SE369027B - - Google Patents

Info

Publication number: SE369027B
Authority: SE; Sweden

Application number

SE406770A

Inventor

F Schneble

Cormack J Mc

R Zeblisky

J Williamson

J Polichette

Original Assignee

Photocircuits Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1969-03-27

Filing date

1970-03-24

Publication date

1974-07-29

1969-03-27 Priority claimed from US00811142A external-priority patent/US3799802A/en

1970-03-24 Application filed by Photocircuits Corp filed Critical Photocircuits Corp

1974-07-29 Publication of SE369027B publication Critical patent/SE369027B/xx

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/09436—Pads or lands on permanent coating which covers the other conductors
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/054—Continuous temporary metal layer over resist, e.g. for selective electroplating
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1383—Temporary protective insulating layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Chemical & Material Sciences (AREA)
Manufacturing & Machinery (AREA)
Materials Engineering (AREA)
Chemical Kinetics & Catalysis (AREA)
General Chemical & Material Sciences (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Manufacturing Of Printed Wiring (AREA)
Insulated Metal Substrates For Printed Circuits (AREA)

SE406770A 1969-03-27 1970-03-24 SE369027B (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US00811142A US3799802A (en)	1966-06-28	1969-03-27	Plated through hole printed circuit boards

Publications (1)

Publication Number	Publication Date
SE369027B true SE369027B (de)	1974-07-29

Family

ID=25205692

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SE406770A SE369027B (de)	1969-03-27	1970-03-24

Country Status (7)

Country	Link
AT (2)	AT311460B (de)
CA (1)	CA939831A (de)
CH (2)	CH504147A (de)
DE (2)	DE2014138C3 (de)
FR (1)	FR2040016A5 (de)
NL (1)	NL173700C (de)
SE (1)	SE369027B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2809013C2 (de) *	1978-02-28	1985-08-01	Ruwel-Werke Spezialfabrik für Hochfrequenzbauteile GmbH, 4170 Geldern	Verfahren zum Herstellen einer mit Bauelementen bestückten gedruckten Schaltungsplatte
DE3427015A1 (de) *	1984-07-21	1986-01-30	Nippon Mektron, Ltd., Tokio/Tokyo	Verfahren zur herstellung von durchkontaktierungen in gedruckten schaltungen
EP0216513A3 (de) *	1985-08-22	1987-10-21	Amoco Corporation	Behandlung von perforierten Kupfer-Thermoplast-Laminaten
WO2000016443A1 (en) *	1998-09-10	2000-03-23	Viasystems Group, Inc.	Non-circular micro-via
US9922951B1 (en) *	2016-11-12	2018-03-20	Sierra Circuits, Inc.	Integrated circuit wafer integration with catalytic laminate or adhesive

1969
- 1969-09-30 CA CA063,648A patent/CA939831A/en not_active Expired
1970
- 1970-03-18 DE DE19702014138 patent/DE2014138C3/de not_active Expired
- 1970-03-18 DE DE19702014104 patent/DE2014104C3/de not_active Expired
- 1970-03-19 CH CH418370A patent/CH504147A/de not_active IP Right Cessation
- 1970-03-19 CH CH418470A patent/CH502748A/de not_active IP Right Cessation
- 1970-03-24 AT AT272570A patent/AT311460B/de not_active IP Right Cessation
- 1970-03-24 SE SE406770A patent/SE369027B/xx unknown
- 1970-03-24 AT AT272470A patent/AT312730B/de not_active IP Right Cessation
- 1970-03-26 NL NL7004485A patent/NL173700C/xx not_active IP Right Cessation
- 1970-03-26 FR FR7010884A patent/FR2040016A5/fr not_active Expired

Also Published As

Publication number	Publication date
DE2014104A1 (de)	1970-10-29
DE2014104B2 (de)	1972-07-13
DE2014104C3 (de)	1975-10-09
AT312730B (de)	1974-01-10
AT311460B (de)	1973-11-26
DE2014138C3 (de)	1979-06-28
CH502748A (de)	1971-01-31
CA939831A (en)	1974-01-08
NL173700C (nl)	1984-02-16
CH504147A (de)	1971-02-28
DE2014138A1 (de)	1970-11-05
FR2040016A5 (en)	1971-01-15
NL173700B (nl)	1983-09-16
DE2014138B2 (de)	1972-10-05
NL7004485A (de)	1970-09-29

Publication	Publication Date	Title
AU2270770A (de)	1972-06-01
AU465413B2 (de)	1975-09-11
AU429630B2 (de)	1972-10-26
AU5461069A (de)	1970-11-12
CS153153B1 (de)	1974-02-25
AU2355770A (de)	1972-06-22
AU427401B2 (de)	1972-08-17
AU428074B2 (de)	1972-09-11
AU442357B2 (de)	1973-11-07
AT308690B (de)	1973-06-15
AU470661B1 (de)	1970-10-05
AU438128B2 (de)	1973-07-16
AU442535B2 (de)	1973-11-12
AU442322B2 (de)	1973-11-02
AU428129B2 (de)	1972-09-12
AU425297B2 (de)	1972-03-26
AU442285B2 (de)	1973-11-02
AU5988769A (de)	1971-02-25
AU6261969A (de)	1971-04-22
AU5979569A (de)	1971-02-25
CS153110B1 (de)	1974-02-25
AU6144869A (de)	1971-04-01
AU6132869A (de)	1971-03-11
AU5598769A (de)	1970-12-10
CS149288B1 (de)	1973-07-05