PL442865A1 - Adhesive composition and method of its preparation - Google Patents
Adhesive composition and method of its preparationInfo
- Publication number
- PL442865A1 PL442865A1 PL442865A PL44286522A PL442865A1 PL 442865 A1 PL442865 A1 PL 442865A1 PL 442865 A PL442865 A PL 442865A PL 44286522 A PL44286522 A PL 44286522A PL 442865 A1 PL442865 A1 PL 442865A1
- Authority
- PL
- Poland
- Prior art keywords
- composition
- weight
- amount
- sup
- filler
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 4
- 239000003822 epoxy resin Substances 0.000 abstract 4
- 239000000945 filler Substances 0.000 abstract 4
- 229920000647 polyepoxide Polymers 0.000 abstract 4
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 2
- -1 aliphatic amine amine Chemical class 0.000 abstract 2
- 125000005210 alkyl ammonium group Chemical group 0.000 abstract 2
- 150000001412 amines Chemical class 0.000 abstract 2
- 229910000278 bentonite Inorganic materials 0.000 abstract 2
- 239000000440 bentonite Substances 0.000 abstract 2
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical class O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 abstract 2
- 239000007795 chemical reaction product Substances 0.000 abstract 2
- 239000004848 polyfunctional curative Substances 0.000 abstract 2
- KPJKMUJJFXZGAX-UHFFFAOYSA-N 2-chloropropan-2-ylbenzene Chemical group CC(C)(Cl)C1=CC=CC=C1 KPJKMUJJFXZGAX-UHFFFAOYSA-N 0.000 abstract 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 abstract 1
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Natural products C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 abstract 1
- 125000006182 dimethyl benzyl group Chemical group 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 125000003011 styrenyl group Chemical group [H]\C(*)=C(/[H])C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 abstract 1
- 238000013022 venting Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
Przedmiotem zgłoszenia jest kompozycja klejowa, która charakteryzuje się tym, że składa się z modyfikowanej za pomocą styrenu żywicy epoksydowej, będącej produktem reakcji bisfenolu A i epichlorohydryny, o średniej masie cząsteczkowej ≤ 700 i liczbie epoksydowej od 0,41 do 0,51 mol/100 g w ilości 89,69% wagowo składu kompozycji, utwardzacza aminowego aminy alifatycznej o liczbie aminowej co najmniej 1100 mg KOH/g w ilości 8,96% wagowo składu kompozycji oraz napełniacza w postaci bentonitu modyfikowanego chlorkiem dimetylobenzylo(C<sub>12-18</sub>)alkiloamoniowym o gęstości nasypowej < 0,6 g/cm<sup>3</sup> ilości 1,35% wagowo składu kompozycji. Zgłoszenie obejmuje także sposób wytwarzania kompozycji klejowej, który polega na tym, że do pojemnika z podgrzaną do temperatury 50°C modyfikowaną za pomocą styrenu żywicą epoksydową, będącą produktem reakcji bisfenolu A i epichlorohydryny, o średniej masie cząsteczkowej ≤ 700 i liczbie epoksydowej od 0,41 do 0,51 mol/100 g w ilości 89,69% wagowo składu kompozycji dodaje się napełniacz w postaci bentonitu modyfikowanego chlorkiem dimetylobenzylo(C<sub>12-18</sub>)alkiloamoniowym o gęstości nasypowej < 0,6 g/cm<sup>3</sup> w ilości 1,35% wagowo składu kompozycji, po czym miesza się żywicę epoksydową z napełniaczem z prędkością obrotową 1170 obr./min przez 2 minuty mieszadłem tarczowym dyspergującym z jednoczesnym odpowietrzaniem w temperaturze 23°C i przy wilgotności powietrza 26%. Następnie po wymieszaniu żywicy epoksydowej z napełniaczem dodaje się utwardzacz aminowy aminy alifatycznej o liczbie aminowej co najmniej 1100 mg KOH/g w ilości 8,96% wagowo składu kompozycji, po czym miesza się całość z prędkością obrotową 1170 obr./min przez 2 minuty za pomocą mieszadła tarczowego dyspergującego z jednoczesnym odpowietrzaniem w temperaturze 23°C i przy wilgotności powietrza 26%. Następnie całość utwardza się przez 7 dni w temperaturze 23°C i przy wilgotności powietrza 26%.The subject of the application is an adhesive composition characterized in that it consists of a styrene-modified epoxy resin, which is a reaction product of bisphenol A and epichlorohydrin, with an average molecular weight ≤ 700 and an epoxy number of 0.41 to 0.51 mol/100 g in the amount of 89.69% by weight of the composition, an aliphatic amine amine hardener with an amine number of at least 1100 mg KOH/g in the amount of 8.96% by weight of the composition and a filler in the form of bentonite modified with dimethylbenzyl chloride (C<sub>12-18</ sub>)alkylammonium with a bulk density of <0.6 g/cm<sup>3</sup> in an amount of 1.35% by weight of the composition composition. The application also includes a method for producing an adhesive composition, which consists in filling a container with an epoxy resin modified with styrene, which is a reaction product of bisphenol A and epichlorohydrin, having an average molecular weight ≤ 700 and an epoxy number of 0, 41 to 0.51 mol/100 g in the amount of 89.69% by weight of the composition, a filler is added in the form of bentonite modified with dimethylbenzyl(C<sub>12-18</sub>)alkylammonium chloride with a bulk density < 0.6 g/cm <sup>3</sup> in the amount of 1.35% by weight of the composition, and then the epoxy resin is mixed with the filler at a rotational speed of 1170 rpm for 2 minutes using a dispersing disc mixer with simultaneous deaeration at a temperature of 23°C and air humidity 26%. Then, after mixing the epoxy resin with the filler, an aliphatic amine amine hardener with an amine number of at least 1100 mg KOH/g is added in the amount of 8.96% by weight of the composition, and then the whole is mixed at a rotational speed of 1170 rpm for 2 minutes with a dispersing disc mixer with simultaneous venting at 23°C and 26% air humidity. Then, the whole thing is cured for 7 days at 23°C and 26% humidity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL442865A PL245698B1 (en) | 2022-11-18 | 2022-11-18 | Adhesive composition and method of producing it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL442865A PL245698B1 (en) | 2022-11-18 | 2022-11-18 | Adhesive composition and method of producing it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| PL442865A1 true PL442865A1 (en) | 2023-03-27 |
| PL245698B1 PL245698B1 (en) | 2024-09-23 |
Family
ID=85785151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PL442865A PL245698B1 (en) | 2022-11-18 | 2022-11-18 | Adhesive composition and method of producing it |
Country Status (1)
| Country | Link |
|---|---|
| PL (1) | PL245698B1 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| PL439373A1 (en) * | 2021-11-02 | 2022-09-12 | Politechnika Lubelska | Method of producing adhesive composition and adhesive composition |
-
2022
- 2022-11-18 PL PL442865A patent/PL245698B1/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| PL245698B1 (en) | 2024-09-23 |
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