SE361381B - - Google Patents
Info
- Publication number
- SE361381B SE361381B SE09757/71A SE975771A SE361381B SE 361381 B SE361381 B SE 361381B SE 09757/71 A SE09757/71 A SE 09757/71A SE 975771 A SE975771 A SE 975771A SE 361381 B SE361381 B SE 361381B
- Authority
- SE
- Sweden
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/04—Manufacture or treatment of leadframes
- H10W70/042—Etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/424—Cross-sectional shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19702037666 DE2037666A1 (de) | 1970-07-29 | 1970-07-29 | Verfahren zum Kontaktieren eines mit mehreren Elektroden versehenen Halbleiterkörpers mit Hilfe eines aus einem Metallblech hergestellten Systems von elektrischen Zuleitungen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SE361381B true SE361381B (de) | 1973-10-29 |
Family
ID=5778271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SE09757/71A SE361381B (de) | 1970-07-29 | 1971-07-29 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US3795044A (de) |
| AT (1) | AT339962B (de) |
| CA (1) | CA932482A (de) |
| CH (1) | CH524248A (de) |
| DE (1) | DE2037666A1 (de) |
| FR (1) | FR2099654B1 (de) |
| GB (1) | GB1320619A (de) |
| NL (1) | NL7110490A (de) |
| SE (1) | SE361381B (de) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3853650A (en) * | 1973-02-12 | 1974-12-10 | Honeywell Inc | Stress sensor diaphragms over recessed substrates |
| US4711700A (en) * | 1985-07-03 | 1987-12-08 | United Technologies Corporation | Method for densifying leadframe conductor spacing |
| GB2178895B (en) * | 1985-08-06 | 1988-11-23 | Gen Electric Co Plc | Improved preparation of fragile devices |
| US5205036A (en) * | 1988-10-17 | 1993-04-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device with selective coating on lead frame |
| KR930006868A (ko) * | 1991-09-11 | 1993-04-22 | 문정환 | 반도체 패키지 |
| JPH05102364A (ja) * | 1991-10-11 | 1993-04-23 | Rohm Co Ltd | 電子部品用リードフレームの製造方法 |
| US5454905A (en) * | 1994-08-09 | 1995-10-03 | National Semiconductor Corporation | Method for manufacturing fine pitch lead frame |
| JPH10116861A (ja) * | 1996-10-09 | 1998-05-06 | Texas Instr Japan Ltd | キャリアテープ、及びキャリアテープ製造方法 |
| DE10321257B4 (de) | 2003-05-06 | 2006-04-27 | Infineon Technologies Ag | Optische oder optoelektronische Anordnung mit mindestens einem auf einem Metallträger angeordneten optoelektronischen Bauelement |
| US6815806B1 (en) * | 2003-07-17 | 2004-11-09 | International Business Machines Corp. | Asymmetric partially-etched leads for finer pitch semiconductor chip package |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3390308A (en) * | 1966-03-31 | 1968-06-25 | Itt | Multiple chip integrated circuit assembly |
| US3436810A (en) * | 1967-07-17 | 1969-04-08 | Jade Corp | Method of packaging integrated circuits |
| US3559285A (en) * | 1968-01-08 | 1971-02-02 | Jade Corp | Method of forming leads for attachment to semi-conductor devices |
| DE1954135A1 (de) * | 1969-10-28 | 1971-05-06 | Licentia Gmbh | Verfahren zum Herstellen einer Halbleiteranordnung |
-
1970
- 1970-07-29 DE DE19702037666 patent/DE2037666A1/de active Pending
-
1971
- 1971-07-02 CH CH975571A patent/CH524248A/de not_active IP Right Cessation
- 1971-07-13 GB GB3268971A patent/GB1320619A/en not_active Expired
- 1971-07-15 AT AT617871A patent/AT339962B/de not_active IP Right Cessation
- 1971-07-22 US US00164999A patent/US3795044A/en not_active Expired - Lifetime
- 1971-07-28 FR FR7127574A patent/FR2099654B1/fr not_active Expired
- 1971-07-29 NL NL7110490A patent/NL7110490A/xx unknown
- 1971-07-29 SE SE09757/71A patent/SE361381B/xx unknown
- 1971-07-29 CA CA119383A patent/CA932482A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| CA932482A (en) | 1973-08-21 |
| NL7110490A (de) | 1972-02-01 |
| GB1320619A (en) | 1973-06-20 |
| DE2037666A1 (de) | 1972-02-03 |
| US3795044A (en) | 1974-03-05 |
| AT339962B (de) | 1977-11-25 |
| FR2099654B1 (de) | 1977-03-18 |
| ATA617871A (de) | 1977-03-15 |
| FR2099654A1 (de) | 1972-03-17 |
| CH524248A (de) | 1972-06-15 |