PL3910667T3 - Opakowaniowe podłoże szklane dla półprzewodnika, podłoże opakowaniowe dla półprzewodnika i urządzenie półprzewodnikowe - Google Patents
Opakowaniowe podłoże szklane dla półprzewodnika, podłoże opakowaniowe dla półprzewodnika i urządzenie półprzewodnikoweInfo
- Publication number
- PL3910667T3 PL3910667T3 PL20783657.8T PL20783657T PL3910667T3 PL 3910667 T3 PL3910667 T3 PL 3910667T3 PL 20783657 T PL20783657 T PL 20783657T PL 3910667 T3 PL3910667 T3 PL 3910667T3
- Authority
- PL
- Poland
- Prior art keywords
- semiconductor
- packaging
- substrate
- glass substrate
- semiconductor device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/63—Vias, e.g. via plugs
- H10W70/635—Through-vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
- H10W70/692—Ceramics or glasses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/401—Package configurations characterised by multiple insulating or insulated package substrates, interposers or RDLs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962826144P | 2019-03-29 | 2019-03-29 | |
| US201962826122P | 2019-03-29 | 2019-03-29 | |
| PCT/KR2020/004165 WO2020204473A1 (ko) | 2019-03-29 | 2020-03-27 | 반도체용 패키징 유리기판, 반도체용 패키징 기판 및 반도체 장치 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL3910667T3 true PL3910667T3 (pl) | 2025-11-12 |
Family
ID=72666885
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL20783657.8T PL3910667T3 (pl) | 2019-03-29 | 2020-03-27 | Opakowaniowe podłoże szklane dla półprzewodnika, podłoże opakowaniowe dla półprzewodnika i urządzenie półprzewodnikowe |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US11437308B2 (pl) |
| EP (1) | EP3910667B1 (pl) |
| JP (2) | JP7087205B2 (pl) |
| KR (2) | KR102515304B1 (pl) |
| CN (2) | CN114678344B (pl) |
| ES (1) | ES3041275T3 (pl) |
| PL (1) | PL3910667T3 (pl) |
| WO (1) | WO2020204473A1 (pl) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI831318B (zh) * | 2021-08-06 | 2024-02-01 | 美商愛玻索立克公司 | 電子器件封裝用基板、其製造方法及包括其的電子器件封裝 |
| TWI848353B (zh) | 2021-09-02 | 2024-07-11 | 美商愛玻索立克公司 | 基板載體以及包括其之基板組合 |
| CN116135805A (zh) * | 2021-11-18 | 2023-05-19 | 深圳市大族数控科技股份有限公司 | 基于玻璃基板的开孔方法 |
| JP2023132151A (ja) * | 2022-03-10 | 2023-09-22 | 凸版印刷株式会社 | ガラス基板、貫通電極、多層配線基板、およびガラス基板の製造方法 |
| US12599034B2 (en) | 2022-03-18 | 2026-04-07 | Intel Corporation | Microelectronic structure including active base substrate with through vias between a top die and a bottom die supported on an interposer |
| US12564059B2 (en) | 2022-10-12 | 2026-02-24 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming graphene core shell embedded within shielding layer |
| US12581974B2 (en) | 2023-01-05 | 2026-03-17 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of making a semiconductor package with graphene-coated interconnects |
| US12588572B2 (en) | 2023-03-15 | 2026-03-24 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming fine pitch conductive posts with graphene-coated cores |
| WO2025079686A1 (ja) * | 2023-10-12 | 2025-04-17 | 大日本印刷株式会社 | 貫通電極基板及び半導体パッケージ、並びにそれらの製造方法 |
| WO2025094490A1 (ja) * | 2023-10-30 | 2025-05-08 | Ｔｏｐｐａｎホールディングス株式会社 | 多層配線基板および多層配線基板の製造方法 |
| KR102697845B1 (ko) * | 2023-11-02 | 2024-08-21 | 앱솔릭스 인코포레이티드 | 측면보호층을 갖는 기판 및 이의 제조방법 |
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2020
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- 2020-03-27 PL PL20783657.8T patent/PL3910667T3/pl unknown
- 2020-03-27 WO PCT/KR2020/004165 patent/WO2020204473A1/ko not_active Ceased
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| US20210398891A1 (en) | 2021-12-23 |
| JP2022123003A (ja) | 2022-08-23 |
| EP3910667A4 (en) | 2022-10-26 |
| CN113383413A (zh) | 2021-09-10 |
| ES3041275T3 (en) | 2025-11-11 |
| CN114678344B (zh) | 2025-08-15 |
| JP7588114B2 (ja) | 2024-11-21 |
| KR102515304B1 (ko) | 2023-03-29 |
| CN114678344A (zh) | 2022-06-28 |
| CN113383413B (zh) | 2022-04-08 |
| KR20210071074A (ko) | 2021-06-15 |
| WO2020204473A1 (ko) | 2020-10-08 |
| KR20210130241A (ko) | 2021-10-29 |
| US11437308B2 (en) | 2022-09-06 |
| JP2022517062A (ja) | 2022-03-04 |
| EP3910667A1 (en) | 2021-11-17 |
| EP3910667B1 (en) | 2025-08-13 |
| JP7087205B2 (ja) | 2022-06-20 |
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