SE0100367L - Förfarande och anordning för passiv upplinjering - Google Patents

Förfarande och anordning för passiv upplinjering

Info

Publication number
SE0100367L
SE0100367L SE0100367A SE0100367A SE0100367L SE 0100367 L SE0100367 L SE 0100367L SE 0100367 A SE0100367 A SE 0100367A SE 0100367 A SE0100367 A SE 0100367A SE 0100367 L SE0100367 L SE 0100367L
Authority
SE
Sweden
Prior art keywords
passive alignment
carrier
precision
alignment method
laser
Prior art date
Application number
SE0100367A
Other languages
Unknown language ( )
English (en)
Other versions
SE0100367D0 (sv
SE519713C2 (sv
Inventor
Paul Eriksen
Christian Vieider
Goeran Palmskog
Mats Granberg
Krister Froejdh
Pontus Lundstroem
Thomas Ericson
Lennart Baecklin
Original Assignee
Ericsson Telefon Ab L M
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from SE0001954A external-priority patent/SE0001954D0/sv
Application filed by Ericsson Telefon Ab L M filed Critical Ericsson Telefon Ab L M
Priority to SE0100367A priority Critical patent/SE519713C2/sv
Publication of SE0100367D0 publication Critical patent/SE0100367D0/sv
Priority to PCT/SE2001/001181 priority patent/WO2001090794A1/en
Priority to KR1020027000938A priority patent/KR100902433B1/ko
Priority to DE60142832T priority patent/DE60142832D1/de
Priority to CN01801356A priority patent/CN1380987A/zh
Priority to JP2001586503A priority patent/JP4808900B2/ja
Priority to AT01934792T priority patent/ATE478356T1/de
Priority to EP01934792A priority patent/EP1290481B1/en
Priority to CA2380240A priority patent/CA2380240C/en
Priority to AU60942/01A priority patent/AU6094201A/en
Priority to US09/862,461 priority patent/US20020019068A1/en
Publication of SE0100367L publication Critical patent/SE0100367L/sv
Publication of SE519713C2 publication Critical patent/SE519713C2/sv
Priority to US11/177,493 priority patent/US7317746B2/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/05—Construction or shape of optical resonators; Accommodation of active medium therein; Shape of active medium
    • H01S3/06—Construction or shape of active medium
    • H01S3/063—Waveguide lasers, i.e. whereby the dimensions of the waveguide are of the order of the light wavelength
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Optical Integrated Circuits (AREA)
  • Manipulator (AREA)
  • Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)
SE0100367A 2000-05-23 2001-02-06 Förfarande och anordning för passiv upplinjering SE519713C2 (sv)

Priority Applications (12)

Application Number Priority Date Filing Date Title
SE0100367A SE519713C2 (sv) 2000-05-23 2001-02-06 Förfarande och anordning för passiv upplinjering
US09/862,461 US20020019068A1 (en) 2000-05-23 2001-05-23 Method and device for passive alignment
AU60942/01A AU6094201A (en) 2000-05-23 2001-05-23 Method and device for passive alignment
JP2001586503A JP4808900B2 (ja) 2000-05-23 2001-05-23 受動位置合わせの方法および装置
KR1020027000938A KR100902433B1 (ko) 2000-05-23 2001-05-23 수동 정렬을 위한 방법 및 장치
DE60142832T DE60142832D1 (de) 2000-05-23 2001-05-23 Verfahren und vorrichtung zur passiven ausrichtung
CN01801356A CN1380987A (zh) 2000-05-23 2001-05-23 被动校准的方法和装置
PCT/SE2001/001181 WO2001090794A1 (en) 2000-05-23 2001-05-23 Method and device for passive alignment
AT01934792T ATE478356T1 (de) 2000-05-23 2001-05-23 Verfahren und vorrichtung zur passiven ausrichtung
EP01934792A EP1290481B1 (en) 2000-05-23 2001-05-23 Method and device for passive alignment
CA2380240A CA2380240C (en) 2000-05-23 2001-05-23 Method and device for passive alignment
US11/177,493 US7317746B2 (en) 2000-05-23 2005-07-11 Method and device for passive alignment

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE0001954A SE0001954D0 (sv) 2000-05-23 2000-05-23 Anordning för passiv upplinjering
SE0100367A SE519713C2 (sv) 2000-05-23 2001-02-06 Förfarande och anordning för passiv upplinjering

Publications (3)

Publication Number Publication Date
SE0100367D0 SE0100367D0 (sv) 2001-02-06
SE0100367L true SE0100367L (sv) 2001-11-26
SE519713C2 SE519713C2 (sv) 2003-04-01

Family

ID=26655120

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0100367A SE519713C2 (sv) 2000-05-23 2001-02-06 Förfarande och anordning för passiv upplinjering

Country Status (11)

