PL4298666T3 - Podłoże opakowaniowe i urządzenie półprzewodnikowe zawierające takie podłoże - Google Patents
Podłoże opakowaniowe i urządzenie półprzewodnikowe zawierające takie podłożeInfo
- Publication number
- PL4298666T3 PL4298666T3 PL22796777.5T PL22796777T PL4298666T3 PL 4298666 T3 PL4298666 T3 PL 4298666T3 PL 22796777 T PL22796777 T PL 22796777T PL 4298666 T3 PL4298666 T3 PL 4298666T3
- Authority
- PL
- Poland
- Prior art keywords
- same
- semiconductor device
- packaging substrate
- packaging
- substrate
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
- H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/20—Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/63—Vias, e.g. via plugs
- H10W70/635—Through-vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
- H10W70/692—Ceramics or glasses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
- H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
- H05K1/186—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards manufactured by mounting on or connecting to patterned circuits before or during embedding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/072—Connecting or disconnecting of bump connectors
- H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
- H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W72/241—Dispositions, e.g. layouts
- H10W72/247—Dispositions of multiple bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Dicing (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020210056448A KR102515303B1 (ko) | 2021-04-30 | 2021-04-30 | 패키징 기판 및 이를 포함하는 반도체 장치 |
| PCT/US2022/026847 WO2022232467A1 (en) | 2021-04-30 | 2022-04-28 | Packaging substrate and semiconductor device comprising the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| PL4298666T3 true PL4298666T3 (pl) | 2025-12-08 |
Family
ID=83848678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL22796777.5T PL4298666T3 (pl) | 2021-04-30 | 2022-04-28 | Podłoże opakowaniowe i urządzenie półprzewodnikowe zawierające takie podłoże |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US12456653B2 (pl) |
| EP (1) | EP4298666B1 (pl) |
| JP (1) | JP7546075B2 (pl) |
| KR (1) | KR102515303B1 (pl) |
| CN (1) | CN115917730A (pl) |
| PL (1) | PL4298666T3 (pl) |
| TW (1) | TWI792999B (pl) |
| WO (1) | WO2022232467A1 (pl) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116056756A (zh) * | 2020-09-09 | 2023-05-02 | 美敦力公司 | 电子封装和包括该电子封装的植入式医疗装置 |
| US20230085411A1 (en) * | 2021-09-16 | 2023-03-16 | Intel Corporation | Glass core with cavity structure for heterogeneous packaging architecture |
| US20240063203A1 (en) * | 2022-08-17 | 2024-02-22 | Intel Corporation | Package architectures with glass cores for thickness reduction and 3d integration |
| KR20240057081A (ko) * | 2022-10-24 | 2024-05-02 | 삼성전자주식회사 | 반도체 패키지 및 그 제조 방법 |
| KR102936625B1 (ko) * | 2022-11-15 | 2026-03-06 | 앱솔릭스 인코포레이티드 | 기판 및 반도체 모듈 |
| KR102933701B1 (ko) * | 2022-12-02 | 2026-03-03 | 앱솔릭스 인코포레이티드 | 반도체 패키징용 기판, 반도체 패키지 및 반도체 패키징용 기판의 제조방법 |
| US20240327201A1 (en) * | 2023-03-29 | 2024-10-03 | Intel Corporation | Mems dies embedded in glass cores |
| US20240332195A1 (en) * | 2023-04-02 | 2024-10-03 | Intel Corporation | Spray-coated photoresist and photoimageable dielectrics to enable tsv bridge for glass core packages |
| US20250069965A1 (en) * | 2023-08-25 | 2025-02-27 | Qualcomm Incorporated | Package comprising a substrate with an embedded frame |
| US20250079324A1 (en) * | 2023-08-30 | 2025-03-06 | Absolics Inc. | Method of manufacturing packaging substrate and packaging substrate manufactured thereby |
| US20250079244A1 (en) * | 2023-08-30 | 2025-03-06 | Absolics Inc. | Method of manufacturing packaging substrate and packaging substrate manufactured thereby |
| US20250079243A1 (en) * | 2023-08-30 | 2025-03-06 | Absolics Inc. | Packaging substrate and method of manufacturing the same |
