A1 (en) | 2002-03-14 | 2003-09-18 | Sputtering Components, Inc. | High-power ion sputtering magnetron |
| US20060207871A1 (en) * | 2005-03-16 | 2006-09-21 | Gennady Yumshtyk | Sputtering devices and methods |
| BRPI0911980A2 (pt) * | 2008-05-16 | 2015-10-13 | Bekaert Advanced Coatings | pulverização catódica rotativa de magnetron com alta rigidez |
| DE102009033546B4 (de) * | 2009-07-16 | 2014-07-17 | Von Ardenne Anlagentechnik Gmbh | Versorgungsendblock für ein rotierendes Magnetron |
| KR20130012017A (ko) * | 2010-03-31 | 2013-01-30 | 무스탕 배큠 시스템즈 인코포레이티드 | 실린더형 회전 마크네트론 스퍼터링 음극 장치 및 무선 주파수 방사를 사용하여 재료를 증착하는 방법 |
| JP5265811B2 (ja) * | 2010-06-03 | 2013-08-14 | 株式会社アルバック | スパッタ成膜装置 |
-
2012
- 2012-02-13 EP EP12155246.7A patent/EP2626887A1/en not_active Withdrawn
-
2013
- 2013-02-13 TR TR2019/09175T patent/TR201909175T4/tr unknown
- 2013-02-13 KR KR1020147023292A patent/KR101955748B1/ko not_active Expired - Fee Related
- 2013-02-13 ES ES13704595T patent/ES2732740T3/es active Active
- 2013-02-13 HU HUE13704595A patent/HUE044065T2/hu unknown
- 2013-02-13 PL PL13704595T patent/PL2815419T3/pl unknown
- 2013-02-13 CN CN201380009051.4A patent/CN104137221B/zh active Active
- 2013-02-13 WO PCT/EP2013/052913 patent/WO2013120920A1/en not_active Ceased
- 2013-02-13 US US14/378,383 patent/US10163612B2/en active Active
- 2013-02-13 JP JP2014556106A patent/JP6367119B2/ja active Active
- 2013-02-13 EP EP13704595.1A patent/EP2815419B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| JP6367119B2 (ja) | 2018-08-01 |
| US10163612B2 (en) | 2018-12-25 |
| CN104137221B (zh) | 2017-04-26 |
| ES2732740T3 (es) | 2019-11-25 |
| WO2013120920A1 (en) | 2013-08-22 |
| EP2626887A1 (en) | 2013-08-14 |
| JP2015510039A (ja) | 2015-04-02 |
| EP2815419A1 (en) | 2014-12-24 |
| EP2815419B1 (en) | 2019-04-03 |
| CN104137221A (zh) | 2014-11-05 |
| HUE044065T2 (hu) | 2019-09-30 |
| KR101955748B1 (ko) | 2019-03-07 |
| KR20140129039A (ko) | 2014-11-06 |
| US20160013034A1 (en) | 2016-01-14 |
| PL2815419T3 (pl) | 2019-09-30 |
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