BR9105776A - Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada - Google Patents

Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada

Info

Publication number
BR9105776A
BR9105776A BR919105776A BR9105776A BR9105776A BR 9105776 A BR9105776 A BR 9105776A BR 919105776 A BR919105776 A BR 919105776A BR 9105776 A BR9105776 A BR 9105776A BR 9105776 A BR9105776 A BR 9105776A
Authority
BR
Brazil
Prior art keywords
electrodeposited copper
copper film
bath
copper
ions
Prior art date
Application number
BR919105776A
Other languages
English (en)
Inventor
Sidney J Clouser
Dino F Difranco
Craig J Hasegawa
Original Assignee
Gould Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gould Inc filed Critical Gould Inc
Publication of BR9105776A publication Critical patent/BR9105776A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/934—Electrical process
    • Y10S428/935—Electroplating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12431—Foil or filament smaller than 6 mils
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12993—Surface feature [e.g., rough, mirror]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Air Conditioning Control Device (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
BR919105776A 1990-05-30 1991-05-24 Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada BR9105776A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US53145290A 1990-05-30 1990-05-30
PCT/US1991/003695 WO1991019024A1 (en) 1990-05-30 1991-05-24 Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations

Publications (1)

Publication Number Publication Date
BR9105776A true BR9105776A (pt) 1992-08-04

Family

ID=24117700

Family Applications (1)

Application Number Title Priority Date Filing Date
BR919105776A BR9105776A (pt) 1990-05-30 1991-05-24 Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada

Country Status (9)

Country Link
US (2) US5421985A (pt)
EP (1) EP0485588B1 (pt)
JP (2) JP3392414B2 (pt)
KR (1) KR100275899B1 (pt)
AT (1) ATE151474T1 (pt)
AU (1) AU7952791A (pt)
BR (1) BR9105776A (pt)
DE (1) DE69125573T2 (pt)
WO (1) WO1991019024A1 (pt)

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US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
US5366612A (en) * 1993-04-19 1994-11-22 Magma Copper Company Process for making copper foil
US5670033A (en) * 1993-04-19 1997-09-23 Electrocopper Products Limited Process for making copper metal powder, copper oxides and copper foil
US5679232A (en) * 1993-04-19 1997-10-21 Electrocopper Products Limited Process for making wire
AU682356B2 (en) * 1993-04-19 1997-10-02 Ga-Tek Inc. Process for making copper metal powder, copper oxides and copper foil
US6123788A (en) * 1993-04-19 2000-09-26 Electrocopper Products Limited Copper wire and process for making copper wire
JP3263750B2 (ja) 1993-12-08 2002-03-11 奥野製薬工業株式会社 酸性銅めっき浴及びこれを使用するめっき方法
JP3709221B2 (ja) * 1994-10-06 2005-10-26 古河サーキットフォイル株式会社 銅箔の表面粗化処理方法
US6132887A (en) * 1995-06-16 2000-10-17 Gould Electronics Inc. High fatigue ductility electrodeposited copper foil
JP3313277B2 (ja) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 ファインパターン用電解銅箔とその製造方法
MY138743A (en) * 1996-05-13 2009-07-31 Mitsui Mining & Smelting Co High tensile strength electrodeposited copper foil and the production process of the same
TW336325B (en) * 1996-05-24 1998-07-11 Electrocopper Products Ltd Copper wire and process for making copper wire
KR100327955B1 (ko) * 1996-08-23 2002-05-09 마이클 에이. 센타니 고성능가요성라미네이트
US5863666A (en) * 1997-08-07 1999-01-26 Gould Electronics Inc. High performance flexible laminate
KR19980024945A (ko) * 1996-09-26 1998-07-06 야마모토 히데키 범프 접점을 갖는 회로 기판의 제조 방법 및 그 방법에 사용되는 제트 분사형 도금 장치
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JP3250994B2 (ja) * 1999-12-28 2002-01-28 三井金属鉱業株式会社 電解銅箔
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JP3963907B2 (ja) * 2004-05-26 2007-08-22 三井金属鉱業株式会社 純銅被覆銅箔及びその製造方法、並びにｔａｂテープ及びその製造方法
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JP4583149B2 (ja) * 2004-12-01 2010-11-17 三井金属鉱業株式会社 電解銅箔及びその製造方法
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JP2011091114A (ja) * 2009-10-20 2011-05-06 Nitto Denko Corp 配線回路基板およびその製法
PH12013501034B1 (en) 2010-11-22 2018-01-12 Mitsui Mining & Smelting Co Ltd Surface treated copper foil
JP5822928B2 (ja) * 2011-07-13 2015-11-25 Jx日鉱日石金属株式会社 強度が高く、かつ反りの少ない電解銅箔及びその製造方法
CN103827358B (zh) * 2011-10-31 2018-05-15 古河电气工业株式会社 高强度、高耐热电解铜箔及其制造方法
JP5858849B2 (ja) * 2012-03-30 2016-02-10 Jx日鉱日石金属株式会社 金属箔
JP6067256B2 (ja) * 2012-06-27 2017-01-25 古河電気工業株式会社 電解銅箔、リチウムイオン二次電池用負極電極及びリチウムイオン二次電池
TWI539033B (zh) * 2013-01-07 2016-06-21 Chang Chun Petrochemical Co Electrolytic copper foil and its preparation method
KR101571060B1 (ko) 2013-11-28 2015-11-24 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지, 및 전해동박 제조방법
KR101571063B1 (ko) 2013-11-28 2015-11-24 일진머티리얼즈 주식회사 전해동박, 이를 포함하는 전기부품 및 전지, 및 전해동박 제조방법
KR101633725B1 (ko) * 2014-05-13 2016-06-27 (주)피엔티 합금박 제조 장치
US9707738B1 (en) 2016-01-14 2017-07-18 Chang Chun Petrochemical Co., Ltd. Copper foil and methods of use
JP6721547B2 (ja) * 2017-07-27 2020-07-15 ケイシーエフ テクノロジース カンパニー リミテッド 高い引張強度を有する電解銅箔、それを含む電極、それを含む二次電池、およびその製造方法
TWI679314B (zh) * 2018-06-07 2019-12-11 國立中興大學 以單一電鍍槽製備銅箔生箔同時形成粗化毛面的方法及該銅箔生箔
US12344953B2 (en) 2020-01-30 2025-07-01 Mitsui Mining & Smelting Co., Ltd. Electrolytic copper foil
CN116815257B (zh) * 2023-06-21 2025-09-05 九江德福科技股份有限公司 一种制备微孔铜箔的电解液方法
WO2025026863A1 (en) * 2023-08-03 2025-02-06 Basf Se Composition for copper electroplating on a metal seed

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Also Published As

Publication number Publication date
DE69125573T2 (de) 1997-07-17
AU7952791A (en) 1991-12-31
EP0485588A4 (en) 1993-03-31
EP0485588A1 (en) 1992-05-20
JP3392414B2 (ja) 2003-03-31
ATE151474T1 (de) 1997-04-15
JPH05502062A (ja) 1993-04-15
US5454926A (en) 1995-10-03
DE69125573D1 (de) 1997-05-15
WO1991019024A1 (en) 1991-12-12
KR920703881A (ko) 1992-12-18
JP2001247994A (ja) 2001-09-14
KR100275899B1 (ko) 2000-12-15
US5421985A (en) 1995-06-06
EP0485588B1 (en) 1997-04-09

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