PL406197A1 - Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi - Google Patents

Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi

Info

Publication number
PL406197A1
PL406197A1 PL406197A PL40619713A PL406197A1 PL 406197 A1 PL406197 A1 PL 406197A1 PL 406197 A PL406197 A PL 406197A PL 40619713 A PL40619713 A PL 40619713A PL 406197 A1 PL406197 A1 PL 406197A1
Authority
PL
Poland
Prior art keywords
connecting optical
optical fibres
metallic elements
conducting layers
cleaning
Prior art date
Application number
PL406197A
Other languages
English (en)
Inventor
Katarzyna Gibała
Michał Dłubek
Jan Kalisz
Tomasz Nasiłowski
Alicja Leśko
Anna Łożańska
Katarzyna Joanna Pawlik
Małgorzata Olszewska
Zbigniew Hołdyński
Michał Szymański
Michał Murawski
Łukasz Ostrowski
Tadeusz Tenderenda
Marek Adam Napierała
Tomasz Stańczyk
Karol Wysokiński
Original Assignee
Inphotech Spółka Z Ograniczoną Odpowiedzialnością
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inphotech Spółka Z Ograniczoną Odpowiedzialnością filed Critical Inphotech Spółka Z Ograniczoną Odpowiedzialnością
Priority to PL406197A priority Critical patent/PL406197A1/pl
Priority to CN201480073684.6A priority patent/CN106164341A/zh
Priority to PCT/PL2014/050074 priority patent/WO2015076685A1/en
Priority to JP2016533536A priority patent/JP2017503915A/ja
Priority to EP14830743.2A priority patent/EP3071735A1/en
Priority to US15/038,376 priority patent/US20160288268A1/en
Publication of PL406197A1 publication Critical patent/PL406197A1/pl

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K28/00—Welding or cutting not covered by groups B23K5/00 - B23K26/00
    • B23K28/006—Welding metals by means of an electrolyte
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
  • Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)

Abstract

Sposób przedstawiony na rysunku łączenia włókien światłowodowych pokrytych warstwą przewodzącą korzystnie metalizowaną z elementami metalowymi zawiera etapy: sporządzenie elektrolitu, oczyszczenie powierzchni światłowodu i oczyszczenia elektrod, umieszczenie światłowodu i metalowego elementu czujnika w elektrolizerze, włączenie przepływu prądu, oczyszczenie elementów - połączonego elementu światłowodowego z elementem metalowym.
PL406197A 2013-11-22 2013-11-22 Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi PL406197A1 (pl)

Priority Applications (6)

Application Number Priority Date Filing Date Title
PL406197A PL406197A1 (pl) 2013-11-22 2013-11-22 Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi
CN201480073684.6A CN106164341A (zh) 2013-11-22 2014-11-22 具有导电涂层的光纤与金属元件结合的方法
PCT/PL2014/050074 WO2015076685A1 (en) 2013-11-22 2014-11-22 A method of bonding optical fibers with conductive coatings with metal elements
JP2016533536A JP2017503915A (ja) 2013-11-22 2014-11-22 導電性コーティングを有する光ファイバを金属要素に接着させる方法
EP14830743.2A EP3071735A1 (en) 2013-11-22 2014-11-22 A method of bonding optical fibers with conductive coatings with metal elements
US15/038,376 US20160288268A1 (en) 2013-11-22 2014-11-22 A method of bonding optical fibers with conductive coatings with metal elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PL406197A PL406197A1 (pl) 2013-11-22 2013-11-22 Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi

Publications (1)

Publication Number Publication Date
PL406197A1 true PL406197A1 (pl) 2015-05-25

Family

ID=52396790

Family Applications (1)

Application Number Title Priority Date Filing Date
PL406197A PL406197A1 (pl) 2013-11-22 2013-11-22 Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi

Country Status (6)

Country Link
US (1) US20160288268A1 (pl)
EP (1) EP3071735A1 (pl)
JP (1) JP2017503915A (pl)
CN (1) CN106164341A (pl)
PL (1) PL406197A1 (pl)
WO (1) WO2015076685A1 (pl)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107414221B (zh) * 2017-04-14 2019-04-30 哈尔滨工业大学 一种三维微纳结构电化学诱导加工方法
CN111781152B (zh) * 2020-07-10 2021-05-11 德州学院 一种石墨烯增敏的光纤乳酸传感器及其制备方法

