PL441866A1 - Elektrolityczna folia miedziana - Google Patents

Elektrolityczna folia miedziana

Info

Publication number
PL441866A1
PL441866A1 PL441866A PL44186621A PL441866A1 PL 441866 A1 PL441866 A1 PL 441866A1 PL 441866 A PL441866 A PL 441866A PL 44186621 A PL44186621 A PL 44186621A PL 441866 A1 PL441866 A1 PL 441866A1
Authority
PL
Poland
Prior art keywords
sup
kgf
copper foil
equal
less
Prior art date
Application number
PL441866A
Other languages
English (en)
Other versions
PL245191B1 (pl
Inventor
Daisuke Nakajima
Yasuji Hara
Mitsuyoshi Matsuda
Mitsuhiro Wada
Original Assignee
Mitsui Mining & Smelting Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsui Mining & Smelting Co., Ltd filed Critical Mitsui Mining & Smelting Co., Ltd
Publication of PL441866A1 publication Critical patent/PL441866A1/pl
Publication of PL245191B1 publication Critical patent/PL245191B1/pl

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/615—Microstructure of the layers, e.g. mixed structure
    • C25D5/617—Crystalline layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electrolytic Production Of Metals (AREA)

Abstract

Przedmiotem zgłoszenia jest osadzana elektrolitycznie folia miedziana mająca na co najmniej jednej powierzchni dziesięciopunktową średnią chropowatość Rz 0,1 µm lub większą i 2,0 µm lub mniejszą, która to osadzana elektrolitycznie folia miedziana ma w stanie pierwotnym nie poddanym wyżarzaniu wytrzymałość na rozciąganie mierzoną zgodnie z IPC-TM-650 równą 56 kgf/mm<sup>2</sup> lub większą i mniejszą niż 65 kgf/mm<sup>2</sup>, a po wyżarzaniu w 180°C przez 1 godzinę ma wytrzymałość na rozciąganie, mierzoną zgodnie z IPC-TM-650, równą 15 kgf/mm<sup>2</sup> lub większą i mniejszą niż 25 kgf/mm<sup>2</sup>. Przedmiotem zgłoszenia jest także elastyczne podłoże zawierające ww.osadzaną elektrolitycznie folię.
PL441866A 2020-01-30 2021-01-14 Elektrolityczna folia miedziana PL245191B1 (pl)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020013720 2020-01-30
JP2020-013720 2020-01-30
PCT/JP2021/001103 WO2021153257A1 (ja) 2020-01-30 2021-01-14 電解銅箔

Publications (2)

Publication Number Publication Date
PL441866A1 true PL441866A1 (pl) 2023-05-15
PL245191B1 PL245191B1 (pl) 2024-05-27

Family

ID=77078851

Family Applications (1)

Application Number Title Priority Date Filing Date
PL441866A PL245191B1 (pl) 2020-01-30 2021-01-14 Elektrolityczna folia miedziana

Country Status (8)

Country Link
US (1) US12344953B2 (pl)
JP (1) JP7656555B2 (pl)
KR (1) KR102758515B1 (pl)
CN (1) CN114901872B (pl)
HU (1) HU231735B1 (pl)
PL (1) PL245191B1 (pl)
TW (1) TWI899142B (pl)
WO (1) WO2021153257A1 (pl)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA3221847A1 (en) * 2022-12-13 2024-06-13 Sk Nexilis Co., Ltd. Copper foil with high strength and high elongation, electrode comprising the same, secondary battery comprising the same, and method for manufacturing the same

