PL3493948T3 - Urządzenie szlifierskie i sposób eksploatowania urządzenia szlifierskiego - Google Patents
Urządzenie szlifierskie i sposób eksploatowania urządzenia szlifierskiegoInfo
- Publication number
- PL3493948T3 PL3493948T3 PL17754106T PL17754106T PL3493948T3 PL 3493948 T3 PL3493948 T3 PL 3493948T3 PL 17754106 T PL17754106 T PL 17754106T PL 17754106 T PL17754106 T PL 17754106T PL 3493948 T3 PL3493948 T3 PL 3493948T3
- Authority
- PL
- Poland
- Prior art keywords
- grinding device
- operating
- grinding
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/06—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving members with limited contact area pressing the belt against the work, e.g. shoes sweeping across the whole area to be ground
- B24B21/08—Pressure shoes; Pressure members, e.g. backing belts
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
- B24B21/10—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces involving a rigid member, e.g. pressure bar, table, pressing or supporting the belt over substantially its whole span
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016214568.1A DE102016214568A1 (de) | 2016-08-05 | 2016-08-05 | Bearbeitungsvorrichtung und Bearbeitungsverfahren |
| EP17754106.7A EP3493948B1 (de) | 2016-08-05 | 2017-08-02 | Schleifvorrichtung und verfahren zum betreiben der schleifvorrichtung |
| PCT/EP2017/069520 WO2018024769A2 (de) | 2016-08-05 | 2017-08-02 | Bearbeitungsvorrichtung und bearbeitungsverfahren |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3493948T3 true PL3493948T3 (pl) | 2022-03-28 |
Family
ID=59649674
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL17754106T PL3493948T3 (pl) | 2016-08-05 | 2017-08-02 | Urządzenie szlifierskie i sposób eksploatowania urządzenia szlifierskiego |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US11325219B2 (pl) |
| EP (1) | EP3493948B1 (pl) |
| CN (1) | CN109715341A (pl) |
| DE (1) | DE102016214568A1 (pl) |
| PL (1) | PL3493948T3 (pl) |
| WO (1) | WO2018024769A2 (pl) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT201800000625A1 (it) * | 2018-01-09 | 2019-07-09 | Costa Levigatrici Spa | Macchina levigatrice con nastro trasversale |
| DE102018121139B3 (de) | 2018-08-29 | 2019-09-26 | Vsm Vereinigte Schmirgel- Und Maschinen-Fabriken Ag | Endlos-Schleifband für eine Schleifmaschine |
| JP6852034B2 (ja) * | 2018-10-15 | 2021-03-31 | 本田技研工業株式会社 | 研磨装置 |
| CH716746A2 (de) * | 2019-10-16 | 2021-04-30 | Kuendig Ag | Vorrichtung und Verfahren für den seitlich präzis definierten Einsatz von Schleifbändern bei Bandschleifmaschinen im Durchlauf. |
| CN112676992A (zh) * | 2020-12-30 | 2021-04-20 | 青岛建诚伟业机械制造有限公司 | 一种升降式电磁压梁系统 |
| US20230381911A1 (en) * | 2022-05-25 | 2023-11-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Polishing metrology |
| CN119973878B (zh) * | 2025-04-15 | 2025-07-25 | 宁波弘讯科技股份有限公司 | 砂光机的控制方法和电子设备 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2634829C3 (de) | 1976-08-03 | 1982-04-01 | Böttcher & Gessner GmbH, 2000 Hamburg | Druckbalken für Bandschleifmaschinen |
| DE3402104C2 (de) * | 1984-01-21 | 1986-07-17 | Karl Heesemann Maschinenfabrik GmbH & Co KG, 4970 Bad Oeynhausen | Bandschleifmaschine |
| DE3639329C1 (de) * | 1986-11-18 | 1988-02-25 | Heesemann Karl Masch | Bandschleifmaschine |
| DE3716832C2 (de) * | 1987-05-20 | 1995-06-14 | Boettcher Renardy & Co Gmbh | Druckbalken für eine Bandschleifmaschine |
| US5486129A (en) * | 1993-08-25 | 1996-01-23 | Micron Technology, Inc. | System and method for real-time control of semiconductor a wafer polishing, and a polishing head |
| US5868896A (en) * | 1996-11-06 | 1999-02-09 | Micron Technology, Inc. | Chemical-mechanical planarization machine and method for uniformly planarizing semiconductor wafers |
| DE19833881C1 (de) * | 1998-07-28 | 1999-10-21 | Juergen Heesemann | Bandschleifmaschine |
| US6186865B1 (en) * | 1998-10-29 | 2001-02-13 | Lam Research Corporation | Apparatus and method for performing end point detection on a linear planarization tool |
| US6325706B1 (en) * | 1998-10-29 | 2001-12-04 | Lam Research Corporation | Use of zeta potential during chemical mechanical polishing for end point detection |
| US6520834B1 (en) * | 2000-08-09 | 2003-02-18 | Micron Technology, Inc. | Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates |
| JP2002059349A (ja) * | 2000-08-21 | 2002-02-26 | Fukuoka Prefecture | ベルト研磨の制御方法 |