| JP2025059046A (ja) * | 2023-09-27 | 2025-04-09 | アブソリックス インコーポレイテッド | パッケージング基板の製造方法及びこれを用いたパッケージング基板 |
| KR20250064590A (ko) * | 2023-10-31 | 2025-05-09 | 앱솔릭스 인코포레이티드 | 패키징 기판 및 패키징 기판의 제조 방법 |
| EP4550406A1 (en) * | 2023-10-31 | 2025-05-07 | Absolics Inc. | Packaging substrate and manufacturing method of packaging substrate |
| KR20250065219A (ko) * | 2023-11-02 | 2025-05-12 | 앱솔릭스 인코포레이티드 | 패키징 기판 및 패키징 기판의 제조 방법 |
| KR20250099432A (ko) * | 2023-12-24 | 2025-07-01 | 앱솔릭스 인코포레이티드 | 패키징 기판의 제조 방법 및 이를 이용한 패키징 기판 |
| KR20250099431A (ko) * | 2023-12-24 | 2025-07-01 | 앱솔릭스 인코포레이티드 | 패키징 기판에 포함되는 기판 및 기판의 제조방법 |
| KR102886059B1 (ko) * | 2023-12-27 | 2025-11-12 | 앱솔릭스 인코포레이티드 | 패키징 기판의 제조방법 |
| KR20250101308A (ko) * | 2023-12-27 | 2025-07-04 | 앱솔릭스 인코포레이티드 | 패키징 기판이 배치된 기판의 제조 방법 |
| US20250385090A1 (en) | 2024-06-13 | 2025-12-18 | Nanya Technology Corporation | Semiconductor device and method for manufacturing the same using multilayer mask |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010097902A1 (ja) | 2009-02-25 | 2010-09-02 | セイコーインスツル株式会社 | ガラス基板の研磨方法、パッケージの製造方法、圧電振動子、発振器、電子機器並びに電波時計 |
| US8578010B2 (en) | 2009-12-17 | 2013-11-05 | Mastercard International Incorporated | Methods and system for tracking web page analytics |
| JP6083152B2 (ja) * | 2012-08-24 | 2017-02-22 | ソニー株式会社 | 配線基板及び配線基板の製造方法 |
| KR20150083278A (ko) | 2014-01-09 | 2015-07-17 | 삼성전기주식회사 | 다층기판 및 다층기판의 제조방법 |
| US20150279814A1 (en) * | 2014-04-01 | 2015-10-01 | Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd. | Embedded chips |
| TWI571983B (zh) * | 2014-11-25 | 2017-02-21 | 矽品精密工業股份有限公司 | 電子封裝件及其製法 |
| KR20160082286A (ko) | 2014-12-30 | 2016-07-08 | 삼성전기주식회사 | 전자 부품 모듈 및 이의 제조 방법 |
| JP2017050315A (ja) * | 2015-08-31 | 2017-03-09 | イビデン株式会社 | プリント配線板及びプリント配線板の製造方法 |
| KR101781989B1 (ko) | 2015-12-07 | 2017-09-27 | 주식회사 심텍 | 글라스 회로 기판 및 이의 제조 방법 |
| JP6639934B2 (ja) * | 2016-02-08 | 2020-02-05 | 新光電気工業株式会社 | 配線基板、半導体装置及び配線基板の製造方法 |
| US9952110B2 (en) | 2016-03-29 | 2018-04-24 | Infineon Technologies Ag | Multi-die pressure sensor package |
| US20180130761A1 (en) * | 2016-11-09 | 2018-05-10 | Samsung Electro-Mechanics Co., Ltd. | Semiconductor package, manufacturing method thereof, and electronic element module using the same |
| CN111434191B (zh) * | 2017-11-10 | 2023-10-20 | Lpkf激光电子股份公司 | 集成半导体晶片的方法和装置 |
| CN112189001A (zh) | 2018-04-03 | 2021-01-05 | 康宁股份有限公司 | 包含结构化玻璃制品的电子封装件及其制造方法 |
| US11270920B2 (en) * | 2018-08-14 | 2022-03-08 | Medtronic, Inc. | Integrated circuit package and method of forming same |
| JP7145037B2 (ja) * | 2018-10-30 | 2022-09-30 | 京セラ株式会社 | 電子素子実装用基板、電子装置、および電子モジュール |
| KR102396184B1 (ko) * | 2019-03-12 | 2022-05-10 | 앱솔릭스 인코포레이티드 | 패키징 기판 및 이를 포함하는 반도체 장치 |
| CN111312697B (zh) | 2020-02-28 | 2022-02-22 | 西安微电子技术研究所 | 一种三维堆叠集成结构及其多芯片集成结构和制备方法 |
-
2021
- 2021-04-30 KR KR1020210056448A patent/KR102515303B1/ko active Active
-
2022
- 2022-04-28 WO PCT/US2022/026847 patent/WO2022232467A1/en not_active Ceased
- 2022-04-28 PL PL22796777.5T patent/PL4298666T3/pl unknown
- 2022-04-28 EP EP22796777.5A patent/EP4298666B1/en active Active
- 2022-04-28 US US18/010,809 patent/US12456653B2/en active Active
- 2022-04-28 CN CN202280005087.4A patent/CN115917730A/zh active Pending
- 2022-04-28 JP JP2022572386A patent/JP7546075B2/ja active Active
- 2022-04-29 TW TW111116516A patent/TWI792999B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| EP4298666C0 (en) | 2025-10-22 |
| JP7546075B2 (ja) | 2024-09-05 |
| JP2023536041A (ja) | 2023-08-23 |
| US12456653B2 (en) | 2025-10-28 |
| EP4298666A4 (en) | 2024-09-18 |
| EP4298666B1 (en) | 2025-10-22 |
| TW202245157A (zh) | 2022-11-16 |
| KR102515303B1 (ko) | 2023-03-29 |
| TWI792999B (zh) | 2023-02-11 |
| KR20220149170A (ko) | 2022-11-08 |
| EP4298666A1 (en) | 2024-01-03 |
| WO2022232467A1 (en) | 2022-11-03 |
| CN115917730A (zh) | 2023-04-04 |
| US20230307304A1 (en) | 2023-09-28 |
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