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DE2647108A1 (de) * 1976-10-19 1978-04-20 Felten & Guilleaume Carlswerk Verfahren und vorrichtung zur kontinuierlichen metallisierung von nichtmetallischen endlosfasern
PL134228B1 (en) 1982-01-28 1985-08-31 Politechnika Warszawska Bath for electroplating of bright copper coatings
DE3485676D1 (de) * 1984-01-20 1992-05-27 Hughes Aircraft Co Faseroptisches bauelement.
EP0274772B1 (en) * 1984-01-20 1992-04-22 Hughes Aircraft Company Fiber optic structure
US4647147A (en) * 1984-01-20 1987-03-03 Hughes Aircraft Company Fiber optic to integrated optical chip coupler
US4733933A (en) * 1984-01-20 1988-03-29 Hughes Aircraft Company Fiber optic structure and method of making
JPS6290603A (ja) * 1985-10-17 1987-04-25 Nippon Telegr & Teleph Corp <Ntt> 光フアイバアレイの成端方法
DE3541733C1 (de) * 1985-11-26 1986-11-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V., 8000 München Faseroptische Fabry-Perot-Einrichtung
US4767508A (en) * 1986-02-27 1988-08-30 Nippon Mining Co., Ltd. Strike plating solution useful in applying primer plating to electronic parts
JPH02275910A (ja) * 1989-04-18 1990-11-09 Yokogawa Electric Corp 光ファイバの固定方法
JP2567951B2 (ja) * 1989-08-30 1996-12-25 古河電気工業株式会社 金属被覆光ファイバの製造方法
JPH04106509A (ja) * 1990-08-27 1992-04-08 Kyowa Densen Kk 光ファイバ素材
US5048919A (en) 1990-10-05 1991-09-17 Bell Communications Research, Inc. Low-stress coupling of electrooptical device to optical fiber
US5235179A (en) * 1991-09-24 1993-08-10 Hughes Aircraft Company Evanescent wave liquid level sensor with density compensation
JPH05258623A (ja) * 1992-03-10 1993-10-08 Furukawa Electric Co Ltd:The 超電導線の銅安定化層を電気メッキ法により形成する方法
US5311610A (en) 1993-03-31 1994-05-10 Bell Communications Research, Inc. Low-stress coupling of electrooptical device to optical fiber
US6126798A (en) * 1997-11-13 2000-10-03 Novellus Systems, Inc. Electroplating anode including membrane partition system and method of preventing passivation of same
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JP2000054192A (ja) * 1998-08-03 2000-02-22 Ngk Insulators Ltd 複合金属酸化物膜の製造方法
JP4481541B2 (ja) * 2000-12-20 2010-06-16 日本リーロナール有限会社 電解銅めっき液および電解銅めっき液の管理方法
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US20070102300A1 (en) * 2005-11-07 2007-05-10 Jin-Shing Dai Method for ceramic electroplating a cylinder assembly of an internal combustion engine
PL1839883T3 (pl) * 2006-03-08 2017-08-31 Homag Holzbearbeitungssysteme Ag Sposób i urządzenie do zadrukowywania półwyrobów w kształcie płyty
JP5300716B2 (ja) * 2006-06-08 2013-09-25 エバレデイ バツテリ カンパニー インコーポレーテツド アルカリ電池のためのスズメッキアノードケーシング
US20090038947A1 (en) * 2007-08-07 2009-02-12 Emat Technology, Llc. Electroplating aqueous solution and method of making and using same
RU2539897C2 (ru) * 2009-07-30 2015-01-27 Басф Се Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов поверхности
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CN102788603B (zh) * 2012-07-27 2016-02-24 华东理工大学 全金属封装的耐高温光纤光栅传感器及其制造方法

Also Published As

Publication number Publication date
US20160288268A1 (en) 2016-10-06
WO2015076685A1 (en) 2015-05-28
EP3071735A1 (en) 2016-09-28
JP2017503915A (ja) 2017-02-02
CN106164341A (zh) 2016-11-23

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PL406197A1 (pl) Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi
IN2014DN03360A (pl)