Country Link
US (2) US20020019068A1 (sv)
EP (1) EP1290481B1 (sv)
JP (1) JP4808900B2 (sv)
KR (1) KR100902433B1 (sv)
CN (1) CN1380987A (sv)
AT (1) ATE478356T1 (sv)
AU (1) AU6094201A (sv)
CA (1) CA2380240C (sv)
DE (1) DE60142832D1 (sv)
SE (1) SE519713C2 (sv)
WO (1) WO2001090794A1 (sv)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3975066B2 (ja) * 2001-10-12 2007-09-12 株式会社トプコン レーザ発振装置
US7223635B1 (en) * 2003-07-25 2007-05-29 Hrl Laboratories, Llc Oriented self-location of microstructures with alignment structures
JP4699262B2 (ja) * 2006-03-31 2011-06-08 京セラ株式会社 光導波路コネクタ及びそれを用いた光接続構造、並びに光導波路コネクタの製造方法
JP4754613B2 (ja) * 2008-11-27 2011-08-24 日東電工株式会社 光電気混載基板およびその製造方法
US8265436B2 (en) 2010-05-12 2012-09-11 Industrial Technology Research Institute Bonding system for optical alignment
JP6052815B2 (ja) 2014-09-30 2016-12-27 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ 導波路用のコネクタおよびアライメント方法
US10852492B1 (en) * 2014-10-29 2020-12-01 Acacia Communications, Inc. Techniques to combine two integrated photonic substrates
US12124087B2 (en) 2015-10-08 2024-10-22 Teramount Ltd. Wideband surface coupling
US11585991B2 (en) 2019-02-28 2023-02-21 Teramount Ltd. Fiberless co-packaged optics
US10564374B2 (en) 2015-10-08 2020-02-18 Teramount Ltd. Electro-optical interconnect platform
US12164159B2 (en) 2021-12-22 2024-12-10 Teramount Ltd. Backside optical connector
US12189195B2 (en) 2015-10-08 2025-01-07 Teramount Ltd. Optical coupling
US12265259B2 (en) 2019-01-23 2025-04-01 Teramount Ltd. Waveguide mode coupling
US9804334B2 (en) 2015-10-08 2017-10-31 Teramount Ltd. Fiber to chip optical coupler
US12379555B2 (en) 2021-10-27 2025-08-05 Teramount Ltd. Detachable connector for co-packaged optics
US10048455B2 (en) * 2016-01-18 2018-08-14 Cisco Technology, Inc. Passive fiber array connector alignment to photonic chip
US9835809B2 (en) * 2016-03-28 2017-12-05 Cisco Technology, Inc. Alignment of optical components using nanomagnets
US10031299B2 (en) * 2016-05-27 2018-07-24 Corning Optical Communications LLC Silicon-based optical ports providing passive alignment connectivity
US10656339B2 (en) 2018-03-14 2020-05-19 Cisco Technology, Inc. Fiber to chip alignment using passive vgroove structures
US11500166B2 (en) * 2020-02-03 2022-11-15 Senko Advanced Components, Inc. Elastic averaging coupling
US11562984B1 (en) 2020-10-14 2023-01-24 Hrl Laboratories, Llc Integrated mechanical aids for high accuracy alignable-electrical contacts
US12057429B1 (en) 2021-06-23 2024-08-06 Hrl Laboratories, Llc Temporary bonding structures for die-to-die and wafer-to-wafer bonding

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JPH0339706A (ja) 1989-07-06 1991-02-20 Fujitsu Ltd 光モジュール
JP3090335B2 (ja) * 1990-12-03 2000-09-18 株式会社東芝 光半導体モジュール
JPH06130254A (ja) * 1992-10-15 1994-05-13 Toshiba Corp 光部品結合装置
US5412748A (en) * 1992-12-04 1995-05-02 Kabushiki Kaisha Toshiba Optical semiconductor module
DE4240950C1 (de) * 1992-12-07 1994-03-31 Bosch Gmbh Robert Verfahren zum Herstellen eines Deckels für eine integriert optische Schaltung und Deckel für eine integriert optische Schaltung
JPH0777634A (ja) * 1993-09-09 1995-03-20 Fujitsu Ltd 光端末装置
GB2293248B (en) * 1994-09-07 1998-02-18 Northern Telecom Ltd Providing optical coupling between optical components
US5535296A (en) * 1994-09-28 1996-07-09 Optobahn Corporation Integrated optoelectronic coupling and connector
TW298627B (en) * 1995-08-31 1997-02-21 At & T Corp Article comprising a fiber-to-planar waveguide coupling and method of making the article
SE510049C2 (sv) * 1996-03-25 1999-04-12 Ericsson Telefon Ab L M Anordning för att ansluta minst en vågledare till en optisk sändare eller mottagare
JPH1039176A (ja) * 1996-07-24 1998-02-13 Furukawa Electric Co Ltd:The 光素子の基板実装方法
KR100248407B1 (ko) * 1997-08-06 2000-03-15 이계철 광섬유와 광소자의 수동정렬 방법
DE19845227A1 (de) * 1998-10-01 2000-04-06 Daimler Chrysler Ag Anordnung zur Justage optischer Komponenten
JP2000121889A (ja) * 1998-10-21 2000-04-28 Nec Corp 光モジュール及び該光モジュールの製造方法
JP2000171669A (ja) * 1998-12-03 2000-06-23 Hitachi Ltd 光素子アレイモジュールおよびその製造方法ならびに多芯光コネクタと光素子搭載基板
US6219470B1 (en) * 1999-09-23 2001-04-17 Xiang Zheng Tu Wavelength division multiplexing transmitter and receiver module
JP2001324631A (ja) * 2000-05-12 2001-11-22 Nec Corp 基板、光ファイバ接続端部材、光素子ハウジング部材、光モジュール及び基板の製造方法

Also Published As

Publication number Publication date
WO2001090794A1 (en) 2001-11-29
US7317746B2 (en) 2008-01-08
SE0100367D0 (sv) 2001-02-06
US20060007972A1 (en) 2006-01-12
JP4808900B2 (ja) 2011-11-02
ATE478356T1 (de) 2010-09-15
CA2380240A1 (en) 2001-11-29
KR100902433B1 (ko) 2009-06-11
US20020019068A1 (en) 2002-02-14
EP1290481B1 (en) 2010-08-18
SE519713C2 (sv) 2003-04-01
DE60142832D1 (de) 2010-09-30
KR20020021161A (ko) 2002-03-18
EP1290481A1 (en) 2003-03-12
CN1380987A (zh) 2002-11-20
JP2003534568A (ja) 2003-11-18
CA2380240C (en) 2011-05-03
AU6094201A (en) 2001-12-03

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