PL2888330T3 - Przyczepna masa klejąca, w szczególności do uszczelniania układu elektronicznego - Google Patents

Przyczepna masa klejąca, w szczególności do uszczelniania układu elektronicznego

Info

Publication number
PL2888330T3
PL2888330T3 PL13735003T PL13735003T PL2888330T3 PL 2888330 T3 PL2888330 T3 PL 2888330T3 PL 13735003 T PL13735003 T PL 13735003T PL 13735003 T PL13735003 T PL 13735003T PL 2888330 T3 PL2888330 T3 PL 2888330T3
Authority
PL
Poland
Prior art keywords
adhesive
electronic systems
sealing electronic
sealing
systems
Prior art date
Application number
PL13735003T
Other languages
English (en)
Inventor
KLAUS KEITE-TELGENBüSCHER
Jan Ellinger
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of PL2888330T3 publication Critical patent/PL2888330T3/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C09J127/16—Homopolymers or copolymers of vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K11/00—Use of ingredients of unknown constitution, e.g. undefined reaction products
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/16—Homopolymers or copolymers or vinylidene fluoride
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J127/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers
    • C09J127/02—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J127/12—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Adhesives based on derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2217—Oxides; Hydroxides of metals of magnesium
    • C08K2003/222—Magnesia, i.e. magnesium oxide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Physics & Mathematics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
PL13735003T 2012-08-24 2013-07-04 Przyczepna masa klejąca, w szczególności do uszczelniania układu elektronicznego PL2888330T3 (pl)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012215136 2012-08-24
DE102012219877.6A DE102012219877A1 (de) 2012-08-24 2012-10-30 Haftklebemasse insbesondere zur Kapselung einer elektronischen Anordnung

Publications (1)

Publication Number Publication Date
PL2888330T3 true PL2888330T3 (pl) 2017-09-29

Family

ID=50069636

Family Applications (1)

Application Number Title Priority Date Filing Date
PL13735003T PL2888330T3 (pl) 2012-08-24 2013-07-04 Przyczepna masa klejąca, w szczególności do uszczelniania układu elektronicznego

Country Status (11)

Country Link
US (1) US9631127B2 (pl)
EP (1) EP2888330B1 (pl)
JP (1) JP6307079B2 (pl)
KR (1) KR102123407B1 (pl)
CN (1) CN104736654B (pl)
BR (1) BR112015003675A2 (pl)
DE (1) DE102012219877A1 (pl)
IN (1) IN2015DN01249A (pl)
PL (1) PL2888330T3 (pl)
TW (1) TWI582188B (pl)
WO (1) WO2014029545A1 (pl)

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DE102013215149A1 (de) * 2013-08-01 2015-02-19 Conti Temic Microelectronic Gmbh Mehrstufiges Dichtsystem zum Einsatz in einem Kraftfahrzeugsteuergerät
JP5667282B1 (ja) * 2013-12-27 2015-02-12 古河電気工業株式会社 有機電界発光素子用充填材料及び有機電界発光素子の封止方法
US20170327717A1 (en) 2014-10-29 2017-11-16 Tesa Se Adhesive compounds containing getter materials that can be activated
JP6720473B2 (ja) * 2015-04-09 2020-07-08 Dic株式会社 発光装置、照明器具及び情報表示装置ならびに発光装置の製造方法
JP2017073379A (ja) * 2015-10-09 2017-04-13 荒川化学工業株式会社 非水系二次電池電極用バインダー、非水系二次電池電極形成用スラリー、非水系二次電池電極、非水系二次電池、リチウムイオン二次電池
CN105759511A (zh) * 2016-04-15 2016-07-13 京东方科技集团股份有限公司 显示面板及其制造方法和显示装置及其制造方法
US20190330496A1 (en) * 2016-06-15 2019-10-31 3M Innovative Properties Company Membrane electrode assembly component and method of making an assembly
CN109563397B (zh) 2016-08-10 2021-03-16 3M创新有限公司 氟化压敏粘合剂及其制品
WO2018181766A1 (ja) * 2017-03-31 2018-10-04 リンテック株式会社 半導体装置の製造方法及び両面粘着シート
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
WO2019027899A1 (en) * 2017-07-31 2019-02-07 Corning Incorporated ACCELERATED THERMAL CROSSLINKING OF PVDF-HFP BY ADDITION OF ORGANIC BASES, AND USE OF CROSS-LINKED PVDF-HFP AS DIELECTRIC GRID MATERIAL FOR ORGANIC TCM DEVICES
DE102017221270B4 (de) * 2017-11-28 2021-08-12 Tesa Se Verfahren zur Herstellung eines Siegelklebebandes und Verwendung
TWI678404B (zh) * 2017-11-29 2019-12-01 住華科技股份有限公司 感壓性黏著組成物、電極複合膜及其製造方法
CN111465669B (zh) 2017-12-06 2022-12-16 3M创新有限公司 阻隔性粘合剂组合物和制品
CN109335253A (zh) * 2018-08-30 2019-02-15 浙江时进包装有限公司 一种新型可重复封合自粘包装袋
CN110750449A (zh) * 2019-09-19 2020-02-04 中山大学 一种测试驱动的网页构件功能抽取方法
JP7445211B2 (ja) 2019-09-25 2024-03-07 大日本印刷株式会社 光学シート及びその製造方法
CN111858367A (zh) * 2020-07-24 2020-10-30 北京达佳互联信息技术有限公司 代码覆盖率测试方法、系统、装置、电子设备及存储介质
KR102905931B1 (ko) 2020-07-27 2025-12-29 삼성전자주식회사 연신 소자, 표시 패널, 센서 및 전자 장치
CN112996235B (zh) * 2021-02-10 2022-09-27 武汉天马微电子有限公司 一种柔性电路板、显示面板及绝缘膜
KR102715152B1 (ko) * 2021-09-03 2024-10-11 한국전자통신연구원 엔캡슐레이션한 유기발광소자 및 이의 제조방법
JP2023067788A (ja) * 2021-10-29 2023-05-16 株式会社リコー 光電変換素子、および光電変換素子モジュール
CN117171057B (zh) * 2023-11-02 2024-01-26 沐曦集成电路(上海)有限公司 芯片软硬件联合仿真阶段的软件代码覆盖率确定系统
KR102852393B1 (ko) 2025-01-22 2025-09-01 주식회사 탑런토탈솔루션 밴드 감압접착제 조립장치

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Also Published As

Publication number Publication date
CN104736654B (zh) 2017-10-20
JP2015531807A (ja) 2015-11-05
JP6307079B2 (ja) 2018-04-04
EP2888330B1 (de) 2017-06-21
US20150240134A1 (en) 2015-08-27
TW201418392A (zh) 2014-05-16
IN2015DN01249A (pl) 2015-06-26
EP2888330A1 (de) 2015-07-01
KR20150050571A (ko) 2015-05-08
CN104736654A (zh) 2015-06-24
BR112015003675A2 (pt) 2017-07-04
WO2014029545A1 (de) 2014-02-27
TWI582188B (zh) 2017-05-11
US9631127B2 (en) 2017-04-25
KR102123407B1 (ko) 2020-06-16
DE102012219877A1 (de) 2014-02-27

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