SE363190B - - Google Patents

Info

Publication number
SE363190B
SE363190B SE1774769A SE1774769A SE363190B SE 363190 B SE363190 B SE 363190B SE 1774769 A SE1774769 A SE 1774769A SE 1774769 A SE1774769 A SE 1774769A SE 363190 B SE363190 B SE 363190B
Authority
SE
Sweden
Application number
SE1774769A
Inventor
D E Piccone
D B Rosser
Original Assignee
Gen Electric
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gen Electric filed Critical Gen Electric
Publication of SE363190B publication Critical patent/SE363190B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
SE1774769A 1968-12-23 1969-12-22 SE363190B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US78625168A 1968-12-23 1968-12-23

Publications (1)

Publication Number Publication Date
SE363190B true SE363190B (de) 1974-01-07

Family

ID=25138058

Family Applications (1)

Application Number Title Priority Date Filing Date
SE1774769A SE363190B (de) 1968-12-23 1969-12-22

Country Status (7)

Country Link
US (1) US3581160A (de)
BR (1) BR6915542D0 (de)
CH (1) CH507587A (de)
DE (2) DE6948923U (de)
ES (1) ES374813A1 (de)
GB (1) GB1293915A (de)
SE (1) SE363190B (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3686540A (en) * 1970-08-03 1972-08-22 Gen Motors Corp Cold welded-ceramic semiconductor package
US3751800A (en) * 1970-08-04 1973-08-14 Gen Motors Corp Method of fabricating a semiconductor enclosure
US3688163A (en) * 1970-08-04 1972-08-29 Gen Motors Corp Cold welded semiconductor package having integral cold welding oil
CH601917A5 (de) * 1976-10-27 1978-07-14 Bbc Brown Boveri & Cie
JPS5354971A (en) * 1976-10-28 1978-05-18 Mitsubishi Electric Corp Semiconductor device
US4099201A (en) * 1977-04-11 1978-07-04 General Electric Company Semiconductor rectifier assembly having an insulating material therein that evolves gases when exposed to an arc
JPS5635443A (en) * 1979-08-31 1981-04-08 Toshiba Corp Semiconductor device
JPH0693468B2 (ja) * 1988-08-09 1994-11-16 株式会社東芝 圧接平型半導体装置
JPH0760893B2 (ja) * 1989-11-06 1995-06-28 三菱電機株式会社 半導体装置およびその製造方法
JPH04352457A (ja) * 1991-05-30 1992-12-07 Mitsubishi Electric Corp 圧接型半導体装置及びその製造方法
DE4214794B4 (de) * 1992-05-04 2005-03-24 Marquardt Gmbh Elektrische Schalteranordnung
JP3347888B2 (ja) * 1994-08-11 2002-11-20 アルプス電気株式会社 プリント基板保持構造
GB2341579B (en) 1998-09-16 2003-04-16 Agra Vadeko Inc Apparatus and method of marking polymer-based laminates
DE10055177B4 (de) * 2000-11-08 2009-06-10 Infineon Technologies Ag Elektronisches Bauelement mit einem Halbleiter, insbesondere einem Leistungshalbleiter, mit Trennwänden zwischen den Anschlussstiften
US7143500B2 (en) * 2001-06-25 2006-12-05 Micron Technology, Inc. Method to prevent damage to probe card
US7132698B2 (en) * 2002-01-25 2006-11-07 International Rectifier Corporation Compression assembled electronic package having a plastic molded insulation ring
DE10306767A1 (de) * 2003-02-18 2004-08-26 eupec Europäische Gesellschaft für Leistungshalbleiter mbH Halbleitermodul
KR20110068420A (ko) * 2009-12-16 2011-06-22 (주)디티알 폴리머 핀 애자 및 폴리머 핀 애자의 제조 방법
WO2025131269A1 (en) * 2023-12-20 2025-06-26 Hitachi Energy Ltd. Power semiconductor module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1489791A1 (de) * 1964-12-22 1969-06-12 Ckd Praha Narodni Podnik Halbleiterbauelement mit einer Flaechenhalbleiteranordnung zwischen durch Federdruck angepressten Elektrodenkontaktplatten
US3437887A (en) * 1966-06-03 1969-04-08 Westinghouse Electric Corp Flat package encapsulation of electrical devices
GB1191887A (en) * 1966-09-02 1970-05-13 Gen Electric Semiconductor Rectifier Assemblies
US3457472A (en) * 1966-10-10 1969-07-22 Gen Electric Semiconductor devices adapted for pressure mounting

Also Published As

Publication number Publication date
GB1293915A (en) 1972-10-25
DE6948923U (de) 1972-09-14
ES374813A1 (es) 1972-01-16
DE1963478A1 (de) 1971-02-11
CH507587A (de) 1971-05-15
BR6915542D0 (pt) 1973-01-02
US3581160A (en) 1971-05-25

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