PL3028549T3 - Ścieżka przewodząca i sposób formowania ścieżki przewodzącej - Google Patents

Ścieżka przewodząca i sposób formowania ścieżki przewodzącej

Info

Publication number
PL3028549T3
PL3028549T3 PL14831630T PL14831630T PL3028549T3 PL 3028549 T3 PL3028549 T3 PL 3028549T3 PL 14831630 T PL14831630 T PL 14831630T PL 14831630 T PL14831630 T PL 14831630T PL 3028549 T3 PL3028549 T3 PL 3028549T3
Authority
PL
Poland
Prior art keywords
conductive trace
forming
forming conductive
trace
conductive
Prior art date
Application number
PL14831630T
Other languages
English (en)
Inventor
George E. Sakoske
Phil MAITLAND
Dietrich Speer
Frank Walter
Robert P. Blonski
Srinivasan Sridharan
Original Assignee
Ferro Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ferro Corporation filed Critical Ferro Corporation
Publication of PL3028549T3 publication Critical patent/PL3028549T3/pl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
    • H05K3/1291—Firing or sintering at relative high temperatures for patterns on inorganic boards, e.g. co-firing of circuits on green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dispersion Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Surface Treatment Of Glass (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
PL14831630T 2013-07-29 2014-07-22 Ścieżka przewodząca i sposób formowania ścieżki przewodzącej PL3028549T3 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361859323P 2013-07-29 2013-07-29
PCT/US2014/047512 WO2015017171A1 (en) 2013-07-29 2014-07-22 Method of forming conductive trace
EP14831630.0A EP3028549B1 (en) 2013-07-29 2014-07-22 Conductive trace and method of forming conductive trace

Publications (1)

Publication Number Publication Date
PL3028549T3 true PL3028549T3 (pl) 2018-11-30

Family

ID=52432334

Family Applications (1)

Application Number Title Priority Date Filing Date
PL14831630T PL3028549T3 (pl) 2013-07-29 2014-07-22 Ścieżka przewodząca i sposób formowania ścieżki przewodzącej

Country Status (8)

Country Link
US (1) US9565772B2 (pl)
EP (1) EP3028549B1 (pl)
JP (1) JP6246925B2 (pl)
KR (1) KR101934312B1 (pl)
CN (1) CN105432154B (pl)
ES (1) ES2676769T3 (pl)
PL (1) PL3028549T3 (pl)
WO (1) WO2015017171A1 (pl)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2905626B1 (en) * 2014-02-05 2019-09-11 ams AG Integrated current sensor system and method for producing an integrated current sensor system
CN106133845B (zh) 2014-04-02 2018-11-23 费罗公司 具有改善的玻璃强度性能的导电浆料
CN113443654B (zh) * 2021-07-16 2022-07-22 中国科学院兰州化学物理研究所 一种具有电磁波调控功能的稀土掺杂尖晶石材料及其制备

Family Cites Families (20)

* Cited by examiner, † Cited by third party
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US4409261A (en) * 1980-02-07 1983-10-11 Cts Corporation Process for air firing oxidizable conductors
DE3107943A1 (de) * 1981-03-02 1982-09-16 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von loetbaren und temperfaehigen edelmetallfreien duennschichtleiterbahnen
JPS611088A (ja) * 1984-06-14 1986-01-07 松下電器産業株式会社 導電回路の形成法
US4871108A (en) * 1985-01-17 1989-10-03 Stemcor Corporation Silicon carbide-to-metal joint and method of making same
JP3120471B2 (ja) * 1991-05-29 2000-12-25 ソニー株式会社 半導体装置の製造方法
JPH04350937A (ja) * 1991-05-29 1992-12-04 Sony Corp 銅配線の処理方法
JPH05206635A (ja) * 1992-01-28 1993-08-13 Matsushita Electric Ind Co Ltd セラミック回路基板の製造方法
JPH06237026A (ja) * 1993-02-09 1994-08-23 Murata Mfg Co Ltd 厚膜電極の形成方法
US6200897B1 (en) * 1999-06-06 2001-03-13 United Semiconductor Corp. Method for manufacturing even dielectric layer
JP2001099497A (ja) * 1999-09-30 2001-04-13 Nisshin Steel Co Ltd 太陽熱集熱板
US6824857B2 (en) 2001-04-02 2004-11-30 Nashua Corporation Circuit elements having an embedded conductive trace and methods of manufacture
US7564658B2 (en) 2004-09-23 2009-07-21 Headway Technologies, Inc. CoFe insertion for exchange bias and sensor improvement
US20060255102A1 (en) * 2005-05-11 2006-11-16 Snyder Rick B Technique for defining a wettable solder joint area for an electronic assembly substrate
US20110083874A1 (en) * 2009-10-09 2011-04-14 E. I. Du Pont De Nemours And Company Electrode and method for manufacturing the same
JP4705448B2 (ja) * 2005-09-29 2011-06-22 日本シイエムケイ株式会社 プリント配線板の製造方法
RU2338341C2 (ru) * 2006-12-28 2008-11-10 Федеральное государственное унитарное предприятие "Ордена Трудового Красного Знамени федеральный научно-производственный центр по радиоэлектронным системам и информационным технологиям имени В.И. Шимко" (ФГУП "Федеральный НПЦ "Радиоэлектроника" им. В.И. Шимко") Способ изготовления полосковой платы на диэлектрической подложке
CN102960076A (zh) * 2009-12-31 2013-03-06 E·I·内穆尔杜邦公司 用于低温共烧陶瓷电路和装置的混合金属体系导体
JP2012104613A (ja) * 2010-11-09 2012-05-31 Sony Corp 回路基板及び回路基板の製造方法
JP5431598B2 (ja) * 2010-12-28 2014-03-05 株式会社トクヤマ メタライズド基板、金属ペースト組成物、および、メタライズド基板の製造方法
JP2013153051A (ja) * 2012-01-25 2013-08-08 Tokuyama Corp メタライズドセラミックスビア基板及びその製造方法

Also Published As

Publication number Publication date
WO2015017171A1 (en) 2015-02-05
KR101934312B1 (ko) 2019-01-02
EP3028549B1 (en) 2018-06-13
KR20160085243A (ko) 2016-07-15
CN105432154B (zh) 2018-08-07
US20160174386A1 (en) 2016-06-16
EP3028549A4 (en) 2017-03-29
JP2016535924A (ja) 2016-11-17
US9565772B2 (en) 2017-02-07
ES2676769T3 (es) 2018-07-24
CN105432154A (zh) 2016-03-23
JP6246925B2 (ja) 2017-12-13
EP3028549A1 (en) 2016-06-08

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