| IT251598Y1 (it) * | 2000-10-16 | 2003-12-18 | Viet Spa | Tampone per carteggiatrici, con dosaggio ottimale della forza premente di ogni suo settore mobile. |
| US6837774B2 (en) * | 2001-03-28 | 2005-01-04 | Taiwan Semiconductor Manufacturing Co., Ltd | Linear chemical mechanical polishing apparatus equipped with programmable pneumatic support platen and method of using |
| US6863771B2 (en) * | 2001-07-25 | 2005-03-08 | Micron Technology, Inc. | Differential pressure application apparatus for use in polishing layers of semiconductor device structures and methods |
| DE10303407A1 (de) * | 2003-01-27 | 2004-08-19 | Friedrich-Schiller-Universität Jena | Verfahren und Vorrichtung zur hochgenauen Bearbeitung der Oberfläche eines Objektes, insbesondere zum Polieren und Läppen von Halbleitersubstraten |
| AU2003234082A1 (en) * | 2003-05-22 | 2004-12-13 | Costa Levigatrici Spa | Method and device for sanding planar objects |
| DE102004003203A1 (de) | 2004-01-22 | 2005-08-11 | Robert Bosch Gmbh | Elektro-Handwerkzeug mit optimiertem Arbeitsbereich |
| US7840305B2 (en) | 2006-06-28 | 2010-11-23 | 3M Innovative Properties Company | Abrasive articles, CMP monitoring system and method |
| US9696710B2 (en) * | 2009-11-05 | 2017-07-04 | Vibration Technologies, Llc | Method and system for measuring the dynamic response of a structure during a machining process |
| CN102601711B (zh) | 2012-03-20 | 2014-10-08 | 友达光电(苏州)有限公司 | 板体研磨装置 |
| JP6568006B2 (ja) * | 2016-04-08 | 2019-08-28 | 株式会社荏原製作所 | 研磨装置および研磨方法 |
| US10160094B2 (en) * | 2016-12-21 | 2018-12-25 | Ronald Lipson | Intelligent polisher and system |
-
2016
- 2016-08-05 DE DE102016214568.1A patent/DE102016214568A1/de not_active Withdrawn
-
2017
- 2017-08-02 PL PL17754106T patent/PL3493948T3/pl unknown
- 2017-08-02 US US16/322,469 patent/US11325219B2/en active Active
- 2017-08-02 CN CN201780047817.6A patent/CN109715341A/zh active Pending
- 2017-08-02 WO PCT/EP2017/069520 patent/WO2018024769A2/de not_active Ceased
- 2017-08-02 EP EP17754106.7A patent/EP3493948B1/de not_active Not-in-force
Also Published As
| Publication number | Publication date |
|---|---|
| DE102016214568A1 (de) | 2018-02-08 |
| US20190232455A1 (en) | 2019-08-01 |
| WO2018024769A2 (de) | 2018-02-08 |
| EP3493948A2 (de) | 2019-06-12 |
| CN109715341A (zh) | 2019-05-03 |
| EP3493948B1 (de) | 2021-12-22 |
| US11325219B2 (en) | 2022-05-10 |
| WO2018024769A3 (de) | 2018-03-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| IL262065A (en) | Regulatory device and related method | |
| TWI562209B (en) | Semiconductor device and method for manufacturing the same | |
| SG10201502022QA (en) | Polishing device and polishing method | |
| SG10201912585TA (en) | Semiconductor device and method for manufacturing the same | |
| PL3626602T3 (pl) | Urządzenie sterujące i sposób dla urządzenia sterującego | |
| TWI562334B (en) | Semiconductor device and methods for forming the same | |
| SG11201609296XA (en) | Polishing pad and method for manufacturing the same | |
| SG10201705676VA (en) | Grinding apparatus | |
| EP3211560A4 (en) | Fingerprint decryption method and device | |
| EP2926464A4 (en) | ELECTRONIC DEVICE AND METHOD FOR CONTROLLING THEREOF | |
| ZA201706199B (en) | Device for handheld operation and method thereof | |
| PL3493948T3 (pl) | Urządzenie szlifierskie i sposób eksploatowania urządzenia szlifierskiego | |
| SG11201701946PA (en) | Travel path grinding device and travel path grinding method | |
| TWI562362B (en) | Semiconductor device structure and method for forming the same | |
| SG10201707093XA (en) | Grinding wheel and grinding apparatus | |
| SG11201703396YA (en) | Polishing device and polishing method | |
| PL3258660T3 (pl) | Urządzenie zabezpieczające i klucz sprzętowy oraz sposób jego używania | |
| EP3385032A4 (en) | Grinding device and grinding implement for said grinding device | |
| GB2552051B (en) | Motor and apparatus using the same | |
| SG11201606495QA (en) | Printing device and method for controlling the printing device | |
| EP3266565A4 (en) | Polishing device and polishing method | |
| TWI560890B (en) | Diode device and method for forming the same | |
| EP3108540B8 (de) | Antennenvorrichtung und verfahren zum betrieb derselben | |
| TWI562302B (en) | Semiconductor device and method for fabricating the same | |
| GB2566895B (en) | Power device and method for manufacturing the power device |