SE458450B - Kopparlegering med krom, titan och kisel samt anvaendning av denna foer elektronikdetaljer - Google Patents

Kopparlegering med krom, titan och kisel samt anvaendning av denna foer elektronikdetaljer

Info

Publication number
SE458450B
SE458450B SE8603194A SE8603194A SE458450B SE 458450 B SE458450 B SE 458450B SE 8603194 A SE8603194 A SE 8603194A SE 8603194 A SE8603194 A SE 8603194A SE 458450 B SE458450 B SE 458450B
Authority
SE
Sweden
Prior art keywords
copper
titanium
silicon
chromium
alloy
Prior art date
Application number
SE8603194A
Other languages
English (en)
Swedish (sv)
Other versions
SE8603194D0 (sv
SE8603194L (sv
Inventor
W Duerrschnabel
F Puckert
H Stueer
M Bletschacher
Original Assignee
Wieland Werke Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE3527341A external-priority patent/DE3527341C1/de
Application filed by Wieland Werke Ag filed Critical Wieland Werke Ag
Publication of SE8603194D0 publication Critical patent/SE8603194D0/xx
Publication of SE8603194L publication Critical patent/SE8603194L/
Publication of SE458450B publication Critical patent/SE458450B/sv

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/456Materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
SE8603194A 1985-07-31 1986-07-23 Kopparlegering med krom, titan och kisel samt anvaendning av denna foer elektronikdetaljer SE458450B (sv)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3527341A DE3527341C1 (de) 1985-07-31 1985-07-31 Kupfer-Chrom-Titan-Silizium-Legierung und ihre Verwendung

Publications (3)

Publication Number Publication Date
SE8603194D0 SE8603194D0 (sv) 1986-07-23
SE8603194L SE8603194L (sv) 1987-02-01
SE458450B true SE458450B (sv) 1989-04-03

Family

ID=6277213

Family Applications (1)

Application Number Title Priority Date Filing Date
SE8603194A SE458450B (sv) 1985-07-31 1986-07-23 Kopparlegering med krom, titan och kisel samt anvaendning av denna foer elektronikdetaljer

Country Status (7)

Country Link
US (1) US4678637A (de)
JP (1) JPS6260837A (de)
CH (1) CH669211A5 (de)
FR (1) FR2585727B1 (de)
GB (1) GB2178448B (de)
IT (2) IT1195108B (de)
SE (1) SE458450B (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3527341C1 (de) * 1985-07-31 1986-10-23 Wieland-Werke Ag, 7900 Ulm Kupfer-Chrom-Titan-Silizium-Legierung und ihre Verwendung
DE19600864C2 (de) 1996-01-12 2000-02-10 Wieland Werke Ag Verwendung einer Kupfer-Chrom-Titan-Silizium-Magnesium-Legierung
GB2316685B (en) * 1996-08-29 2000-11-15 Outokumpu Copper Oy Copper alloy and method for its manufacture
ES2142747B1 (es) * 1998-03-05 2000-12-16 Farga Lacambra S A Cobre poli-microaleado con elevada conductividad electrica y propiedads termicas y mecanicas superiores a las de las aleaciones base cobre convencionales.
US6749699B2 (en) * 2000-08-09 2004-06-15 Olin Corporation Silver containing copper alloy
TWI502696B (zh) * 2010-02-06 2015-10-01 Ind Tech Res Inst 接合結構及其製造方法
JP5818724B2 (ja) * 2011-03-29 2015-11-18 株式会社神戸製鋼所 電気電子部品用銅合金材、めっき付き電気電子部品用銅合金材
JP5867859B2 (ja) * 2012-02-24 2016-02-24 株式会社神戸製鋼所 銅合金
JP5802150B2 (ja) * 2012-02-24 2015-10-28 株式会社神戸製鋼所 銅合金
KR20140114059A (ko) * 2012-02-24 2014-09-25 가부시키가이샤 고베 세이코쇼 구리 합금
JP5867861B2 (ja) * 2012-03-27 2016-02-24 株式会社神戸製鋼所 銅合金
JP5952726B2 (ja) * 2012-12-10 2016-07-13 株式会社神戸製鋼所 銅合金
JP5981866B2 (ja) * 2013-03-27 2016-08-31 株式会社神戸製鋼所 銅合金
JP6133178B2 (ja) * 2013-09-06 2017-05-24 古河電気工業株式会社 銅合金板材およびその製造方法
JP2016211054A (ja) * 2015-05-12 2016-12-15 株式会社神戸製鋼所 銅合金

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1930956A (en) * 1933-01-18 1933-10-17 Hazeltine Reginald Acid resisting alloy
US2086604A (en) * 1935-05-17 1937-07-13 Titanium Alloy Mfg Co Copper-titanium-silicon alloys
US2189198A (en) * 1938-06-28 1940-02-06 Titanium Alloy Mfg Co Copper-titanium alloy
GB522008A (en) * 1938-11-28 1940-06-06 Mallory Metallurg Prod Ltd Improvements in and relating to the production of copper base alloys
US2212017A (en) * 1940-01-05 1940-08-20 Fletcher James Cuprous alloy
US3072508A (en) * 1961-02-15 1963-01-08 Ampco Metal Inc Method of heat treating copper base alloy
DE1533179A1 (de) * 1966-06-08 1970-02-19 Battelle Institut E V Warmfeste und verschleissbestaendige Kupferlegierung hoher Leitfaehigkeit fuer Elektrizitaet und Waerme
US4007039A (en) * 1975-03-17 1977-02-08 Olin Corporation Copper base alloys with high strength and high electrical conductivity
JPS59145745A (ja) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd 半導体機器のリ−ド材用銅合金
JPS59145746A (ja) * 1983-12-13 1984-08-21 Nippon Mining Co Ltd 半導体機器のリ−ド材用銅合金
JPS60181250A (ja) * 1984-02-28 1985-09-14 Mitsubishi Metal Corp 半導体機器のリ−ド材用銅合金

Also Published As

Publication number Publication date
JPH057450B2 (de) 1993-01-28
FR2585727A1 (fr) 1987-02-06
SE8603194D0 (sv) 1986-07-23
US4678637A (en) 1987-07-07
FR2585727B1 (fr) 1988-06-17
IT1195108B (it) 1988-10-12
IT8653710V0 (it) 1986-07-30
JPS6260837A (ja) 1987-03-17
GB8615133D0 (en) 1986-07-23
SE8603194L (sv) 1987-02-01
GB2178448B (en) 1988-11-02
CH669211A5 (de) 1989-02-28
IT8667613A0 (it) 1986-07-30
GB2178448A (en) 1987-02-11

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