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BR9105776A (pt) * 1990-05-30 1992-08-04 Gould Inc Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
JP2754157B2 (ja) 1994-03-31 1998-05-20 三井金属鉱業株式会社 プリント配線板用電解銅箔の製造方法
TW432124B (en) * 1996-05-13 2001-05-01 Mitsui Mining & Amp Smelting C Electrolytic copper foil with high post heat tensile strength and its manufacturing method
JPH10330983A (ja) 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
JP3850155B2 (ja) 1998-12-11 2006-11-29 日本電解株式会社 電解銅箔、二次電池の集電体用銅箔及び二次電池
JP4120806B2 (ja) 2002-10-25 2008-07-16 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
KR100772946B1 (ko) 2003-04-03 2007-11-02 후쿠다 킨조쿠 하쿠훈 코교 가부시키가이샤 저조면 전착 동박 및 그 제조 방법
JP4273309B2 (ja) * 2003-05-14 2009-06-03 福田金属箔粉工業株式会社 低粗面電解銅箔及びその製造方法
JP4549774B2 (ja) 2004-08-11 2010-09-22 三井金属鉱業株式会社 電解銅箔の製造方法
CN101146933B (zh) * 2005-03-31 2010-11-24 三井金属矿业株式会社 电解铜箔及电解铜箔的制造方法、采用该电解铜箔得到的表面处理电解铜箔、采用该表面处理电解铜箔的覆铜层压板及印刷电路板
US20090142607A1 (en) * 2005-04-04 2009-06-04 Ube Industries Ltd Copper clad laminate
JP2007146289A (ja) * 2005-10-31 2007-06-14 Mitsui Mining & Smelting Co Ltd 電解銅箔の製造方法、該製造方法で得られる電解銅箔、該電解銅箔を用いて得られる表面処理銅箔及び該電解銅箔又は該表面処理銅箔を用いて得られる銅張積層板
US9307639B2 (en) * 2006-04-28 2016-04-05 Mitsui Mining & Smelting Co., Ltd. Electro-deposited copper foil, surface-treated copper foil using the electro-deposited copper foil and copper clad laminate using the surface-treated copper foil, and a method for manufacturing the electro-deposited copper foil
TWI414638B (zh) * 2006-06-07 2013-11-11 Furukawa Electric Co Ltd A method for manufacturing a surface-treated electrolytic copper foil, and a circuit board
KR101385760B1 (ko) * 2010-07-01 2014-04-17 미쓰이금속광업주식회사 전해 동박 및 그 제조 방법
CN103649377B (zh) 2011-06-28 2016-05-11 古河电气工业株式会社 电解铜箔、使用该电解铜箔的线路板及可挠性线路板
JP2014037582A (ja) * 2012-08-17 2014-02-27 Jx Nippon Mining & Metals Corp 電解銅箔
KR20150039711A (ko) 2012-12-27 2015-04-13 후루카와 덴키 고교 가부시키가이샤 저반발성 전해 동박, 상기 전해 동박을 사용한 배선판 및 플렉시블 배선판
JP5740052B2 (ja) * 2013-01-29 2015-06-24 古河電気工業株式会社 電解銅箔及びその製造方法
KR101813818B1 (ko) 2013-08-01 2017-12-29 후루카와 덴키 고교 가부시키가이샤 프린트 배선 기판용 구리박
US10190225B2 (en) 2017-04-18 2019-01-29 Chang Chun Petrochemical Co., Ltd. Electrodeposited copper foil with low repulsive force
CN110093637A (zh) 2019-06-11 2019-08-06 九江德福科技股份有限公司 用于挠性覆铜板、挠性印制电路板的电解铜箔及制备方法

Also Published As

Publication number Publication date
JP7656555B2 (ja) 2025-04-03
WO2021153257A1 (ja) 2021-08-05
HUP2200353A1 (hu) 2022-11-28
US20230074384A1 (en) 2023-03-09
TWI899142B (zh) 2025-10-01
KR102758515B1 (ko) 2025-01-23
HU231735B1 (hu) 2026-01-28
KR20220101691A (ko) 2022-07-19
CN114901872B (zh) 2024-08-06
CN114901872A (zh) 2022-08-12
TW202132627A (zh) 2021-09-01
US12344953B2 (en) 2025-07-01
PL245191B1 (pl) 2024-05-27
HUP2200353A2 (en) 2022-11-28
JPWO2021153257A1 (pl) 2021-08-05

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