SE0102476L - Metod och produkt för bondning - Google Patents

Metod och produkt för bondning

Info

Publication number
SE0102476L
SE0102476L SE0102476A SE0102476A SE0102476L SE 0102476 L SE0102476 L SE 0102476L SE 0102476 A SE0102476 A SE 0102476A SE 0102476 A SE0102476 A SE 0102476A SE 0102476 L SE0102476 L SE 0102476L
Authority
SE
Sweden
Prior art keywords
glass layer
conductive pattern
electrode
providing
bonding
Prior art date
Application number
SE0102476A
Other languages
English (en)
Other versions
SE0102476D0 (sv
SE523600C2 (sv
Inventor
Leif Bergstedt
Katrin Persson
Original Assignee
Imego Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Imego Ab filed Critical Imego Ab
Priority to SE0102476A priority Critical patent/SE523600C2/sv
Publication of SE0102476D0 publication Critical patent/SE0102476D0/sv
Priority to PCT/SE2002/001371 priority patent/WO2003006396A1/en
Priority to EP02747799A priority patent/EP1436237B1/en
Priority to AT02747799T priority patent/ATE356098T1/de
Priority to DE60218717T priority patent/DE60218717T2/de
Publication of SE0102476L publication Critical patent/SE0102476L/sv
Publication of SE523600C2 publication Critical patent/SE523600C2/sv

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B81C1/00357—Creating layers of material on a substrate involving bonding one or several substrates on a non-temporary support, e.g. another substrate
    • H01L21/02104—
    • H01L21/447—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Supplying Of Containers To The Packaging Station (AREA)
  • Containers And Plastic Fillers For Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
SE0102476A 2001-07-09 2001-07-09 Metod för anodisk bodning SE523600C2 (sv)

Priority Applications (5)

Application Number Priority Date Filing Date Title
SE0102476A SE523600C2 (sv) 2001-07-09 2001-07-09 Metod för anodisk bodning
PCT/SE2002/001371 WO2003006396A1 (en) 2001-07-09 2002-07-09 Bonding method and product
EP02747799A EP1436237B1 (en) 2001-07-09 2002-07-09 Bonding method and product
AT02747799T ATE356098T1 (de) 2001-07-09 2002-07-09 Verbindungsverfahren und produkt
DE60218717T DE60218717T2 (de) 2001-07-09 2002-07-09 Verfahren zum anodischen Bonden und Produkt

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SE0102476A SE523600C2 (sv) 2001-07-09 2001-07-09 Metod för anodisk bodning

Publications (3)

Publication Number Publication Date
SE0102476D0 SE0102476D0 (sv) 2001-07-09
SE0102476L true SE0102476L (sv) 2003-01-10
SE523600C2 SE523600C2 (sv) 2004-05-04

Family

ID=20284811

Family Applications (1)

Application Number Title Priority Date Filing Date
SE0102476A SE523600C2 (sv) 2001-07-09 2001-07-09 Metod för anodisk bodning

Country Status (5)

Country Link
EP (1) EP1436237B1 (sv)
AT (1) ATE356098T1 (sv)
DE (1) DE60218717T2 (sv)
SE (1) SE523600C2 (sv)
WO (1) WO2003006396A1 (sv)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5281739B2 (ja) * 2006-07-18 2013-09-04 新光電気工業株式会社 陽極接合装置
CN103145096B (zh) * 2013-03-27 2015-04-08 山东理工大学 一种硅片与玻璃片的低温超声阳极键合方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03233429A (ja) * 1990-02-08 1991-10-17 Mitsubishi Electric Corp 液晶表示素子の製造方法
US6127629A (en) * 1994-10-03 2000-10-03 Ford Global Technologies, Inc. Hermetically sealed microelectronic device and method of forming same
ATE179153T1 (de) * 1995-01-20 1999-05-15 Fraunhofer Ges Forschung Verfahren zur herstellung von glasschichten zum zwecke des anodischen bondens

Also Published As

Publication number Publication date
DE60218717D1 (de) 2007-04-19
SE0102476D0 (sv) 2001-07-09
WO2003006396A1 (en) 2003-01-23
DE60218717T2 (de) 2007-11-15
EP1436237A1 (en) 2004-07-14
EP1436237B1 (en) 2007-03-07
ATE356098T1 (de) 2007-03-15
SE523600C2 (sv) 2004-05-04
WO2003006396B1 (en) 2004-04-08

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Legal Events

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